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SPICE SIGNED

Spintronic-Photonic Integrated Circuit platform for novel Electronics

Total Cost €

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EC-Contrib. €

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Project "SPICE" data sheet

The following table provides information about the project.

Coordinator
AARHUS UNIVERSITET 

Organization address
address: NORDRE RINGGADE 1
city: AARHUS C
postcode: 8000
website: www.au.dk

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Denmark [DK]
 Project website http://spice-fetopen.eu
 Total cost 3˙395˙178 €
 EC max contribution 3˙395˙178 € (100%)
 Programme 1. H2020-EU.1.2.1. (FET Open)
 Code Call H2020-FETOPEN-2014-2015-RIA
 Funding Scheme RIA
 Starting year 2016
 Duration (year-month-day) from 2016-10-01   to  2020-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    AARHUS UNIVERSITET DK (AARHUS C) coordinator 957˙382.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 747˙026.00
3    STICHTING KATHOLIEKE UNIVERSITEIT NL (NIJMEGEN) participant 675˙000.00
4    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 587˙078.00
5    SYNOPSYS DENMARK APS DK (COPENHAGEN V) participant 265˙734.00
6    QUANTUMWISE A/S DK (Copenhagen) participant 162˙956.00

Map

 Project objective

The main objective of SPICE is to realize a novel integration platform that combines photonic, magnetic and electronic components. Its validity will be shown by a conceptually new spintronic-photonic memory chip demonstrator with 3 orders of magnitude higher write speed and 2 orders of magnitude lower energy consumption than state-of-the-art spintronic memory technologies. This enables, e.g., future petabit-per-second processor-memory bandwidths, required in a decade from now, and highly energy-efficient exascale datacenters with reduced carbon footprint. Such a versatile memory will result in so-called Universal Memory: one technology for all memory applications ranging from cache to storage. The methods to achieve this are based on the recent discovery of magnetization reversal by short optical pulses. SPICE will bring this technique to the integrated circuit level by first developing free magnetic layers that can be optically switched into a magnetic-tunnel-junction layerstack, with optically transparent top contacts. These layers will then be processed into spintronic memory elements that can be electrically read. A novel short-pulse switching architecture will be designed and implemented in a silicon photonic integrated circuit. This photonic switching layer will then be combined with the spintronic memory layer to achieve an optically switched 8-bit memory with write efficiency of 600 fJ per bit: the proof of concept of the technology. The novelty of SPICE is the convergence of the emerging fields of opto-magnetism and spintronics with electronic and photonic integration technologies. The ambition is to develop this technology in such a way that it can be compatible with future mature electronics fabrication processes, for real-world applications beyond 2025, thereby creating a new field. The SPICE platform is therefore foundational as it can be used not only for ultrafast and energy-efficient memory, but also for RF nano-oscillators and sensor technology.

 Deliverables

List of deliverables.
Quantitative analysis of memory application Documents, reports 2020-02-25 08:16:31
MTJ element design for optical access Documents, reports 2020-02-25 08:16:31
Silicon photonic chip for distribution network Demonstrators, pilots, prototypes 2020-02-25 08:16:31
MTJ layerstack design for optical switching Documents, reports 2020-02-25 08:16:31
Data Management plan update 1 Documents, reports 2020-02-25 08:16:31
PhD course material Websites, patent fillings, videos etc. 2020-02-25 08:16:31
2nd Annual meeting Documents, reports 2020-02-25 08:16:31
Dissemination and exploitation plan Documents, reports 2020-02-25 08:16:31
1st annual meeting Documents, reports 2020-02-25 08:16:30
Plan for Quality Assurance Documents, reports 2020-02-25 08:16:31
Data Management Plan Open Research Data Pilot 2020-02-25 08:16:31
Check meeting 1 Other 2020-02-25 08:16:30
Kick off meeting Documents, reports 2020-02-25 08:16:30
Project website and logo Websites, patent fillings, videos etc. 2020-02-25 08:16:30

Take a look to the deliverables list in detail:  detailed list of SPICE deliverables.

 Publications

year authors and title journal last update
List of publications.
2018 Becker HB, Heck M
Compact Vertically Focusing Grating Coupler for Optical Addressing of Spintronic Memory Elements
published pages: , ISSN: , DOI:
European Optical Society Annual Meeting 2018 (EOSAM 2018) bi-annual, year 2018 2020-02-25
2017 Juan Manuel Marmolejo-Tejada, Kapildeb Dolui, Predrag Lazić, Po-Hao Chang, Søren Smidstrup, Daniele Stradi, Kurt Stokbro, Branislav K. Nikolić
Proximity Band Structure and Spin Textures on Both Sides of Topological-Insulator/Ferromagnetic-Metal Interface and Their Charge Transport Probes
published pages: 5626-5633, ISSN: 1530-6984, DOI: 10.1021/acs.nanolett.7b02511
Nano Letters 17/9 2020-02-25

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The information about "SPICE" are provided by the European Opendata Portal: CORDIS opendata.

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