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MoCRIV SIGNED

Modeling critical reliability issues in VLSI technologies beyond 2020

Total Cost €

0

EC-Contrib. €

0

Partnership

0

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 MoCRIV project word cloud

Explore the words cloud of the MoCRIV project. It provides you a very rough idea of what is the project "MoCRIV" about.

perspectives    engineering    physics    nanowire    channel    device    bias    determined    temperature    special    unifying    validation    interface    simulation    training    effect    architectures    nanoscale    specifics    dependent    fin    professional    gate    building    driving    skills    experimentally    description    carriers    topology    energetic    oxide    defect    acquired    transistors    activation    alloys    time    ge    parasitic    chemistry    circuit    variability    modeling    instability    carrier    sige    hot    paid    materials    dielectrics    valuable    hence    put    science    degradation    forces    interdisciplinary    expertise    industrial    suggested    industry    expose    physical    plan    capture    2020    framework    material    vlsi    centric    activated    reliability    model    self    phenomena    computational    career    microscopic    core    mobility    fundamental    broadening    consistently    validated    defects    deactivation    paradigm    individual    electrical    precursors    heating   

Project "MoCRIV" data sheet

The following table provides information about the project.

Coordinator
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM 

Organization address
address: KAPELDREEF 75
city: LEUVEN
postcode: 3001
website: www.imec.be

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Belgium [BE]
 Total cost 172˙800 €
 EC max contribution 172˙800 € (100%)
 Programme 1. H2020-EU.1.3.2. (Nurturing excellence by means of cross-border and cross-sector mobility)
 Code Call H2020-MSCA-IF-2017
 Funding Scheme MSCA-IF-EF-ST
 Starting year 2018
 Duration (year-month-day) from 2018-08-22   to  2020-08-21

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) coordinator 172˙800.00

Map

 Project objective

This proposal presents an interdisciplinary, forward looking, training-by-research plan in the field of physical reliability modeling of emerging transistors and materials beyond 2020. Its main goal is development and validation of a simulation framework which self-consistently considers the main reliability phenomena including bias temperature instability, hot-carrier degradation, and self-heating. These effects were suggested to be the response of interface and oxide defects/precursors which can be activated by different driving forces determined by device operating conditions and specifics of the device topology. Thus, the core of this project will be put on a detailed microscopic description of the properties of defects/precursors, which will be studied experimentally and theoretically. Within this defect-centric paradigm we will address reliability issues in devices with emerging architectures, i.e. fin and nanowire transistors, high-k gate dielectrics, and high mobility channel materials such as SiGe, Ge, and III-V alloys. The unifying model building on the microscopic defect properties will be validated over a wide range of device bias conditions. We will capture the parasitic effect of self-heating which has a strong impact on the energetic distribution of hot carriers and hence on hot-carrier degradation. Special attention will be paid to time-dependent variability of device characteristics which is a response of nanoscale devices on activation/deactivation of individual defects. Knowledge acquired within this project will be valuable for applied and fundamental physics, material science, computational chemistry, electrical engineering, VLSI technology, and circuit design. The research and training activities will enhance applicant’s future career by broadening his professional skills and expertise, expose him to industrial requirements, and open new perspectives for future collaboration with industry.

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The information about "MOCRIV" are provided by the European Opendata Portal: CORDIS opendata.

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