SMAC
SMArt systems Co-design
| Coordinatore | STMICROELECTRONICS SRL
Organization address
address: Stradale Primosole 50 contact info |
| Nazionalità Coordinatore | Italy [IT] |
| Totale costo | 13˙043˙170 € |
| EC contributo | 8˙197˙000 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2011-7 |
| Funding Scheme | CP |
| Anno di inizio | 2011 |
| Periodo (anno-mese-giorno) | 2011-10-01 - 2015-03-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
STMICROELECTRONICS SRL
Organization address
address: Stradale Primosole 50 contact info |
IT (Catania) | coordinator | 0.00 |
| 2 |
AGILENT TECHNOLOGIES BELGIUM NV
Organization address
address: DE KLEETLAAN 5 contact info |
BE (DIEGEM) | participant | 0.00 |
| 3 |
COVENTOR SARL
Organization address
city: VILLEBON SUR YVETTE contact info |
FR (VILLEBON SUR YVETTE) | participant | 0.00 |
| 4 |
EDALab srl
Organization address
address: Strada le Grazie 15 contact info |
IT (Verona) | participant | 0.00 |
| 5 |
FONDAZIONE ISTITUTO ITALIANO DI TECNOLOGIA
Organization address
address: VIA MOREGO 30 contact info |
IT (GENOVA) | participant | 0.00 |
| 6 |
INSTYTUT TECHNOLOGII ELEKTRONOWEJ
Organization address
address: al. Lotnikow 32/46 contact info |
PL (WARSZAWA) | participant | 0.00 |
| 7 |
KATHOLIEKE UNIVERSITEIT LEUVEN
Organization address
address: Oude Markt 13 contact info |
BE (LEUVEN) | participant | 0.00 |
| 8 |
MUNEDA GmbH
Organization address
address: Stefan-George-Ring 29 contact info |
DE (Munich) | participant | 0.00 |
| 9 |
ON SEMICONDUCTOR BELGIUM BVBA
Organization address
address: WESTERRING 15 contact info |
BE (OUDENAARDE) | participant | 0.00 |
| 10 |
POLITECNICO DI TORINO
Organization address
address: CORSO DUCA DEGLI ABRUZZI 24 contact info |
IT (TORINO) | participant | 0.00 |
| 11 |
SLOVENSKA TECHNICKA UNIVERZITA V BRATISLAVE
Organization address
address: VAZOVOVA 5 contact info |
SK (BRATISLAVA) | participant | 0.00 |
| 12 |
ST-POLITO Societa' consortile a r.l.
Organization address
address: CORSO DUCA DEGLI ABRUZZI 24 contact info |
IT (Torino) | participant | 0.00 |
| 13 |
TECHNISCHE UNIVERSITEIT EINDHOVEN
Organization address
address: DEN DOLECH 2 contact info |
NL (EINDHOVEN) | participant | 0.00 |
| 14 |
THE UNIVERSITY OF NOTTINGHAM
Organization address
address: University Park contact info |
UK (NOTTINGHAM) | participant | 0.00 |
| 15 |
UNIVERSITA DEGLI STUDI DI CATANIA
Organization address
address: PIAZZA UNIVERSITA 2 contact info |
IT (CATANIA) | participant | 0.00 |
| 16 |
UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
Organization address
address: Western Road contact info |
IE (CORK) | participant | 0.00 |
Mappa
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Obiettivo del progetto (Objective)
Smart systems consist of heterogeneous subsystems and components providing different functionalities; they are normally implemented as 'Multi-Package on a Board'. To fully exploit the potential of current nanoelectronics technologies, as well as to enable the integration of existing/new IPs and 'More than Moore' devices, smart system miniaturization and 'Multi-Chip in a Package' implementation are unavoidable. Such goals are only achievable if a flexible software platform (i.e., the SMAC platform) for smart subsystems/components design and integration is made available to designers and system integrators.nThe platform must include methodologies and EDA tools enabling multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of specific metrics, such as power, performance, reliability and robustness.nKey ingredients for the construction of the SMAC platform include: (1) The development of a cosimulation and co-design environment which is aware (and thus considers) the essential features of the basic subsystems and components to be integrated. (2) The development of modeling and design techniques, methods and tools that, when added to the platform, will enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.nThe SMAC platform will allow to successfully address the following grand challenges related to the design and manufacturing of miniaturized smart systems: (1) Development of innovative smart subsystems and components demonstrating advanced performance, ultra low power and the capability of operating under special conditions (e.g., high reliability, long lifetime). (2) Design of miniaturized and integrated smart systems with advanced functionality and performance, including nanoscale sensing systems, possibly operating autonomously and in a networked fashion