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3PEAT SIGNED

3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications

Total Cost €

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EC-Contrib. €

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Partnership

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Project "3PEAT" data sheet

The following table provides information about the project.

Coordinator
INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS 

Organization address
address: Patission Str. 42
city: ATHINA
postcode: 10682
website: www.iccs.gr

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Greece [EL]
 Project website http://ict-3peat.eu/
 Total cost 3˙993˙285 €
 EC max contribution 3˙993˙285 € (100%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2017-1
 Funding Scheme RIA
 Starting year 2018
 Duration (year-month-day) from 2018-01-01   to  2020-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS EL (ATHINA) coordinator 484˙375.00
2    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 930˙285.00
3    LIONIX INTERNATIONAL BV NL (ENSCHEDE) participant 480˙750.00
4    CORDON ELECTRONICS ITALIA SRL IT (CORNATE D'ADDA) participant 480˙375.00
5    UNIVERSITEIT TWENTE NL (ENSCHEDE) participant 423˙750.00
6    MELLANOX TECHNOLOGIES LTD - MLNX IL (YOKNEAM) participant 346˙250.00
7    SOLMATES BV NL (ENSCHEDE) participant 330˙000.00
8    POLYTEC GMBH DE (WALDBRONN) participant 312˙500.00
9    OPTAGON FOTONIKI IDIOTIKI KEFALAIOUCHIKI ETAIRIA EL (PALLINI, ATHINA) participant 205˙000.00

Map

 Project objective

3PEAT will develop a powerful photonic integration technology with all size, functionality and quality credentials in order to help a broad range of optical applications like optical switching and remote sensing, to achieve a strong commercial impact. In order to do so, the project will introduce a fully functional 3D photonic integration platform based on the use of multiple waveguiding layers and vertical couplers in a polymer technology (PolyBoard), as a means to disrupt the integration scale and functionality. Moreover, 3PEAT will combine this powerful 3D photonic technology with a silicon-nitride platform (TriPleX), via the development of a methodology for the deposition and processing of multilayer polymers inside etched windows on TriPleX chips. In parallel with the development of this hybrid 3D technology, 3PeaT will bring a number of key innovations at the integration and component level relating to: a) the heterogeneous integration of PZT films on TriPleX platform for development of phase shifters and switches for operation up to 50 MHz, b) the development of a disruptive external cavity laser on the same platform with linewidth less than 1 kHz, c) the development for the first time of an integrated circulator on PolyBoard with isolation more than 25 dB, and d) the development of flexible types of PolyBoards for the purpose of physical interconnection of other PICs. This enormous breadth of innovations can remove the current limitations and unleash the full potential of optical switching and remote sensing and ranging applications. The main switching module that will be fabricated will be a 36×36 optical switch with 20 ns switching time and possibility for power and cost savings of almost 95% compared to standard electronic solutions. The main sensing module on the other hand will be a disruptive Laser Doppler Vibrometer (LDV) with all of its optical units, including its optical beam scanning unit, integrated on a very large, hybrid 3D PIC.

 Deliverables

List of deliverables.
Announcement of 3PEAT (Preparation of fact-sheet, presentation and press-release) Websites, patent fillings, videos etc. 2020-01-14 16:15:03
Website availability and set up of social media accounts Websites, patent fillings, videos etc. 2020-01-14 16:14:59

Take a look to the deliverables list in detail:  detailed list of 3PEAT deliverables.

 Publications

year authors and title journal last update
List of publications.
2019 Albert van Rees, Dimitri Geskus, Edwin J. Klein, Youwen Fan, Peter J. M. van der Slot and Klaus-J. Boller
Mode-hop-free Tuning of a Chip-based Hybrid Integrated InP-Si3N4 Laser
published pages: , ISSN: , DOI:
European Conference on Lasers and Electro-Optics, CLEO/EUROPE-EQEC 2019 24/06/2019 2019-10-07
2019 Albert van Rees, Edwin Klein, Dimitri Geskus, Youwen Fan, Klaus Boller
Mode-hop-free tuning of a chip-based InP-Si3N4 hybrid laser
published pages: , ISSN: , DOI:
Physics@Veldhoven 2019 22/01/2019 2019-10-07
2018 Albert van Rees, Edwin Klein, Dimitri Geskus, Youwen Fan, Klaus Boller
Mode-hop free tuning of a hybrid glass-semiconductor laser
published pages: , ISSN: , DOI:
42nd Annual Meeting NNV AMO 2018 25/09/2018 2019-10-07

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The information about "3PEAT" are provided by the European Opendata Portal: CORDIS opendata.

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