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Stability Under Process Variability for Advanced Interconnects and Devices Beyond 7 nm node

Total Cost €


EC-Contrib. €






 SUPERAID7 project word cloud

Explore the words cloud of the SUPERAID7 project. It provides you a very rough idea of what is the project "SUPERAID7" about.

nm    device    possibility    meet    node    thermal    roadmap    commercialization    compact    influence    electrical    behavior    itrs    stochastic    correlations    international    stacked    trace    limitations    fp7    percentage    capability    gss    progress    nanowires    omega    board    fets    models    experimental    architectures    supertheme    industrial    variations    drastically    specifications    physical    semiconductors    scaled    utilizing    extended    globalfoundries    impossible    variability    corresponding    data    benchmarks    stmicroelectronics    successful    channel    aggressively    statistical    changing    architecture    alternative    materials    investigation    benchmarked    consisting    gate    critical    highlighted    cea    initially    sources    tcad    sideground    nanoelectronics    below    channels    input    fabricated    circuits    whereas    software    offers    background    moore    superaid7    systematic    trigate    mechanical    subsequent    interconnects    simulation    advisory    largely    predefine    experiments    requirement   

Project "SUPERAID7" data sheet

The following table provides information about the project.


Organization address
postcode: 80686

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Project website
 Total cost 3˙377˙527 €
 EC max contribution 3˙377˙527 € (100%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2015
 Funding Scheme RIA
 Starting year 2016
 Duration (year-month-day) from 2016-01-01   to  2018-12-31


Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
3    UNIVERSITY OF GLASGOW UK (GLASGOW) participant 598˙205.00
4    TECHNISCHE UNIVERSITAET WIEN AT (WIEN) participant 534˙250.00
5    Gold Standard Simulations ltd UK (Glasgow) participant 382˙877.00


 Project objective

Among the physical limitations which challenge progress in nanoelectronics for aggressively scaled More Moore, process variability is getting ever more critical. Effects from various sources of process variations, both systematic and stochastic, influence each other and lead to variations of the electrical, thermal and mechanical behavior of devices, interconnects and circuits. Correlations are of key importance because they drastically affect the percentage of products which meet the specifications. Whereas the comprehensive experimental investigation of these effects is largely impossible, modelling and simulation (TCAD) offers the unique possibility to predefine process variations and trace their effects on subsequent process steps and on devices and circuits fabricated, just by changing the corresponding input data. This important requirement for and capability of simulation is among others highlighted in the International Technology Roadmap for Semiconductors ITRS. SUPERAID7 will build upon the successful FP7 project SUPERTHEME which focused on advanced More-than-Moore devices, and will establish a software system for the simulation of the impact of systematic and statistical process variations on advanced More Moore devices and circuits down to the 7 nm node and below, including especially interconnects. This will need improved physical models and extended compact models. Device architectures addressed in the benchmarks include especially TriGate/ΩGate FETs and stacked nanowires, including alternative channel materials. The software developed will be benchmarked utilizing background and sideground experiments of the partner CEA. Main channels for exploitation will be software commercialization via the partner GSS and support of device architecture activities at CEA. Furthermore, an Industrial Advisory Board initially consisting of GLOBALFOUNDRIES and STMicroelectronics will contribute to the specifications and will get early access to the project results.


List of deliverables.
Hierarchical set of presentation foils and leaflets for use by SUPERAID7 partners and eventually by the EC services – to be updated until the end of the project Documents, reports 2019-10-02 12:46:27
Final version of SUPERAID7 WWW including restricted section and including material from the SUPERAID7 Workshop Websites, patent fillings, videos etc. 2019-10-02 12:46:27
Summary of results of SUPERAID7 dissemination actions (events, papers) Documents, reports 2019-10-02 12:46:27
Guide to research data disseminated from SUPERAID7 Open Research Data Pilot 2019-10-02 12:46:27
Public workshop on variability Websites, patent fillings, videos etc. 2019-10-02 12:46:27
Demonstration of correlation-aware simulation of impacts of statistical and systematic variability Documents, reports 2019-10-02 12:46:27
Publishable version of the Technology Implementation Plan Documents, reports 2019-10-02 12:46:27
Set-up of SUPERAID7 WWW including preliminary version of restricted section Websites, patent fillings, videos etc. 2019-10-02 12:46:27
Project Presentation Websites, patent fillings, videos etc. 2019-10-02 12:46:27

Take a look to the deliverables list in detail:  detailed list of SUPERAID7 deliverables.


year authors and title journal last update
List of publications.
2017 Talib Al-Ameri, Vihar P. Georgiev, Fikru Adamu-Lema, Asen Asenov
Simulation Study of Vertically Stacked Lateral Si Nanowires Transistors for 5-nm CMOS Applications
published pages: 466-472, ISSN: 2168-6734, DOI: 10.1109/jeds.2017.2752465
IEEE Journal of the Electron Devices Society 5/6 2019-10-02
2017 S. Barraud, V. Lapras, M. Samson, B. Previtali, J. Hartmann, N. Rambal, C. Vizioz, V. Loup, C. Comboroure, F. Triozon, N. Bernier, D. Cooper, M. Vinet
Stacked-Wires FETs for Advanced CMOS Scaling
published pages: 1, ISSN: , DOI:
Proceedings 2017 International Conference on Solid State Devices and Materials (SSDM 2017) 2019-10-02
2017 Zaiping Zeng, Francois Triozon, Sylvain Barraud, Yann-Michel Niquet
A Simple Interpolation Model for the Carrier Mobility in Trigate and Gate-All-Around Silicon NWFETs
published pages: 2485-2491, ISSN: 0018-9383, DOI: 10.1109/ted.2017.2691406
IEEE Transactions on Electron Devices 64/6 2019-10-02
2018 Juergen Klaus Lorenz, Asen Asenov, Eberhard Baer, Sylvain Barraud, Campbell Millar, Mihail Nedjalkov
(Invited) Process Variability for Devices at and Beyond the 7 nm Node
published pages: 113-124, ISSN: 1938-5862, DOI: 10.1149/08508.0113ecst
ECS Transactions 85/8 2019-10-02
2018 Xaver Klemenschits, Siegfried Selberherr, Lado Filipovic
Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review
published pages: 631, ISSN: 2072-666X, DOI: 10.3390/mi9120631
Micromachines 9/12 2019-10-02
2018 Bruna Cardoso Paz, Mikaël Cassé, Sylvain Barraud, Gilles Reimbold, Maud Vinet, Olivier Faynot, Marcelo Antonio Pavanello
Methodology to separate channel conductions of two level vertically stacked SOI nanowire MOSFETs
published pages: 62-70, ISSN: 0038-1101, DOI: 10.1016/j.sse.2018.08.012
Solid-State Electronics 149 2019-10-02
2019 Toufik Sadi, Cristina Medina-Bailon, Mihail Nedjalkov, Jaehyun Lee, Oves Badami, Salim Berrada, Hamilton Carrillo-Nunez, Vihar Georgiev, Siegfried Selberherr, Asen Asenov
Simulation of the Impact of Ionized Impurity Scattering on the Total Mobility in Si Nanowire Transistors
published pages: 124, ISSN: 1996-1944, DOI: 10.3390/ma12010124
Materials 12/1 2019-10-02
2017 Paul Ellinghaus, Josef Weinbub, Mihail Nedjalkov, Siegfried Selberherr
Analysis of lense-governed Wigner signed particle quantum dynamics
published pages: 1700102, ISSN: 1862-6254, DOI: 10.1002/pssr.201700102
physica status solidi (RRL) - Rapid Research Letters 11/7 2019-10-02
2019 Jürgen Lorenz, Eberhard Bär, Sylvain Barraud, Andrew Brown, Peter Evanschitzky, Fabian Klüpfel, Liping Wang
Process Variability—Technological Challenge and Design Issue for Nanoscale Devices
published pages: 6, ISSN: 2072-666X, DOI: 10.3390/mi10010006
Micromachines 10/1 2019-10-02
2018 Jaehyun Lee, Oves Badami, Hamilton Carrillo-Nuñez, Salim Berrada, Cristina Medina-Bailon, Tapas Dutta, Fikru Adamu-Lema, Vihar Georgiev, Asen Asenov
Variability Predictions for the Next Technology Generations of n-type SixGe1−x Nanowire MOSFETs
published pages: 643, ISSN: 2072-666X, DOI: 10.3390/mi9120643
Micromachines 9/12 2019-10-02
2018 Mihail Nedjalkov, Paul Ellinghaus, Josef Weinbub, Toufik Sadi, Asen Asenov, Ivan Dimov, Siegfried Selberherr
Stochastic analysis of surface roughness models in quantum wires
published pages: 30-37, ISSN: 0010-4655, DOI: 10.1016/j.cpc.2018.03.010
Computer Physics Communications 228 2019-10-02
2018 J. K. Lorenz, A. Asenov, E. Baer, S. Barraud, F. Kluepfel, C. Millar, M. Nedjalkov
Process Variability for Devices at and beyond the 7 nm Node
published pages: P595-P601, ISSN: 2162-8769, DOI: 10.1149/2.0051811jss
ECS Journal of Solid State Science and Technology 7/11 2019-10-02
2018 Bruna Cardoso Paz, Mikaël Cassé, Sylvain Barraud, Gilles Reimbold, Maud Vinet, Olivier Faynot, Marcelo Antonio Pavanello
Electrical characterization of vertically stacked p-FET SOI nanowires
published pages: 84-91, ISSN: 0038-1101, DOI: 10.1016/j.sse.2017.12.011
Solid-State Electronics 141 2019-10-02
2017 Vihar P. Georgiev, Muhammad M. Mirza, Alexandru-Iustin Dochioiu, Fikru Adamu-Lema, Salvatore M. Amoroso, Ewan Towie, Craig Riddet, Donald A. MacLaren, Asen Asenov, Douglas J. Paul
Experimental and Simulation Study of Silicon Nanowire Transistors Using Heavily Doped Channels
published pages: 727-735, ISSN: 1536-125X, DOI: 10.1109/tnano.2017.2665691
IEEE Transactions on Nanotechnology 16/5 2019-10-02
2018 Talib Al-Ameri
Correlation between the Golden Ratio and Nanowire Transistor Performance
published pages: 54, ISSN: 2076-3417, DOI: 10.3390/app8010054
Applied Sciences 8/1 2019-10-02

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