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MoCRIV SIGNED

Modeling critical reliability issues in VLSI technologies beyond 2020

Total Cost €

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EC-Contrib. €

0

Partnership

0

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 MoCRIV project word cloud

Explore the words cloud of the MoCRIV project. It provides you a very rough idea of what is the project "MoCRIV" about.

circuit    description    nanowire    alloys    self    unifying    forces    defect    physics    activated    career    industry    paid    science    broadening    engineering    training    simulation    suggested    perspectives    expertise    driving    framework    reliability    capture    consistently    material    special    specifics    hence    nanoscale    bias    skills    hot    dielectrics    parasitic    effect    interface    industrial    deactivation    professional    experimentally    activation    precursors    energetic    computational    expose    time    device    physical    valuable    fundamental    microscopic    topology    defects    sige    materials    put    carriers    mobility    model    interdisciplinary    variability    centric    vlsi    ge    gate    fin    oxide    temperature    electrical    validation    transistors    instability    degradation    modeling    validated    channel    building    carrier    plan    phenomena    heating    paradigm    architectures    dependent    individual    determined    chemistry    2020    acquired    core   

Project "MoCRIV" data sheet

The following table provides information about the project.

Coordinator
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM 

Organization address
address: KAPELDREEF 75
city: LEUVEN
postcode: 3001
website: www.imec.be

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Belgium [BE]
 Total cost 172˙800 €
 EC max contribution 172˙800 € (100%)
 Programme 1. H2020-EU.1.3.2. (Nurturing excellence by means of cross-border and cross-sector mobility)
 Code Call H2020-MSCA-IF-2017
 Funding Scheme MSCA-IF-EF-ST
 Starting year 2018
 Duration (year-month-day) from 2018-08-22   to  2020-08-21

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) coordinator 172˙800.00

Map

 Project objective

This proposal presents an interdisciplinary, forward looking, training-by-research plan in the field of physical reliability modeling of emerging transistors and materials beyond 2020. Its main goal is development and validation of a simulation framework which self-consistently considers the main reliability phenomena including bias temperature instability, hot-carrier degradation, and self-heating. These effects were suggested to be the response of interface and oxide defects/precursors which can be activated by different driving forces determined by device operating conditions and specifics of the device topology. Thus, the core of this project will be put on a detailed microscopic description of the properties of defects/precursors, which will be studied experimentally and theoretically. Within this defect-centric paradigm we will address reliability issues in devices with emerging architectures, i.e. fin and nanowire transistors, high-k gate dielectrics, and high mobility channel materials such as SiGe, Ge, and III-V alloys. The unifying model building on the microscopic defect properties will be validated over a wide range of device bias conditions. We will capture the parasitic effect of self-heating which has a strong impact on the energetic distribution of hot carriers and hence on hot-carrier degradation. Special attention will be paid to time-dependent variability of device characteristics which is a response of nanoscale devices on activation/deactivation of individual defects. Knowledge acquired within this project will be valuable for applied and fundamental physics, material science, computational chemistry, electrical engineering, VLSI technology, and circuit design. The research and training activities will enhance applicant’s future career by broadening his professional skills and expertise, expose him to industrial requirements, and open new perspectives for future collaboration with industry.

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The information about "MOCRIV" are provided by the European Opendata Portal: CORDIS opendata.

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