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MY-CUBE SIGNED

3D integration of a logic/memory CUBE for In-Memory-Computing

Total Cost €

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EC-Contrib. €

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Partnership

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 MY-CUBE project word cloud

Explore the words cloud of the MY-CUBE project. It provides you a very rough idea of what is the project "MY-CUBE" about.

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Project "MY-CUBE" data sheet

The following table provides information about the project.

Coordinator
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES 

Organization address
address: RUE LEBLANC 25
city: PARIS 15
postcode: 75015
website: www.cea.fr

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country France [FR]
 Total cost 2˙734˙139 €
 EC max contribution 2˙734˙139 € (100%)
 Programme 1. H2020-EU.1.1. (EXCELLENT SCIENCE - European Research Council (ERC))
 Code Call ERC-2018-COG
 Funding Scheme ERC-COG
 Starting year 2019
 Duration (year-month-day) from 2019-04-01   to  2024-03-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) coordinator 2˙734˙139.00

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 Project objective

For integrated circuits to be able to leverage the future “data deluge” coming from the cloud and cyber-physical systems, the historical scaling of Complementary-Metal-Oxide-Semiconductor (CMOS) devices is no longer the corner stone. At system-level, computing performance is now strongly power-limited and the main part of this power budget is consumed by data transfers between logic and memory circuit blocks in widespread Von-Neumann design architectures. An emerging computing paradigm solution overcoming this “memory wall” consists in processing the information in-situ, owing to In-Memory-Computing (IMC). However, today’s existing memory technologies are ineffective to In-Memory compute billions of data items, as it is the case in the brain. Things may change with the emergence of three key enabling technologies: non-volatile resistive memory, new energy-efficient nanowire transistors and 3D-monolithic. My-CUBE will leverage them towards a functionality-enhanced system with a tight entangling of logic and memory. Only such a technology can support the scalability of the IMC concept. Following a holistic approach from the system to the material, My-CUBE unique solution relies on a new class of nano-technology, mixing at the fine-grain level a high capacity of non-volatile resistive memory coupled with new junctionless nanowire transistors 3D-interconnected at low-temperature, to perform data-centric computations. A 3D IMC accelerator circuit will be designed, manufactured and measured, targeting a 20x reduction in (Energy x Delay) Product vs. Von-Neumann systems. This technology that adds smartness to memory/storage will not only be a game changer for artificial intelligence, machine learning, data analytics or any data-abundant computing systems but it will also be, more broadly, a key computational kernel for next low-power, energy-efficient European integrated circuits.

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The information about "MY-CUBE" are provided by the European Opendata Portal: CORDIS opendata.

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