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RocketChip SIGNED

High Speed, Cost Effective Optical Communications Module Enabling the Next Generation of Ethernet 400 GbE

Total Cost €

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EC-Contrib. €

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Partnership

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Project "RocketChip" data sheet

The following table provides information about the project.

Coordinator
EFFECT PHOTONICS BV 

Organization address
address: TORENALLEE 20
city: EINDHOVEN
postcode: 5617 BC
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Netherlands [NL]
 Project website http://www.rocketchip.eu
 Total cost 3˙368˙250 €
 EC max contribution 2˙357˙775 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-2-2016-2017
 Funding Scheme SME-2
 Starting year 2016
 Duration (year-month-day) from 2016-11-01   to  2018-10-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    EFFECT PHOTONICS BV NL (EINDHOVEN) coordinator 1˙416˙712.00
2    EFFECT PHOTONICS LTD UK (ALTRINCHAM) participant 941˙062.00

Map

 Project objective

Project “RocketChip” will develop a 400 Gb/s optical communications module for optical fibre transmission. The core technology for this high speed, communications module is Photonic Integrated Circuits (PIC). This technology allows the transmit- and receive-functionality of the system to be integrated onto single chips. The size of the integrated chips will allow the module size to meet the requirement of an industry standard common form factor. This will make it physically compatible with current system vendors’ products. PIC chips are key to the next generation of telecommunications networks that will demand even higher performance, smaller size and lower cost. EFFECT Photonics are leaders in the field of Photonic Integrated Circuits (PICs) and will combine their PIC technology (based on technology spun out from TuE) with their unique and low cost PIC chip packaging technology (15x cheaper than traditional gold box packaging). This will give EFFECT Photonics a significant cost advantage over competing technologies and products, making it economically viable to manufacture the product in Europe. On completion, this 2 year project will deliver a market ready and cost effective 400 Gb/s optical communication module. The project is a key enabler of 400Gb Ethernet (400 GbE), providing a timely solution to the urgent, unrelenting issue of rapidly increasing bandwidth demand, converting world leading European research and innovation into €148M of revenue and securing Europe’s position at the forefront of an emerging Photonic Integrated Circuit industry. This project will enable EFFECT Photonics to develop a leadership position in the next generation of PICs and hence develop a strong, profitable and growing business in Europe.

 Deliverables

List of deliverables.
Final (Public) Report Documents, reports 2020-03-11 14:37:27
External project website Websites, patent fillings, videos etc. 2019-04-18 14:27:11

Take a look to the deliverables list in detail:  detailed list of RocketChip deliverables.

 Publications

year authors and title journal last update
List of publications.
2017 Aaron Albores-Mejía, Sjoerd van der Heide, Muhammad Usman Sadiq, Saeed Tahvili, Chigo Okonkwo, Boudewijn Docter
112-Gbit/s/λ PAM4 transmission enabled by a negatively-chirped InP-MZ modulator
published pages: , ISSN: , DOI:
European Conference on Optical Communication (ECOC)  Th.1.C.4. 2019-06-11
2017 Sjoerd van der Heide, Aaron Albores-Mejia, Fausto Gomez-Agis, Boudewijn Docter, Chigo Okonkwo
112-Gbit/s Single side-band PAM-4 transmission over inter-DCI distances without DCF enabled by low-complexity DSP
published pages: , ISSN: , DOI:
European Conference on Optical Communication (ECOC)  P2.SC5.8 2019-06-11
2019 Boudewijn Docter, Karen Solis-Trapala, Aaron Albores-Mejia
InP PIC\'s scalability for datacenter applications
published pages: , ISSN: , DOI:
Optical Fiber Communication Conference and Exhibition (OFC)  Th3A.5 2019-05-14

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The information about "ROCKETCHIP" are provided by the European Opendata Portal: CORDIS opendata.

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