Teraboard SIGNED
High density scalable optically interconnected Tb/s Board
Total Cost €
0EC-Contrib. €
0Partnership
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0Teraboard project word cloud
Explore the words cloud of the Teraboard project. It provides you a very rough idea of what is the project "Teraboard" about.
Project "Teraboard" data sheet
The following table provides information about the project.
| Coordinator |
CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI
Organization address contact info |
| Coordinator Country | Italy [IT] |
| Project website | http://www.teraboard.eu/ |
| Total cost | 4˙249˙157 € |
| EC max contribution | 4˙249˙157 € (100%) |
| Programme |
1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)) |
| Code Call | H2020-ICT-2015 |
| Funding Scheme | RIA |
| Starting year | 2015 |
| Duration (year-month-day) | from 2015-12-01 to 2019-11-30 |
Partnership
Take a look of project's partnership.
| # | ||||
|---|---|---|---|---|
| 1 | CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI | IT (PARMA) | coordinator | 1˙029˙750.00 |
| 2 | INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM | BE (LEUVEN) | participant | 1˙955˙357.00 |
| 3 | STMICROELECTRONICS SRL | IT (AGRATE BRIANZA) | participant | 370˙350.00 |
| 4 | UNIVERSITAT POLITECNICA DE VALENCIA | ES (VALENCIA) | participant | 270˙000.00 |
| 5 | ERICSSON TELECOMUNICAZIONI SPA | IT (ROMA) | participant | 241˙250.00 |
| 6 | CONSIGLIO NAZIONALE DELLE RICERCHE | IT (ROMA) | participant | 206˙250.00 |
| 7 | NOKIA SOLUTIONS AND NETWORKS ITALIA SPA | IT (MILANO) | participant | 119˙950.00 |
| 8 | EUROPEAN PHOTONICS INDUSTRY CONSORTIUM | FR (PARIS 16) | participant | 56˙250.00 |
| 9 | ALCATEL-LUCENT ITALIA S.P.A. | IT (MILANO) | participant | 0.00 |
| 10 | IMINDS | BE (GENT) | participant | 0.00 |
Map
Project objective
Optical communications are becoming always more relevant because of the continuous growth of the requiested bandwidth. In the last decade we assisted a continuous growing of transport and metro netwotks, presently the bottleneck is in the processing of the huge amount of data constituted by the growing number of users, the capacity of the content that is exchanged and the convergence of Telecom and Datacom. This accumulation of data are elaborated and redirected within data centers with a continuous growing of traffic congestion. The continuous growth of traffic require therefore a roadmap of bandwidth density growth that necessarily has to be scalable on the timeframe of several years. To this point photonics plays a crucial role that is always more pervasive. However a major limiting factor is also arising from the energy cost and latency accumulated by the need of aggregation to route signals. To limitate this effect is necessary to make possible data exchange and processing without or with limited aggregation. Teraboard project consists in developing a full intra data center photonic platform for intraboard, intrarack and intra data center optical communications. The Teraboard interconnection platform will be based on ultra-high density and scalable bandwidth optical interconnectivity with low insertion loss and a target of lowest energy cost per channel of 2.5pJ/bit and a manufacturing cost of 0.1$/Gb/s in volumes. These target values are 10x reduction respect to commercial state of the art. Teraboard demonstrates: 1) passive, scalable, 3D inter processor interconnection layer, 2) novel WDM optical connector to plug the fiber ribbons directly onto the transceiver chip, 3) intraboard transceiver bank with high density bandwidth of 7Tb/s/cm2. Single wavelength laser arrays will be directly integrated on the silicon photonics transceiver circuits, 4) and edge single and four wavelength transceiver interface with bandwidth density of 50 and 7Tb/s/cm2 respectively.
Deliverables
| TERABOARD communication Kit | Websites, patent fillings, videos etc. | 2019-05-31 15:13:34 |
| TERABOARD communication Kit | Websites, patent fillings, videos etc. | 2019-05-31 15:13:34 |
| Press release | Websites, patent fillings, videos etc. | 2019-05-31 15:13:30 |
| Data Management Plan | Documents, reports | 2019-05-31 15:13:36 |
Take a look to the deliverables list in detail: detailed list of Teraboard deliverables.
Publications
| year | authors and title | journal | last update |
|---|---|---|---|
| 2018 |
D. Van Thourhout New Materials for Active Devices in Silicon Photonics published pages: , ISSN: , DOI: |
The 7th Conference on Advances in Optoelectronics and Micro/nano-optics | 2020-02-06 |
| 2018 |
R. Vázquez et al. Internode interconnection optical platform based on fs-laser written vertical waveguides published pages: , ISSN: , DOI: |
SPIE OPTO 2018, SPIE Photonic West 2018 | 2020-02-06 |
| 2018 |
Hannes Ramon, Xin Yin, Johan Bauwelinck, Michael Vanhoecke, Jochem Verbist, Wouter Soenen, Peter De Heyn, Yoojin Ban, Marianna Pantouvaki, Joris Van Campenhout, Peter Ossieur Low-Power 56Gb/s NRZ Microring Modulator Driver in 28nm FDSOI CMOS published pages: 467-470, ISSN: 1041-1135, DOI: 10.1109/lpt.2018.2799004 |
IEEE Photonics Technology Letters 30/5 | 2020-02-05 |
| 2019 |
Joris Lambrecht, Hannes Ramon, Bart Moeneclaey, Jochem Verbist, Michael Vanhoecke, Peter Ossieur, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, Xin Yin A 106-Gb/s PAM-4 Silicon Optical Receiver published pages: 505-508, ISSN: 1041-1135, DOI: 10.1109/lpt.2019.2899147 |
IEEE Photonics Technology Letters 31/7 | 2020-02-05 |
| 2018 |
Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas de Groote, Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Günther Roelkens, Dries Van Thourhout Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing published pages: 21443, ISSN: 1094-4087, DOI: 10.1364/oe.26.021443 |
Optics Express 26/17 | 2020-02-05 |
| 2019 |
Joris Lambrecht, Hannes Ramon, Bart Moeneclaey, Jochem Verbist, Michiel Verplaetse, Michael Vanhoecke, Peter Ossieur, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, Xin Yin 90-Gb/s NRZ Optical Receiver in Silicon Using a Fully Differential Transimpedance Amplifier published pages: 1964-1973, ISSN: 0733-8724, DOI: 10.1109/jlt.2019.2896757 |
Journal of Lightwave Technology 37/9 | 2020-02-05 |
| 2018 |
Jochem Verbist, Joris Lambrecht, Michiel Verplaetse, Joris Van Kerrebrouck, Ashwyn Srinivasan, Peter De Heyn, Timothy De Keulenaer, Xin Yin, Guy Torfs, Joris Van Campenhout, Gunther Roelkens, Johan Bauwelinck DAC-Less and DSP-Free 112 Gb/s PAM-4 Transmitter Using Two Parallel Electroabsorption Modulators published pages: 1281-1286, ISSN: 0733-8724, DOI: 10.1109/jlt.2017.2789164 |
Journal of Lightwave Technology 36/5 | 2020-02-05 |
| 2019 |
Hannes Ramon, Johan Bauwelinck, Joris Lambrecht, Jochem Verbist, Michael Vanhoecke, Srinivasan Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, Peter Ossieur, Xin Yin 70 Gb/s Low-Power DC-Coupled NRZ Differential Electro-Absorption Modulator Driver in 55 nm SiGe BiCMOS published pages: 1504-1514, ISSN: 0733-8724, DOI: 10.1109/jlt.2019.2900192 |
Journal of Lightwave Technology 37/5 | 2020-02-05 |
| 2017 |
Ana Belén González, Jose Pozo Teraboard Project Closing in on Future of Telecommunications published pages: 24-25, ISSN: 1863-1460, DOI: 10.1002/opph.201790006 |
Optik & Photonik 12/1 | 2019-06-18 |
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The information about "TERABOARD" are provided by the European Opendata Portal: CORDIS opendata.