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PAMPA

Plastic Components for Advanced Microwave Equipment of New Generation SatCom PAyloads

Total Cost €

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EC-Contrib. €

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Partnership

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Project "PAMPA" data sheet

The following table provides information about the project.

Coordinator
THALES ALENIA SPACE FRANCE SAS 

Organization address
address: AVENUE JEAN FRANCOIS CHAMPOLLION 26
city: TOULOUSE
postcode: 31100
website: www.thalesaleniaspace.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country France [FR]
 Project website http://www.pampah2020.eu
 Total cost 1˙036˙876 €
 EC max contribution 1˙036˙626 € (100%)
 Programme 1. H2020-EU.2.1.6.1. (Enabling European competitiveness, non-dependence and innovation of the European space sector)
 Code Call H2020-COMPET-2014
 Funding Scheme RIA
 Starting year 2015
 Duration (year-month-day) from 2015-01-01   to  2017-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    THALES ALENIA SPACE FRANCE SAS FR (TOULOUSE) coordinator 343˙562.00
2    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 195˙401.00
3    SENCIO BV NL (NIJMEGEN) participant 190˙000.00
4    IKOR TECHNOLOGY CENTER,S.L. ES (SAN SEBASTIAN) participant 187˙653.00
5    UNITED MONOLITHIC SEMICONDUCTORS SAS FR (VILLEBON SUR YVETTE) participant 120˙010.00

Map

 Project objective

Plastic packaging solutions are foreseen as a good candidate to drastically reduce the cost of microwave equipment for future telecom satellite payloads. The objective of PAMPA project is to develop a plastic component technology, from the supply of the packaged microwave component with a reliability level compatible with space constraints up to its assembly on board using SMT (Surface Mount Technology) process. In order to demonstrate the potential of such technology, a flexible, digitally controlled microwave chain, representative of the need for new generation telecom satellite payloads, will be implemented on printed circuit board. Such technologies are particularly appealing for flexible microwave equipment, as the ASIC (Application Specific Integrated Circuit) and the microwave components can be assembled on board using the same SMT process. Furthermore, the use of a multilayer printed circuit board for the microwave chain is convenient for the implementation of dense DC routing of the command signals. To achieve the objective, the consortium gathers a manufacturer of satellite equipment, a Monolithic Microwave Integrated Circuit (MMIC) foundry, an industrial specialized in SMT manufacturing process and an academic partner with valuable knowledge in reliability of microelectronics packaging. It should be outlined that the MMIC foundry involved in the project is a dual foundry as it provides both plastic packaged components for the Automotive market in QFN (Quad-Flat No-leads) housings and bare MMIC with a Space grade quality. The main challenge will be to successfully spin-in a plastic technology coming from another harsh environment market that has drastic cost concerns, the Automotive, to the Space domain.

 Deliverables

List of deliverables.
Delivery of project website Websites, patent fillings, videos etc. 2019-02-25 14:45:51

Take a look to the deliverables list in detail:  detailed list of PAMPA deliverables.

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The information about "PAMPA" are provided by the European Opendata Portal: CORDIS opendata.

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