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Highly Integrated Optoelectronic Sensor

Total Cost €


EC-Contrib. €






Project "HIOS" data sheet

The following table provides information about the project.


Organization address
postcode: 8141

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Austria [AT]
 Project website
 Total cost 4˙282˙541 €
 EC max contribution 2˙997˙778 € (70%)
 Programme 1. H2020-EU.3. (PRIORITY 'Societal challenges)
2. H2020-EU.2. (PRIORITY 'Industrial leadership')
 Code Call H2020-FTIPilot-2015-1
 Funding Scheme IA
 Starting year 2016
 Duration (year-month-day) from 2016-08-01   to  2019-07-31


Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    AMS AG AT (UNTERPREMSTAETTEN) coordinator 1˙471˙341.00
2    BUHLER ALZENAU GMBH DE (ALZENAU) participant 770˙000.00
3    BOSCHMAN TECHNOLOGIES BV NL (DUIVEN) participant 489˙825.00
4    ADVANCED PACKAGING CENTER BV NL (DUIVEN) participant 266˙612.00


 Project objective

HIOS (“Highly Integrated Optoelectronic Sensor”) aims to develop and to launch world’s first light sensor with fully integrated optical stack. The fully integrated optically stack technology which will be developed in HIOS project will be the technology enabler which brings the highly integrated optoelectronic sensor to the market. The sensors which will be enabled in the first step are single band and multi band light sensors, namely Ambient Light Sensor and derivate such as UV Sensor & Color Sensor. Three main markets which will be addressed are the Wearable, Low Cost Consumer (smart phones, cellular) & Smart Lighting Market.

ams already offers prior art TSL2584TSV which is industry’s first ambient light sensor with 3D/TSV and single filter integrated at wafer level. In HIOS project the consortium wants to move one step further to ensure also the future competitiveness and keep the market leadership in Europe. HIOS project wants to integrate the full optical stacks including multiple filters, lenses and apertures for the first time and wants to provide a high volume production environment for 3D/TSV Filters Wafer Level Package. The main technical innovations will be Filter tool and processes developed to achieve industry’s tightest filter specifications, Wafer Level Molding tool modified by adding new alignment system to achieve, novel patented lense design and wafer level mold process, filters, lenses and apertures integrated at Wafer Level for the first time and industry’s lowest alignment tolerances as required by the applications. The expected outcomes are a Single band and multi-band light sensors – smallest size and lowest system cost at best optical performance (ambient light sensor and derivatives such as color sensor and UV sensor) and an Equipment which enabling this new application and many other applications; WLM- tightest overlay control; Filter – tightest pass band width control; low stress filter deposition to enable multiple filters.


List of deliverables.
D5.4 Report on final dissemination and communication results Documents, reports 2020-04-14 15:32:46
D5.2 Report on first 24 month dissemination and communication results Documents, reports 2020-04-14 15:32:46
D1.5 Final Publishable Activity Report Documents, reports 2020-04-14 15:32:46

Take a look to the deliverables list in detail:  detailed list of HIOS deliverables.


year authors and title journal last update
List of publications.
2017 Jens-Peter Biethan, Detlef Arhilger, Jürgen Pistner, Holger Reus, Martin Stapp, Harro Hagedorn
High precision optical filter based on magnetron sputtering
published pages: 26-31, ISSN: 0947-076X, DOI: 10.1002/vipr.201700654
Vakuum in Forschung und Praxis 29/4 2020-04-14

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The information about "HIOS" are provided by the European Opendata Portal: CORDIS opendata.

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