Opendata, web and dolomites


COmponents and MAcrocomponents Packaging For Space

Total Cost €


EC-Contrib. €






 COMAP-4S project word cloud

Explore the words cloud of the COMAP-4S project. It provides you a very rough idea of what is the project "COMAP-4S" about.

interconnexion    die    despite    industrial    300    sup2    functions    analog    chain    validating    organic    supply    cte    line    serving    components    reachable    drastic    dies    dm    aeronautics    4s    standards    revenues    age    business    manufacturing    competitive    satellite    larger    mm    miniaturized    rad    deep    entered    fpga    additional    pcb    full    made    models    opera    defense    leveraging    dissipation    trying    demonstration    technologies    ecss    macro    satellites    deeply    brave    electronics    esa    vs    lighter    power    thermal    hard    reductions    unmatched    mass    service    stage    thanks    2019    contracts    st    packaging    density    space    625    merit    innovative    vegas    downsize    pcbs    efficient    roadblock    integration    submicron    model    pins    partnership    aboard    worse    figures    qualify    close    cheaper    cga    either    surface    principal    members    trl7    digital    launches    sip    markets    true    ceramic    payloads    comap    tec    dahlia   

Project "COMAP-4S" data sheet

The following table provides information about the project.


Organization address
address: 72-76 RUE HENRY FARMAN
city: PARIS
postcode: 75015

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country France [FR]
 Total cost 2˙975˙275 €
 EC max contribution 2˙975˙275 € (100%)
 Programme 1. H2020-EU. (Enabling European competitiveness, non-dependence and innovation of the European space sector)
2. H2020-EU. (Enabling advances in space technology)
 Code Call H2020-SPACE-2019
 Funding Scheme RIA
 Starting year 2020
 Duration (year-month-day) from 2020-01-01   to  2022-12-31


Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    SAFRAN ELECTRONICS & DEFENSE FR (PARIS) coordinator 1˙710˙556.00
4    NANOXPLORE FR (SEVRES) participant 323˙692.00


 Project objective

Space markets have entered a new age, thanks to new business models but also to the increased use of deeply integrated electronics aboard satellites, either for digital or analog functions. Such miniaturized equipment allows for drastic reductions of the satellite mass, thus enabling larger payloads and more service revenues, and/or lighter satellites, and then cheaper launches. However, despite the deep submicron technologies currently used for manufacturing space components, efficient and competitive packaging of large components remains a roadblock in trying to downsize further these equipment. This is especially true when we have to address dies beyond 300 mm² and/or beyond 625 pins, such integration being made worse with ever increased power dissipation, up to 10 or 20 W per die. Following-up innovative approaches already developed by the Consortium members, such as European rad-hard FPGA (e.g. BRAVE, DAHLIA, OR VEGAS/OPERA projects), System In Package (SIP) technologies and High Density PCB as experienced with ESA contracts, the principal objective of this project is to design and ECSS qualify a “macro-component” Demonstration Model (DM) for space applications, offering unmatched Figures of Merit for space packaging, in terms of Interconnexion density, Die surface, Integration density, together with a cost reduction factor of 3 compared to ceramic CGA, among others. These challenges are made reachable within a 3-phase program, leveraging advanced technologies in organic high density low CTE PCBs, innovative thermal management and SIP integration up to a TRL7 stage, validating the full industrial processes vs. the ECSS Q ST standards. Furthermore, thanks to the close partnership we have in our Consortium, this COMAP-4S Project will set the stage for a true European supply chain serving additional markets beyond rad-hard space equipment, such as embedded macro-components for Defense or Aeronautics, being fully in line with the objectives of SPACE-10-TEC-2019.

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "COMAP-4S" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email ( and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "COMAP-4S" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.;H2020-EU.


Next generation meta-material based SMART and FLEXible optical solar reflectors

Read More  

NEMESIS (2019)

Novel Electride Material for Enhanced electrical propulSIon Solutions

Read More  

VIDEO (2019)

Video Imaging Demonstrator for Earth Observation

Read More