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REFERENCE SIGNED

Rf Engineered substrates to FostER fEm performaNCE

Total Cost €

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EC-Contrib. €

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Partnership

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Project "REFERENCE" data sheet

The following table provides information about the project.

Coordinator
SOITEC SA 

Organization address
address: CHEMIN DES FRANQUES - PARC TECHNOLOGIQUE DES FONTAINES
city: BERNIN
postcode: 38190
website: www.soitec.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country France [FR]
 Project website http://reference.ecsel.soitec.eu
 Total cost 33˙065˙895 €
 EC max contribution 10˙028˙062 € (30%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call H2020-ECSEL-2015-1-RIA-two-stage
 Funding Scheme ECSEL-RIA
 Starting year 2015
 Duration (year-month-day) from 2015-12-01   to  2019-11-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    SOITEC SA FR (BERNIN) coordinator 3˙718˙875.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 2˙240˙924.00
3    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 876˙432.00
4    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 698˙916.00
5    GLOBALFOUNDRIES Dresden Module One LLC & Co. KG DE (Dresden) participant 413˙926.00
6    SILTRONIC AG DE (MUNCHEN) participant 372˙445.00
7    AED ENGINEERING GMBH DE (MUNCHEN) participant 345˙386.00
8    TECHNISCHE UNIVERSITAET DRESDEN DE (DRESDEN) participant 295˙693.00
9    AIRBUS DEFENCE AND SPACE GMBH DE (TAUFKIRCHEN) participant 228˙646.00
10    UNIVERSITE LYON 1 CLAUDE BERNARD FR (VILLEURBANNE CEDEX) participant 198˙861.00
11    SENTRONICS METROLOGY GMBH DE (MANNHEIM) participant 191˙937.00
12    ATEP - AMKOR TECHNOLOGY PORTUGAL SA PT (MINDELO VILA DO CONDE) participant 157˙344.00
13    UNIVERSITAET DER BUNDESWEHR MUENCHEN DE (NEUBIBERG) participant 115˙180.00
14    STMICROELECTRONICS SA FR (MONTROUGE) participant 97˙999.00
15    FERFICS LIMITED IE (CORK) participant 75˙493.00
16    TELIT AUTOMOTIVE SOLUTIONS SARL FR (COLOMBELLES) participant 0.00

Map

 Project objective

The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s. The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design, metrology to system integration capable to address the unresolved 4G requirements for RF FEMs (data rate >1Gb/s) and pave the way to 5G. The R&D and demonstration actions include: • Development of innovative RFSOI substrates for 4G / 5G • Move to 300 mm diameter • Development of 4G / 5G RF-SOI devices with 2 major European foundries : analog in 200 mm 130nm technology, RF digital by combining RFSOI and FDSOI in 300 mm at 22nm; • Innovative design for 4G /5G (analog and RF digital), • Integration of several 4G FEM components on the same chip and demonstration System in Package Technology (SiP). 3 applications are investigated : • Cellular / Iot : 4G RFSOI FEM demonstrator at SiP device level • Automotive : 4G RF-SOI demonstrator at SiP device level • Aviation: RF-SOI high data rate wireless communication module at system level; targeting a new frequency band for aeronautic.

The project is executed within 5 European countries, by on a strong and complementary and well balanced consortium, 6 large industrial companies (world leaders in material, foundries, aeronautics), 4 SMEs and a network of world class level and major European public research institutes and academics. It clearly aims to develop industrial solutions enabling European leadership and production. Through this technology disruption, REFERENCE project addresses major thrusts for smart mobility, smart society, semiconductor processes, equipments, design technology and smart systems implementation, and support the societal challenges of smart transport, as well as secure and innovative society.

 Deliverables

List of deliverables.
D1.11 Websites, patent fillings, videos etc. 2020-03-06 18:02:20

Take a look to the deliverables list in detail:  detailed list of REFERENCE deliverables.

 Publications

year authors and title journal last update
List of publications.
2017 S. Boutayeb
Output Matching Network Design for Class B/J PA
published pages: , ISSN: , DOI:
Mars 2020-03-06
2017 A. Giry
RFSOI for Tunable RF
published pages: , ISSN: , DOI:
Mars 2020-03-06
2018 Yeghoyan Taguhi, Alassaad Kassem, McMitchell Sean R.C., Gutierrez Marina, Souliere Véronique, Araujo Daniel, Ferro Gabriel
Silicon (001) Heteroepitaxy on 3C-SiC(001)/Si(001) Seed
published pages: 128-131, ISSN: , DOI:
Materials Science Forum Vol. 924 2020-03-06
2017 A. Giry, A. Serhan, P. Ferris
RF SOI Technology for PA/FEM Integration
published pages: , ISSN: , DOI:
2020-03-06
2017 D. Nicolas, A. Serhan , P. Ferris, A. Giry, T. Parra
Système de Détection d\'impédance en technologie CMOS SOI pour accord d\'antennes
published pages: , ISSN: , DOI:
Journées Nationales Micro-ondes Mai 2020-03-06
2017 T. YEGHOYAN, K. ALASSAAD, V. SOULIERE, G. FERRO
Silicon Deposition on 3C-SiC Seeds of Different Orientations
published pages: 87-90, ISSN: , DOI:
Materials Science Forum Vol. 897 2020-03-06
2018 Lei Zhu, Shuangke Liu, Frederic Allibert, Ionut Radu, Xinen Zhu, Yumin Lu, Xi Wang
RF Characteristics of Two Generations of RFeSI HR-SOI Substrates Over Temperature
published pages: 377-379, ISSN: 1531-1309, DOI: 10.1109/lmwc.2018.2813884
IEEE Microwave and Wireless Components Letters 28/5 2020-03-06
2018 Babak Kazemi Esfeh, Martin Rack, Khaled Ben Ali, Frederic Allibert, Jean-Pierre Raskin
RF Small- and Large-Signal Characteristics of CPW and TFMS Lines on Trap-Rich HR-SOI Substrates
published pages: 3120-3126, ISSN: 0018-9383, DOI: 10.1109/ted.2018.2845679
IEEE Transactions on Electron Devices 65/8 2020-03-06
2018 Manuel Sellier
(Invited) Substrate and Device Engineering for IoT and Automotive
published pages: 3-13, ISSN: 1938-5862, DOI: 10.1149/08508.0003ecst
ECS Transactions 85/8 2020-03-06
2018 Oleg Kononchuk, Didier Landru, Damien Massy, Nadia Ben Mohamed, Youngpil Kim, Pablo Acosta-Alba and François Rieutord
SOI Wafer Technology for Advanced Mos Applications
published pages: , ISSN: , DOI:
236th ECS meetings Oct 3rd 2018 2020-03-06

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