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Teraboard SIGNED

High density scalable optically interconnected Tb/s Board

Total Cost €

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EC-Contrib. €

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Partnership

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 Teraboard project word cloud

Explore the words cloud of the Teraboard project. It provides you a very rough idea of what is the project "Teraboard" about.

presently    teraboard    accumulated    bottleneck    transport    convergence    interface    respect    fiber    continuous    datacom    demonstrates    decade    circuits    limitate    cm2    density    layer    silicon    necessarily    centers    metro    plug    edge    bit    5pj    always    pervasive    limited    assisted    amount    content    photonic    aggregation    requiested    10x    telecom    exchanged    last    processor    huge    exchange    volumes    traffic    interconnectivity    gb    capacity    laser    wavelength    optical    full    limiting    connector    communications    transceiver    center    effect    7tb    constituted    commercial    3d    consists    signals       scalable    channel    passive    roadmap    onto    data    ultra    respectively    latency    platform    route    interconnection    intraboard    accumulation    arrays    intrarack    point    redirected    inter    lowest    single    photonics    energy    elaborated    chip    manufacturing    arising    congestion    timeframe    bandwidth    netwotks    plays    insertion    ribbons    bank    wdm   

Project "Teraboard" data sheet

The following table provides information about the project.

Coordinator
CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI 

Organization address
address: VIALE G. P. USBERTI 181A
city: PARMA
postcode: 43124
website: www.cnit.it

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Italy [IT]
 Project website http://www.teraboard.eu/
 Total cost 4˙249˙157 €
 EC max contribution 4˙249˙157 € (100%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2015
 Funding Scheme RIA
 Starting year 2015
 Duration (year-month-day) from 2015-12-01   to  2019-11-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI IT (PARMA) coordinator 1˙029˙750.00
2    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 1˙955˙357.00
3    STMICROELECTRONICS SRL IT (AGRATE BRIANZA) participant 370˙350.00
4    UNIVERSITAT POLITECNICA DE VALENCIA ES (VALENCIA) participant 270˙000.00
5    ERICSSON TELECOMUNICAZIONI SPA IT (ROMA) participant 241˙250.00
6    CONSIGLIO NAZIONALE DELLE RICERCHE IT (ROMA) participant 206˙250.00
7    NOKIA SOLUTIONS AND NETWORKS ITALIA SPA IT (MILANO) participant 119˙950.00
8    EUROPEAN PHOTONICS INDUSTRY CONSORTIUM FR (PARIS 16) participant 56˙250.00
9    ALCATEL-LUCENT ITALIA S.P.A. IT (MILANO) participant 0.00
10    IMINDS BE (GENT) participant 0.00

Map

 Project objective

Optical communications are becoming always more relevant because of the continuous growth of the requiested bandwidth. In the last decade we assisted a continuous growing of transport and metro netwotks, presently the bottleneck is in the processing of the huge amount of data constituted by the growing number of users, the capacity of the content that is exchanged and the convergence of Telecom and Datacom. This accumulation of data are elaborated and redirected within data centers with a continuous growing of traffic congestion. The continuous growth of traffic require therefore a roadmap of bandwidth density growth that necessarily has to be scalable on the timeframe of several years. To this point photonics plays a crucial role that is always more pervasive. However a major limiting factor is also arising from the energy cost and latency accumulated by the need of aggregation to route signals. To limitate this effect is necessary to make possible data exchange and processing without or with limited aggregation. Teraboard project consists in developing a full intra data center photonic platform for intraboard, intrarack and intra data center optical communications. The Teraboard interconnection platform will be based on ultra-high density and scalable bandwidth optical interconnectivity with low insertion loss and a target of lowest energy cost per channel of 2.5pJ/bit and a manufacturing cost of 0.1$/Gb/s in volumes. These target values are 10x reduction respect to commercial state of the art. Teraboard demonstrates: 1) passive, scalable, 3D inter processor interconnection layer, 2) novel WDM optical connector to plug the fiber ribbons directly onto the transceiver chip, 3) intraboard transceiver bank with high density bandwidth of 7Tb/s/cm2. Single wavelength laser arrays will be directly integrated on the silicon photonics transceiver circuits, 4) and edge single and four wavelength transceiver interface with bandwidth density of 50 and 7Tb/s/cm2 respectively.

 Deliverables

List of deliverables.
TERABOARD communication Kit Websites, patent fillings, videos etc. 2019-05-31 15:13:34
TERABOARD communication Kit Websites, patent fillings, videos etc. 2019-05-31 15:13:34
Press release Websites, patent fillings, videos etc. 2019-05-31 15:13:30
Data Management Plan Documents, reports 2019-05-31 15:13:36

Take a look to the deliverables list in detail:  detailed list of Teraboard deliverables.

 Publications

year authors and title journal last update
List of publications.
2018 D. Van Thourhout
New Materials for Active Devices in Silicon Photonics
published pages: , ISSN: , DOI:
The 7th Conference on Advances in Optoelectronics and Micro/nano-optics 2020-02-06
2018 R. Vázquez et al.
Internode interconnection optical platform based on fs-laser written vertical waveguides
published pages: , ISSN: , DOI:
SPIE OPTO 2018, SPIE Photonic West 2018 2020-02-06
2018 Hannes Ramon, Xin Yin, Johan Bauwelinck, Michael Vanhoecke, Jochem Verbist, Wouter Soenen, Peter De Heyn, Yoojin Ban, Marianna Pantouvaki, Joris Van Campenhout, Peter Ossieur
Low-Power 56Gb/s NRZ Microring Modulator Driver in 28nm FDSOI CMOS
published pages: 467-470, ISSN: 1041-1135, DOI: 10.1109/lpt.2018.2799004
IEEE Photonics Technology Letters 30/5 2020-02-05
2019 Joris Lambrecht, Hannes Ramon, Bart Moeneclaey, Jochem Verbist, Michael Vanhoecke, Peter Ossieur, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, Xin Yin
A 106-Gb/s PAM-4 Silicon Optical Receiver
published pages: 505-508, ISSN: 1041-1135, DOI: 10.1109/lpt.2019.2899147
IEEE Photonics Technology Letters 31/7 2020-02-05
2018 Joan Juvert, Tommaso Cassese, Sarah Uvin, Andreas de Groote, Brad Snyder, Lieve Bogaerts, Geraldine Jamieson, Joris Van Campenhout, Günther Roelkens, Dries Van Thourhout
Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing
published pages: 21443, ISSN: 1094-4087, DOI: 10.1364/oe.26.021443
Optics Express 26/17 2020-02-05
2019 Joris Lambrecht, Hannes Ramon, Bart Moeneclaey, Jochem Verbist, Michiel Verplaetse, Michael Vanhoecke, Peter Ossieur, Peter De Heyn, Joris Van Campenhout, Johan Bauwelinck, Xin Yin
90-Gb/s NRZ Optical Receiver in Silicon Using a Fully Differential Transimpedance Amplifier
published pages: 1964-1973, ISSN: 0733-8724, DOI: 10.1109/jlt.2019.2896757
Journal of Lightwave Technology 37/9 2020-02-05
2018 Jochem Verbist, Joris Lambrecht, Michiel Verplaetse, Joris Van Kerrebrouck, Ashwyn Srinivasan, Peter De Heyn, Timothy De Keulenaer, Xin Yin, Guy Torfs, Joris Van Campenhout, Gunther Roelkens, Johan Bauwelinck
DAC-Less and DSP-Free 112 Gb/s PAM-4 Transmitter Using Two Parallel Electroabsorption Modulators
published pages: 1281-1286, ISSN: 0733-8724, DOI: 10.1109/jlt.2017.2789164
Journal of Lightwave Technology 36/5 2020-02-05
2019 Hannes Ramon, Johan Bauwelinck, Joris Lambrecht, Jochem Verbist, Michael Vanhoecke, Srinivasan Ashwyn Srinivasan, Peter De Heyn, Joris Van Campenhout, Peter Ossieur, Xin Yin
70 Gb/s Low-Power DC-Coupled NRZ Differential Electro-Absorption Modulator Driver in 55 nm SiGe BiCMOS
published pages: 1504-1514, ISSN: 0733-8724, DOI: 10.1109/jlt.2019.2900192
Journal of Lightwave Technology 37/5 2020-02-05
2017 Ana Belén González, Jose Pozo
Teraboard Project Closing in on Future of Telecommunications
published pages: 24-25, ISSN: 1863-1460, DOI: 10.1002/opph.201790006
Optik & Photonik 12/1 2019-06-18

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The information about "TERABOARD" are provided by the European Opendata Portal: CORDIS opendata.

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