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MoCRIV SIGNED

Modeling critical reliability issues in VLSI technologies beyond 2020

Total Cost €

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EC-Contrib. €

0

Partnership

0

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 MoCRIV project word cloud

Explore the words cloud of the MoCRIV project. It provides you a very rough idea of what is the project "MoCRIV" about.

hence    science    device    variability    validation    core    acquired    put    physical    interdisciplinary    materials    topology    effect    architectures    industry    expose    alloys    perspectives    building    description    dependent    suggested    nanowire    channel    engineering    model    unifying    energetic    transistors    individual    centric    electrical    2020    ge    paradigm    framework    experimentally    defects    nanoscale    microscopic    career    circuit    determined    instability    modeling    gate    hot    degradation    precursors    dielectrics    time    temperature    carrier    deactivation    material    phenomena    specifics    sige    bias    professional    fundamental    activation    chemistry    plan    consistently    interface    paid    activated    self    vlsi    validated    fin    carriers    reliability    defect    parasitic    broadening    capture    driving    forces    simulation    physics    computational    oxide    skills    special    training    expertise    valuable    heating    mobility    industrial   

Project "MoCRIV" data sheet

The following table provides information about the project.

Coordinator
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM 

Organization address
address: KAPELDREEF 75
city: LEUVEN
postcode: 3001
website: www.imec.be

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Belgium [BE]
 Total cost 172˙800 €
 EC max contribution 172˙800 € (100%)
 Programme 1. H2020-EU.1.3.2. (Nurturing excellence by means of cross-border and cross-sector mobility)
 Code Call H2020-MSCA-IF-2017
 Funding Scheme MSCA-IF-EF-ST
 Starting year 2018
 Duration (year-month-day) from 2018-08-22   to  2020-08-21

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) coordinator 172˙800.00

Map

 Project objective

This proposal presents an interdisciplinary, forward looking, training-by-research plan in the field of physical reliability modeling of emerging transistors and materials beyond 2020. Its main goal is development and validation of a simulation framework which self-consistently considers the main reliability phenomena including bias temperature instability, hot-carrier degradation, and self-heating. These effects were suggested to be the response of interface and oxide defects/precursors which can be activated by different driving forces determined by device operating conditions and specifics of the device topology. Thus, the core of this project will be put on a detailed microscopic description of the properties of defects/precursors, which will be studied experimentally and theoretically. Within this defect-centric paradigm we will address reliability issues in devices with emerging architectures, i.e. fin and nanowire transistors, high-k gate dielectrics, and high mobility channel materials such as SiGe, Ge, and III-V alloys. The unifying model building on the microscopic defect properties will be validated over a wide range of device bias conditions. We will capture the parasitic effect of self-heating which has a strong impact on the energetic distribution of hot carriers and hence on hot-carrier degradation. Special attention will be paid to time-dependent variability of device characteristics which is a response of nanoscale devices on activation/deactivation of individual defects. Knowledge acquired within this project will be valuable for applied and fundamental physics, material science, computational chemistry, electrical engineering, VLSI technology, and circuit design. The research and training activities will enhance applicant’s future career by broadening his professional skills and expertise, expose him to industrial requirements, and open new perspectives for future collaboration with industry.

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The information about "MOCRIV" are provided by the European Opendata Portal: CORDIS opendata.

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