MAGIC
MAsk less lithoGraphy for IC manufacturing (MAGIC)
| Coordinatore | COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: Rue des Martyrs 17 contact info |
| Nazionalità Coordinatore | France [FR] |
| Totale costo | 16˙694˙010 € |
| EC contributo | 11˙749˙999 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2007-1 |
| Funding Scheme | CP |
| Anno di inizio | 2008 |
| Periodo (anno-mese-giorno) | 2008-01-01 - 2010-12-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: Rue des Martyrs 17 contact info |
FR (Grenoble) | coordinator | 0.00 |
| 2 |
ASELTA NANOGRAPHICS SA
Organization address
address: PARVIS LOUIS NEEL contact info |
FR (GRENOBLE) | participant | 0.00 |
| 3 |
DELONG INSTRUMENTS AS
Organization address
address: PALACKEHO TR. contact info |
CZ (BRNO) | participant | 0.00 |
| 4 |
DOW CORNING EUROPE SA
Organization address
address: Rue Jules Bordet Parc Industriel Zone C contact info |
BE (SENEFFE) | participant | 0.00 |
| 5 |
FACHHOCHSCHULE VORARLBERG GMBH
Organization address
address: HOCHSCHULSTRASSE contact info |
AT (DORNBIRN) | participant | 0.00 |
| 6 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse contact info |
DE (MUENCHEN) | participant | 0.00 |
| 7 |
FUJIFILM ELECTRONIC MATERIALS (EUROPE) N. V.
Organization address
address: KEETBERGLAAN 1A, HAVENNUMMER 1061 contact info |
BE (ZWIJNDRECHT) | participant | 0.00 |
| 8 |
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
Organization address
address: Wilschdorfer Landstrasse contact info |
DE (Dresden) | participant | 0.00 |
| 9 |
IMS NANOFABRICATION AG
Organization address
address: SCHREYGASSE contact info |
AT (WIEN) | participant | 0.00 |
| 10 |
INSTITUT FUER MIKROELEKTRONIK STUTTGART
Organization address
address: ALLMANDRING STRASSE contact info |
DE (STUTTGART) | participant | 0.00 |
| 11 |
KLA-TENCOR CORPORATION (ISRAEL)
Organization address
address: HATIKSHORET ST. contact info |
IL (MIGDAL HAEMEK) | participant | 0.00 |
| 12 |
MAPPER LITHOGRAPHY B.V.
Organization address
address: COMPUTERLAAN 15 contact info |
NL (DELFT) | participant | 0.00 |
| 13 |
STMICROELECTRONICS CROLLES 2 SAS
Organization address
address: RUE JEAN MONNET 850 contact info |
FR (CROLLES) | participant | 0.00 |
| 14 |
Synopsys Armenia CJSC
Organization address
address: Arshakunyats contact info |
AM (Yerevan) | participant | 0.00 |
| 15 |
SYNOPSYS GMBH
Organization address
address: KARL HAMMERSCHMIDT STR contact info |
DE (ASCHHEIM) | participant | 0.00 |
| 16 |
SYNOPSYS INTERNATIONAL LIMITED
Organization address
address: BLOCK 1 BLANCHARDSTOWN CORPORATE PARK contact info |
IE (DUBLIN) | participant | 0.00 |
| 17 |
SYNOPSYS NETHERLANDS BV
Organization address
address: St. Odgerusstraat 3 contact info |
NL (ROERMOND) | participant | 0.00 |
| 18 |
SYNOPSYS SWITZERLAND LLC
Organization address
address: Thurgauerstrasse contact info |
CH (ZURICH) | participant | 0.00 |
Mappa
Word cloud
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Obiettivo del progetto (Objective)
In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now the driving solution to deal with all industry concerns. Nevertheless, this solution becomes less effective for each new technology node. Effectively, it requires more and more complex and expensive masks due to the introduction of optical proximity correction and phase shift techniques. The blow up of the tool price plays also an important role in the overall cost of ownership of this technique. This trend opens opportunities for the Mask-Less Lithography (ML2) technology, based on multi-beam principles and developed by the two European companies MAPPER and IMS Nanofabrication AG. The cost effective model of the ML2 option in association with the high resolution capability of the electron lithography and a reasonable throughput target represents an attractive alternative for lithography and is supported by some key CMOS manufacturers around the world, like TSMC, STMicroelectronics, QIMONDA, TOSHIBA, and Texas Instruments...
This project proposes to support the development of ML2 technology in Europe. It is composed of two linked poles. The first one will be focused on MAPPER and IMS-NANO tool developments with the objective to deliver a first ML2 alpha platform compatible for 32nm half pitch technology before 2010, aligned with the semiconductor manufacturer requirements. In relation with this activity, the program will develop the required infrastructure for the usage of these tools in an industrial environment. Among the tasks to be addressed, there is the delivery of a reliable software platform to treat the data base preparation and to provide solution for ML2 related electron beam proximity effects. The last concern of this project will be to demonstrate the ability to integrate CMOS processes in real manufacturing conditions on the ML2 platforms developed by the tool partners.