SMARTPOWER

Smart integration of GaN & SiC high power electronics for industrial and RF applications

 Coordinatore THALES SA 

 Organization address address: Campus Polytechnique 1, avenue Augustin Fresnel 45
city: Palaiseau Cedex
postcode: 91767

contact info
Titolo: Dr.
Nome: Afshin
Cognome: Ziaei
Email: send email
Telefono: 33169415777
Fax: 33169415538

 Nazionalità Coordinatore France [FR]
 Totale costo 7˙370˙222 €
 EC contributo 5˙075˙000 €
 Programma FP7-ICT
Specific Programme "Cooperation": Information and communication technologies
 Code Call FP7-ICT-2011-7
 Funding Scheme CP
 Anno di inizio 2011
 Periodo (anno-mese-giorno) 2011-09-01   -   2015-07-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    THALES SA

 Organization address address: Campus Polytechnique 1, avenue Augustin Fresnel 45
city: Palaiseau Cedex
postcode: 91767

contact info
Titolo: Dr.
Nome: Afshin
Cognome: Ziaei
Email: send email
Telefono: 33169415777
Fax: 33169415538

FR (Palaiseau Cedex) coordinator 0.00
2    BERLINER NANOTEST UND DESIGN GMBH

 Organization address address: VOLMERSTRASSE 7 B
city: BERLIN
postcode: 12489

contact info
Titolo: Dr.
Nome: Thomas
Cognome: Winkler
Email: send email
Telefono: 493064000000
Fax: 493064000000

DE (BERLIN) participant 0.00
3    BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM

 Organization address address: MUEGYETEM RAKPART 3
city: BUDAPEST
postcode: 1111

contact info
Titolo: Prof.
Nome: Márta
Cognome: Rencz
Email: send email
Telefono: +36 1 4632727
Fax: +36 1 4632973

HU (BUDAPEST) participant 0.00
4    CHALMERS TEKNISKA HOEGSKOLA AB

 Organization address address: -
city: GOETEBORG
postcode: 41296

contact info
Titolo: Prof.
Nome: Johan
Cognome: Liu
Email: send email
Telefono: +46 31 772 3067

SE (GOETEBORG) participant 0.00
5    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

 Organization address address: RUE LEBLANC 25
city: PARIS 15
postcode: 75015

contact info
Titolo: Dr.
Nome: Stephanie
Cognome: THOLLON
Email: send email
Telefono: +33 4 3878 9732
Fax: +33 4 3878 5132

FR (PARIS 15) participant 0.00
6    FOUNDATION FOR RESEARCH AND TECHNOLOGY HELLAS

 Organization address address: N PLASTIRA STR 100
city: HERAKLION
postcode: 70013

contact info
Titolo: Ms.
Nome: Zinovia
Cognome: Papatheodorou
Email: send email
Telefono: 302810000000
Fax: 302810000000

EL (HERAKLION) participant 0.00
7    FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V

 Organization address address: HANSASTRASSE 27C
city: MUNCHEN
postcode: 80686

contact info
Titolo: Mr.
Nome: Christoph
Cognome: Schulte
Email: send email
Telefono: +49 89 1205 2728
Fax: +49 89 1205 7534

DE (MUNCHEN) participant 0.00
8    INFINEON TECHNOLOGIES AG

 Organization address address: AM CAMPEON 1-12
city: NEUBIBERG
postcode: 85579

contact info
Titolo: Ms.
Nome: Mingxia
Cognome: Wu-Lutzenberger
Email: send email
Telefono: 498923000000

DE (NEUBIBERG) participant 0.00
9    INSTITUTUL NATIONAL DE CERCETAREDEZVOLTARE PENTRU MICROTEHNOLOGIE

 Organization address address: Erou iancu Nicolae Street 32B
city: VOLUNTARI, BUCHAREST
postcode: 77190

contact info
Titolo: Ms.
Nome: DOMNICA
Cognome: GEAMBAZI
Email: send email
Telefono: +40 21 269 07 70
Fax: +40 21 269 07 72

RO (VOLUNTARI, BUCHAREST) participant 0.00
10    MICROPELT GMBH

 Organization address address: EMMY-NOETHER-STRASSE 2
city: FREIBURG
postcode: 79110

contact info
Titolo: Mr.
Nome: Oliver
Cognome: Keilhack
Email: send email
Telefono: +49 761 156 33772

DE (FREIBURG) participant 0.00
11    SCHNEIDER ELECTRIC INDUSTRIES SAS

 Organization address address: RUE JOSEPH MONIER 35
city: RUEIL MALMAISON
postcode: 92500

contact info
Titolo: Mr.
Nome: Sylvain
Cognome: Paineau
Email: send email
Telefono: +33 4 76 57 60 47
Fax: +33 4 76 57 32 32

FR (RUEIL MALMAISON) participant 0.00
12    SHT SMART HIGH-TECH AB

 Organization address address: FYSIKGRAND 3
city: GOTEBORG
postcode: 412 96

contact info
Titolo: Dr.
Nome: Lilei
Cognome: Ye
Email: send email
Telefono: 46769489996

SE (GOTEBORG) participant 0.00
13    TAIPRO ENGINEERING SA

 Organization address address: RUE DES CHASSEURS ARDENNAIS 4
city: LIEGE (ANGLEUR)
postcode: 4031

contact info
Titolo: Mr.
Nome: Michel
Cognome: Saint-Mard
Email: send email
Telefono: +32 4 382 44 94

BE (LIEGE (ANGLEUR)) participant 0.00
14    TECHNISCHE UNIVERSITAET CHEMNITZ

 Organization address address: STRASSE DER NATIONEN 62
city: CHEMNITZ
postcode: 9111

contact info
Nome: Annett
Cognome: Kempe
Email: send email
Telefono: +49 371 531 12310
Fax: +49 371 531 12319

DE (CHEMNITZ) participant 0.00
15    THALES SYSTEMES AEROPORTES SAS

 Organization address address: AV GAY LUSSAC LA CLEF DE SAINT PIERRE 2
city: ELANCOURT
postcode: 78990

contact info
Titolo: Mr.
Nome: Jean-Michel
Cognome: BESNIER
Email: send email
Telefono: +33 1 34813875
Fax: +33 1 34815900

FR (ELANCOURT) participant 0.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

ups    solar    efficient    telecom    industrial    thermal    gan    inverters    drive    modules    power    rf    developments    motor    technologies    aerospace       respectively    sic    packaging    smartpower    efficiency    demonstrated   

 Obiettivo del progetto (Objective)

For industrial motor-drive, UPS and solar inverters applications and aerospace or telecom RF applications, new emerging power semiconductor technologies, respectively SiC and GaN, have demonstrated their higher performances than the actual technologies (Si and GaAs) in terms of reduction of losses, increase of efficiency and power handling. But to increase the efficiency of the power modules and in the same time reduce their size and make them more cost effective, these SiC and GaN technologies still have to be associated with new efficient cooling and packaging solutions. The goal of SMARTPOWER is to carry out the packaging and thermal management developments required to achieve the efficient and cost-effective implementation of SiC- and GaN-based power modules respectively into industrial power inverters and RF transmitters systems. This main objective is supported in the project by two routes of research:n- The developments of key enabling technologies required to the integration of the power modules into viable systems: efficient and reliable thermal interface materials and electrical interconnect, highly efficient thermoelectric modules andintegrated temperature sensor.n- The development of new 3D packaging techniques and the associated thermal architectures that will allow to integrate the core chips, together with the enabling technologies, in a viable and cost effective manner.nThe RTD developments will be demonstrated into the realisation of two high power modules: (i) SiC-based inverter for UPS, solar and motor-drive applications (ii) GaN-based RF transmitter for aerospace and telecom applications. The SMARTPOWER consortium (15 partners from 7 European States) gathers all the competences required to achieve these objectives. It is well balanced and involves all the supply chain partners in order to anticipate the cost-effective introduction of these new technologies and future products on the market.

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