PRIMAE
Packaging of futuRe Integrated ModulAr Electronics
| Coordinatore | THALES AVIONICS SAS
Organization address
address: AVENUE DU MARECHAL JUIN 18 contact info |
| Nazionalità Coordinatore | France [FR] |
| Totale costo | 6˙338˙307 € |
| EC contributo | 3˙766˙448 € |
| Programma | FP7-TRANSPORT
Specific Programme "Cooperation": Transport (including Aeronautics) |
| Code Call | FP7-AAT-2010-RTD-1 |
| Funding Scheme | CP-FP |
| Anno di inizio | 2010 |
| Periodo (anno-mese-giorno) | 2010-11-01 - 2014-10-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
THALES AVIONICS SAS
Organization address
address: AVENUE DU MARECHAL JUIN 18 contact info |
FR (MEUDON LA FORET) | coordinator | 631˙345.00 |
| 2 |
BAE Systems (Operations) Ltd
Organization address
address: Warwick House contact info |
UK (FARNBOROUGH) | participant | 331˙500.00 |
| 3 |
DIEHL AEROSPACE GMBH
Organization address
address: Alte Nussdorfer Strasse 23 contact info |
DE (UEBERLINGEN) | participant | 305˙220.00 |
| 4 |
VYZKUMNY A ZKUSEBNI LETECKY USTAV A.S.
Organization address
address: Beranovych 130 contact info |
CZ (PRAHA-LETNANY) | participant | 232˙500.00 |
| 5 |
AIRBUS OPERATIONS SAS
Organization address
address: ROUTE DE BAYONNE 316 contact info |
FR (TOULOUSE) | participant | 201˙980.00 |
| 6 |
ALENIA AERMACCHI SPA
Organization address
address: PIAZZA MONTE GRAPPA 4 contact info |
IT (ROMA) | participant | 162˙445.50 |
| 7 |
DAU Ges.m.b.H. & Co. KG.
Organization address
address: Dietenberg 38 contact info |
AT (Ligist) | participant | 158˙265.00 |
| 8 |
DUTCH THERMOPLASTIC COMPONENTS BV
Organization address
address: Bolderweg 2 contact info |
NL (Almere) | participant | 153˙225.00 |
| 9 |
KONTRON MODULAR COMPUTERS SAS
Organization address
address: RUE MARCELIN BERTHELOT 150 contact info |
FR (TOULON) | participant | 151˙500.00 |
| 10 |
LATELEC
Organization address
address: Max Planck contact info |
FR (LABEGE) | participant | 150˙000.00 |
| 11 |
AALTO-KORKEAKOULUSAATIO
Organization address
address: OTAKAARI 1 contact info |
FI (ESPOO) | participant | 148˙872.00 |
| 12 |
DASSAULT AVIATION SA
Organization address
address: Rond-Point des Champs-Elysees - Marcel Dassault 9 contact info |
FR (PARIS) | participant | 148˙750.00 |
| 13 |
RADIALL
Organization address
address: Rue Philibert Hoffmann 101 contact info |
FR (Rosny Sous Bois) | participant | 148˙597.00 |
| 14 |
UNIVERSITA DEGLI STUDI DI PADOVA
Organization address
address: VIA 8 FEBBRAIO 2 contact info |
IT (PADOVA) | participant | 146˙041.00 |
| 15 |
Tyco Electronics UK Ltd
Organization address
address: Faraday Road contact info |
UK (Swindon) | participant | 140˙100.00 |
| 16 |
EMCCONS DR RASEK GMBH & CO KG
Organization address
address: BOLWIESE 8 MOGGAST contact info |
DE (EBERMANNSTADT) | participant | 139˙087.00 |
| 17 |
THE INSTITUTE OF THERMAL PHYSICS OF THE URAL BRANCH OF THE RUSSIAN ACADEMY OF SCIENCE
Organization address
address: Amundsen street 106 contact info |
RU (EKATERINBURG) | participant | 138˙468.00 |
| 18 |
INSTITUT NATIONAL DES SCIENCES APPLIQUEES DE LYON
Organization address
address: AVENUE ALBERT EINSTEIN 20 contact info |
FR (VILLEURBANNE) | participant | 124˙440.00 |
| 19 |
ATM Przedsiebiorstwo Produkcyjne Sp. z o.o.
Organization address
address: UL. GROCHOWSKA 21A contact info |
PL (Warszawa) | participant | 120˙112.50 |
| 20 |
CELESTICA VALENCIA SA
Organization address
address: "CARRETERA VALENCIA ADEMUZ KM 17,6" contact info |
ES (Pobla Vallbona - Valencia) | participant | 34˙000.00 |
Mappa
Word cloud
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
Obiettivo del progetto (Objective)
'Affordable transport for the citizen relies on innovative solutions and technologies that will result in lower costs and lead-time of the aircraft and its systems. In this area, the packaging of on-board computers is an important contributor.
The Packaging of futuRe Integrated ModulAr Electronics (PRIMAE) objective is to develop a new flexible, robust and open aeronautical packaging for the next generation of electronics and particularly to Integrated Modular Avionics. This new concept after standardization will be able to replace the 35 year old ARINC 600 standard.
PRIMAE technical objectives are: - Reduce electronics packaging in terms of volume (50%) and weight (30%) and offer flexibility and growth capability - Reduce costs (20%) using market standard components - Enhance reliability (50%) through thermal and vibratory breakthrough - Mitigate EMC protection penalties in composite fuselage environment - Ensure fast production ramp up and support rapid final assembly on aircraft - Improve availability and reduce maintenance cost.
In these domains significant technological studies, beyond the state of the art (cooling, lightweight composite materials, electromagnetic interferences, power supply, connectivity), will be carried out in respect to airworthiness regulations.
To achieve the PRIMAE objectives, 3 steps are required: - Definition phase of air framers and suppliers requirement - Research and evaluation of advanced packaging technologies - Specification and development of representative mock-up to integrate different technologies.
The concept once harmonized among the main European players participating in this project, will be proposed as a standard for the future generation of large and regional aircraft, and helicopters. The new packaging concept will strengthen competitiveness of the market and will support the effort of industrial avionics suppliers to improve costs and environmental impacts.'