PEMREL

"Sample power electronic module construction for testing, characterisation and manufacturability assessment"

 Coordinatore SEMELAB LTD 

 Organization address address: COVENTRY ROAD 15
city: LUTTERWORTH
postcode: LE17 4JB

contact info
Titolo: Mr.
Nome: Liam
Cognome: Mills
Email: send email
Telefono: 441456000000
Fax: 441456000000

 Nazionalità Coordinatore United Kingdom [UK]
 Totale costo 499˙571 €
 EC contributo 337˙141 €
 Programma FP7-JTI
Specific Programme "Cooperation": Joint Technology Initiatives
 Code Call SP1-JTI-CS-2010-03
 Funding Scheme JTI-CS
 Anno di inizio 2011
 Periodo (anno-mese-giorno) 2011-03-01   -   2013-08-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    SEMELAB LTD

 Organization address address: COVENTRY ROAD 15
city: LUTTERWORTH
postcode: LE17 4JB

contact info
Titolo: Mr.
Nome: Liam
Cognome: Mills
Email: send email
Telefono: 441456000000
Fax: 441456000000

UK (LUTTERWORTH) coordinator 113˙875.00
2    UNIVERSITY OF GREENWICH

 Organization address address: "Old Royal Naval College, Park Row, Greenwich"
city: LONDON
postcode: SE10 9LS

contact info
Titolo: Prof.
Nome: Christopher
Cognome: Bailey
Email: send email
Telefono: +44 208 331 8660
Fax: +44 208 331 8665

UK (LONDON) participant 148˙196.50
3    DYNEX SEMICONDUCTOR LIMITED

 Organization address address: DODDINGTON ROAD
city: LINCOLN
postcode: LN6 3LF

contact info
Titolo: Mr.
Nome: David
Cognome: Newcombe
Email: send email
Telefono: +44 1522 500500
Fax: +44 1522 502858

UK (LINCOLN) participant 75˙069.50

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

reliability    deg    module    power    models    modules   

 Obiettivo del progetto (Objective)

'Power Module Reliability (PEMREL) addresses the clean sky’s call “Sample PEM (Power Electronic Module) construction for testing, characterisation and manufacturability assessment. This proposal aims to compliment other research into the development of an all SiC 10kW inverter, implemented in a double-side cooled, non-hermetic sandwich packaging technology (no bondwires), able to withstand a nominal ambient temperature range of -60°C to 200°C. Key developments will include FMMEA, and the development of physics-of-failure reliability models for both type 1 & 2 modules. These modules will be tested for electrical and thermal chracterisation. Power and passive cycling of the modules will be undertaken to generate reliability data for validating the developed reliability models.'

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