XMEMS

Towards Cost-Efficient Flexible Heterogeneous Integration for Micro- and Nanosystem Fabrication

Coordinatore	KUNGLIGA TEKNISKA HOEGSKOLAN    more Spiacenti, non ci sono informazioni su questo coordinatore. Contattare Fabio per maggiori infomrazioni, grazie.
Nazionalità Coordinatore	Sweden [SE]
Totale costo	2˙279˙800 €
EC contributo	2˙279˙800 €
Programma	FP7-IDEAS-ERC Specific programme: "Ideas" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
Code Call	ERC-2010-AdG_20100224
Funding Scheme	ERC-AG
Anno di inizio	2011
Periodo (anno-mese-giorno)	2011-03-01   -   2016-02-29

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	KUNGLIGA TEKNISKA HOEGSKOLAN  Organization address address: Valhallavaegen 79 city: STOCKHOLM postcode: 10044 contact info Titolo: Ms. Nome: Erika Cognome: Appel Email: send email Telefono: +46 8 7907786 Fax: +46 8 100858	SE (STOCKHOLM)	hostInstitution	2˙279˙800.00
2	KUNGLIGA TEKNISKA HOEGSKOLAN  Organization address address: Valhallavaegen 79 city: STOCKHOLM postcode: 10044 contact info Titolo: Prof. Nome: Nils Göran Cognome: Stemme Email: send email Telefono: 4687907787 Fax: 468100858	SE (STOCKHOLM)	hostInstitution	2˙279˙800.00

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 Obiettivo del progetto (Objective)

'This proposal targets the development of flexible heterogeneous integration schemes for combining best-of-class materials, components and manufacturing methods into economically viable micro- and nanosystem (MEMS) solutions. Today, the IC industry drives the development of most micro- and nanofabrication technologies, which are characterized by standardized processes, very large production volumes of >10.000 wafers/month and enormous capital investments. In contrast, the vast majority of MEMS demand production volumes of <100 wafers/month and different manufacturing and integration processes for each type of device. The a-priori acceptance of IC manufacturing technologies for MEMS therefore leads to missed market opportunities for many moderate volume MEMS-based products and to sub-optimal material choices. Instead, we aim for a new MEMS-specific integration and manufacturing paradigm, in which the technologies and tools are adapted to the production volumes and design variations of MEMS devices. Specifically, we will develop novel and enabling micro/nano fabrication and integration techniques with a focus on flexibility and cost-efficiency in the following areas: ' Heterogeneous Material Integration, where we incorporate high-performance materials into MEMS using unconventional and innovative technologies and tools, including serial integration, wafer-level integration and free-form fabrication of MEMS; ' Heterogeneous System Integration, where we develop new wafer level schemes to combine, process and interconnect components fabricated with different technologies such as MEMS, NEMS, ICs or photonics; ' Lab-on-Chip Integration, in which transducers, mass transport solutions, surface biochemistry and liquids are combined at the wafer level into high-performance systems.'