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Report

Teaser, summary, work performed and final results

Periodic Reporting for period 1 - 3PEAT (3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications)

Teaser

3PEAT is unique in the way it effectuates the development of a hybrid photonic integration platform with ultra-high potential in terms of scale and density of integration, and in terms of range and quality of supported functionalities. The project invests on two passive...

Summary

3PEAT is unique in the way it effectuates the development of a hybrid photonic integration platform with ultra-high potential in terms of scale and density of integration, and in terms of range and quality of supported functionalities.

The project invests on two passive photonic integration platforms (the PolyBoard and the TriPleX), each with an already broad toolbox and validated potential to serve as the basis of sophisticated PICs for switching and sensing applications. 3PEAT will follow an approach motivated both by innovations at the photonic integration level and opportunities from the market side. The expected impact is straightforward and based on a solid case summarized as follows:
• 3PEAT will develop a disruptive PIC technology with all performance, manufacturability and cost credentials over competing solutions for a very broad range of applications, including optical switching and remote sensing.
• 3PEAT will address a number of established and emerging markets, where the need for PICs with high integration density, multifunctionality, reconfiguration speed, low power consumption and low cost are for granted.
• 3PEAT has clear paths to evaluate its technology in representative settings and to bring the foreground knowledge and the prototypes that will be developed out to the market following consistent exploitation plans.

In order to accomplish its vision, 3PEAT has the following technological objectives:
1) the development of a 3D photonic integration platform based on PolyBoard technology, enabling a disruptive jump in the integration density and the range of supported functionalities on-chip,
2) the establishment of a photonic integration technology for switching applications based on the stress-optic effect on TriPleX platform, enabling a disruptive combination of high switching speed and large number of ports in optical switches,
3) the combination of PolyBoard and TriPleX technologies and the development of a hybrid integration platform with interconnected sections on a single die,
4) the use of this hybrid platform for the fabrication of very large scale photonic integrated circuits with unique complexity and optical functionality and
5) the use of these circuits as the basis for high performance modules in applications spanning a broad range from optical data switching to remote sensing and ranging.

Work performed

During Period 1 the component’s specifications for 3PEAT switching Module-1 and sensing Module-4 and their associated optical and electrical interfaces were defined, which led to the definition of the assembly and the packaging methodologies and to the development of the corresponding testbeds and experimental setups.

Significant progress was achieved in the system design and the methodologies for integration and packaging processes. The application scenario and the datacenter architectures and the system level simulations for the 3PEAT switching and LDV modules have been specified and defined. Moreover, the all the specifications and the interfaces between the 3PEAT modules have been defined which lead to the fact that the packaging methodologies with emphasis on the heterogeneous integration of the two TriPleX and PolyBoard platforms have been also defined. Furthermore, the calibration, the operation and the configurations algorithms for the 3PEAT modules have been created as well as the testbeds for the evaluation of Module-1 and 4 including very accurate, sensitive efficient electronics (drivers and PCBs).
Exploitation plans were generated, and dissemination actions were performed aiming to spread the word for 3PEAT. Main channels were talks, eight (8) publications, and the project website. Three (3) invited conference talks at high profile conferences presented 3PEAT concept and results. IPR in relevant topics were tracked and evaluated, and two (2) patents were filed by the consortium.

Final results

3PEAT’s industry-driven consortium expands along the entire value chain and aims to foster the project’s carefully selected set of innovations into tangible market outcomes. Driven by user needs, the project aims to bridge innovative research in optical switching and optical sensing with near-market exploitation, achieving transformational impact in energy consumption, compactness and cost.
In the components level progress, within 3PEAT, waveguide structures have been already optimized, enabling the very low loss 3D integration between the TriPleX and the PolyBoard platform. Remaining in the TriPleX platform, a novel configuration of the BTO/PZT actuators has been developed, realizing the fast PZT-based modulation with frequencies up to 50 MHz. Additionally, a first version of the ultra-low linewidth laser has already been developed with output power higher than initially targeted (24 instead of 10 mW) and linewidth down to 3.1 kHz (which will be further decreased in the next versions). From the PolyBoard platform point of view, vertical multimode interference (vMMIs) couplers have been developed, enabling the light transition between different layers realizing a fully functional multilayer chip. Likewise, photonic elements like the integrated optical isolator and the four-port optical circulator have been developed, with specs that go beyond the 3PEAT targets in terms of transition losses and isolation level values.

Website & more info

More info: http://ict-3peat.eu/.