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MICROPRINCE SIGNED

Pilot line for micro-transfer-printing of functional components on wafer level

Total Cost €

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EC-Contrib. €

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Partnership

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Project "MICROPRINCE" data sheet

The following table provides information about the project.

Coordinator
X-FAB MEMS FOUNDRY GmbH 

Organization address
address: HAARBERGSTR. 67
city: ERFURT
postcode: 99097
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Project website https://microprince.eu/
 Total cost 10˙854˙745 €
 EC max contribution 2˙614˙618 € (24%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call H2020-ECSEL-2016-2-IA-two-stage
 Funding Scheme ECSEL-IA
 Starting year 2017
 Duration (year-month-day) from 2017-04-01   to  2020-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    X-FAB MEMS FOUNDRY GmbH DE (ERFURT) coordinator 419˙925.00
2    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 504˙867.00
3    MELEXIS GMBH DE (ERFURT) participant 312˙375.00
4    TECHNISCHE UNIVERSITAET DRESDEN DE (DRESDEN) participant 263˙946.00
5    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 262˙407.00
6    X-FAB SEMICONDUCTOR FOUNDRIES GMBH DE (ERFURT) participant 211˙900.00
7    HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM BE (GENT) participant 176˙344.00
8    UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK IE (Cork) participant 173˙125.00
9    OPTICS BALZERS JENA GMBH DE (JENA) participant 97˙599.00
10    MELEXIS TECHNOLOGIES BE (TESSENDERLO) participant 86˙162.00
11    X-CELEPRINT LIMITED IE (DUBLIN) participant 67˙175.00
12    MELEXIS BE (IEPER) participant 38˙787.00
13    MELEXIS TECHNOLOGIES SA CH (BEVAIX) participant 0.00

Map

 Project objective

The “Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level” project (MICROPRINCE) is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (µTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transfer printed to demonstrate the capabilities of the technology and pilot line. Based on several EU and national research activities demonstrating successfully the feasibility of µTP technology in a scientific and laboratory environment, the MICROPRINCE consortium has the goal to setup the first worldwide open access foundry pilot line for heterogeneous integration by µTP and to demonstrate its capability on five defined target application scenarios. For this purpose, the consortium consisting of 13 partners from four different countries combine their expertise along the value chain from materials and equipment, technology and semiconductor processing, integrated circuit and system design, test and application. The partners are industrial companies incl. SME’s, accompanied by leading research institutes with a clear focus on production and application in Europe. The working principle of the micro-transfer-printing technology is to use a micro-structured elastomer stamp to transfer microscale functional components from their native substrates onto non-native substrates. The lateral dimensions of the functional components can range from a few microns to a few hundreds of microns with thicknesses of only a few microns. The native substrate contains the functional components to be printed and is flexible in size and material. The MICROPRINCE pilot line is acting as a regional and nationwide competence cluster for a novel technology with European dimensions for heterogeneous system integration and supports the ECS industry to reach leadership in key applications.

 Deliverables

List of deliverables.
Internal and external IT communication infrastructure and project website Websites, patent fillings, videos etc. 2020-03-12 17:32:40

Take a look to the deliverables list in detail:  detailed list of MICROPRINCE deliverables.

 Publications

year authors and title journal last update
List of publications.
2019 Gerbach, Ronny; Ghosal, Kanchan; Krieger, Uwe; Kittler, Gabriel; Bower, Christopher; Knechtel, Roy
MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly
published pages: , ISSN: , DOI: 10.5281/zenodo.2651911
2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Fairfax, Alaska, 29 November 2017 1 2020-03-12
2019 Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk
Micro-Transfer-Printing and Potential Process Optimizations by FEA
published pages: , ISSN: , DOI: 10.5281/zenodo.2677535
NTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (Eurosime 2019), Hannover, Germany, 24 - 27 March 2019 1 2020-03-12
2019 Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank
Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing
published pages: , ISSN: , DOI: 10.5281/zenodo.2702429
International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components (CAM 2019), Halle, Germany, 10-11 April 2019 1 2020-03-12
2019 Fischbach, Robert; Horst, Tilman; Lienig, Jens
Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing
published pages: , ISSN: , DOI: 10.5281/zenodo.3234391
2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017) 1 2020-03-12
2019 Gomez, David; Moore, Tanya; Meitl, Matthew A.; Bonafede, Salvatore; Pearson, Andrew; Ghosal, Kanchan; Raymond, Brook; Radauscher, Erich; Kneeburg, David; Roe, Julia; Fecioru, Alin; Kelleher, Steven; Trindade, Antonio Jose; Bower, Christopher A.
Manufacturing Capability of Micro-Transfer Printing
published pages: , ISSN: , DOI: 10.5281/zenodo.2654512
Smart Systems Integration (SSI), Barcelona, 10-11 April 2019 1 2020-03-12
2017 Fischbach, Robert; Heinig, Andy; Lienig, Jens
Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT
published pages: , ISSN: , DOI: 10.5281/zenodo.1043277
Fraunhofer EAS 1 2020-03-12
2017 Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny
Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
published pages: , ISSN: , DOI: 10.5281/zenodo.1043259
Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors 1 2020-03-12
2019 Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk
MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA
published pages: , ISSN: , DOI: 10.5281/zenodo.2677551
1 2020-03-12
2019 Roelkens, Gunther; Zhang, Jing; Kumari, Sulakshna; Juvert, Joan; Liles, Alexandros; Muliuk, Grigorij; Goyvaerts, Jeroen; Hag, Bahawal; Mahmoud, Nayyera; Van Thourhout, Dries
Transfer printing for heterogeneous silicon PICs
published pages: , ISSN: , DOI: 10.5281/zenodo.2678181
Presentation at smart Systems Integration 1 2020-03-12
2019 Wicht, Sebastian; Krieger, Uwe; Guenther, Daniela; Heise, Niclas; Krojer, Matthias; Kittler, Gabriel; Naumann, Falk; Altmann, Frank; Gomez, David; Fecioru, Alin
MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level
published pages: , ISSN: , DOI: 10.5281/zenodo.2654502
1 2020-03-12

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