Digital speakers SIGNED

Project "Digital speakers" data sheet

The following table provides information about the project.

 Partnership

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 Project objective

USound GmbH designs, develops and markets highly integrated micro-loudspeakers based on a new piezoelectric MEMS (Micro-Electro-Mechanical System) technology. USound, founded in 2014, is based in Graz, Austria, with offices in Vienna, Austria, San Francisco, USA and Shenzhen, China. USound has been growing fast from the start, with a current headcount of 58 people. USound’s revenue model is based on a high-volume sales of MEMS loudspeakers on a B2B basis to OEMs or other manufacturers of audio equipment. USound’s Vision is to be at the forefront of the digital transformation of the loudspeaker market. By 2020 USound will be a recognised design house for innovative and high-quality acoustic system solutions based on the unique features of the MEMS technology. USound will achieve this by pursuing a fabless business model, concentrating on its core technological competences: audio and MEMS technology, ASIC integration and manufacturing know-how, as well as IP protection and exploitation (37 patent families filed). The loudspeaker is the last component which has not yet been digitised, due to technical restraints. Therefore, loudspeakers are difficult to integrate in the manufacturing flow, which causes manifold problems for manufacturers of micro-electronic devices. The piezoelectric digital MEMS loudspeaker technology of USound makes fully automated manufacturing possible, while also improving sound quality, reducing the form factor and power requirements. The first product (in-ear phone) with USound loudspeakers inside will be marketed internationally by USound’s client 3nod. So, the market readiness of the first USound product “Ganymede” has been proven, but USound has realized that the piezo MEMS technology has not yet been exploited to its full capacity. “Kore” is now the next generation, which will bring a leap in exploitation of the technological potential. This will be achieved by a break-through in the MEMS design and the level of electronic integration.