NANOSOLD

A Chemical Approach to Lead-free Nanosolders

 Coordinatore UNIVERSITAT WIEN 

 Organization address address: UNIVERSITATSRING 1
city: WIEN
postcode: 1010

contact info
Titolo: Prof.
Nome: Herbert
Cognome: Ipser
Email: send email
Telefono: +43 1 4277 52906
Fax: +43 1 4277 9529

 Nazionalità Coordinatore Austria [AT]
 Totale costo 0 €
 EC contributo 232˙837 €
 Programma FP7-PEOPLE
Specific programme "People" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
 Code Call FP7-PEOPLE-IIF-2008
 Funding Scheme MC-IIF
 Anno di inizio 2009
 Periodo (anno-mese-giorno) 2009-09-15   -   2011-09-14

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    UNIVERSITAT WIEN

 Organization address address: UNIVERSITATSRING 1
city: WIEN
postcode: 1010

contact info
Titolo: Prof.
Nome: Herbert
Cognome: Ipser
Email: send email
Telefono: +43 1 4277 52906
Fax: +43 1 4277 9529

AT (WIEN) coordinator 232˙837.56

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

solders    size    solder    sb    free    reactions    materials    bulk    particles    precursors    temperatures    cu    temperature    corresponding    nano    melting    chemical    time    sn    ag      

 Obiettivo del progetto (Objective)

'Physical, electronic and thermodynamic properties of small particles (nano-particles) differ significantly from those of the bulk materials, and the depression of the melting temperature below the melting point of the bulk has been known for a long time. This dependence of the melting temperature on the particle size is not restricted to any particular material and may therefore also be exploited to lower the melting temperatures of lead-free solders. At the same time, the high-temperature solders currently in use (melting temperatures 250-400°C) contain high amounts of lead and are exempt from the European RoHS directive due to reliability reasons. In the search for lead-free substitutes, Sn-Sb and Sn-Sb-M alloys have been identified as possible candidates. With the envisaged reduction of the grain size into the nanometer range and a corresponding lowering of the melting temperature, considerable energy savings would become possible in the first soldering step without sacrificing the stability of the obtained solder junctions against re-melting in the further assembling procedure. Therefore it is proposed to prepare micro- and nanosized particles of lead-free high-temperature solder materials, based on Sn-Sb-M (M=Ag, Cu, Ni) from suitable chemical precursors. These precursors will be prepared by precipitation reactions, followed by thermal decomposition and, if necessary, by adequate reduction reactions, and the reaction conditions will be optimized. The particles will be characterized by chemical analysis, SEM and TEM, and by thermo-analytical methods, and the corresponding properties will be compared with those of bulk materials. At the same time, additional experiments in the bulk systems Sn-Sb-Ag and Sn-Sb-Cu will be performed to complete the available literature information on phase diagram and thermodynamics. It will be attempted to model the phase diagrams for bulk and for nano-sized materials by the well known CALPHAD-method.'

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