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Opendata, web and dolomites

COMAP-4S SIGNED

COmponents and MAcrocomponents Packaging For Space

Total Cost €

EC-Contrib. €

Partnership

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COMAP-4S project word cloud

Explore the words cloud of the COMAP-4S project. It provides you a very rough idea of what is the project "COMAP-4S" about.

defense pcb sup2 stage additional supply mass made manufacturing aeronautics unmatched trl7 integration full 4s deep worse larger tec brave submicron pins reachable business payloads pcbs space dies satellites interconnexion cga chain cte dahlia vs industrial miniaturized vegas ecss digital launches dm markets density rad standards entered principal innovative packaging members organic macro contracts revenues ceramic efficient electronics model comap figures analog line validating close thanks st leveraging dissipation 300 age models hard roadblock trying serving despite competitive satellite deeply sip drastic demonstration true fpga functions service opera surface reductions partnership mm esa die lighter aboard 625 downsize either thermal merit technologies 2019 cheaper qualify components power

Project "COMAP-4S" data sheet

The following table provides information about the project.

Coordinator	SAFRAN ELECTRONICS & DEFENSE Organization address address: 72-76 RUE HENRY FARMAN city: PARIS postcode: 75015 website: www.safran-group.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	France [FR]
Total cost	2˙975˙275 €
EC max contribution	2˙975˙275 € (100%)
Programme	1. H2020-EU.2.1.6.1. (Enabling European competitiveness, non-dependence and innovation of the European space sector) 2. H2020-EU.2.1.6.2. (Enabling advances in space technology)
Code Call	H2020-SPACE-2019
Funding Scheme	RIA
Starting year	2020
Duration (year-month-day)	from 2020-01-01 to 2022-12-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	SAFRAN ELECTRONICS & DEFENSE SAFRAN ELECTRONICS & DEFENSE Organization address address: 72-76 RUE HENRY FARMAN city: PARIS postcode: 75015 website: www.safran-group.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (PARIS)	coordinator	1˙710˙556.00
2	TECHNISCHE UNIVERSITAT BERLIN TECHNISCHE UNIVERSITAT BERLIN Organization address address: STRASSE DES 17 JUNI 135 city: BERLIN postcode: 10623 website: www.tu-berlin.de contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (BERLIN)	participant	499˙000.00
3	ADVANCED CIRCUIT BOARDS NV ADVANCED CIRCUIT BOARDS NV Organization address address: VOSMEER 3 city: DENDERMONDE postcode: 9200 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (DENDERMONDE)	participant	442˙026.00
4	NANOXPLORE NANOXPLORE Organization address address: 1 avenue de la Cristallerie city: SEVRES postcode: 92310 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (SEVRES)	participant	323˙692.00

Map

Project objective

Space markets have entered a new age, thanks to new business models but also to the increased use of deeply integrated electronics aboard satellites, either for digital or analog functions. Such miniaturized equipment allows for drastic reductions of the satellite mass, thus enabling larger payloads and more service revenues, and/or lighter satellites, and then cheaper launches. However, despite the deep submicron technologies currently used for manufacturing space components, efficient and competitive packaging of large components remains a roadblock in trying to downsize further these equipment. This is especially true when we have to address dies beyond 300 mm² and/or beyond 625 pins, such integration being made worse with ever increased power dissipation, up to 10 or 20 W per die. Following-up innovative approaches already developed by the Consortium members, such as European rad-hard FPGA (e.g. BRAVE, DAHLIA, OR VEGAS/OPERA projects), System In Package (SIP) technologies and High Density PCB as experienced with ESA contracts, the principal objective of this project is to design and ECSS qualify a “macro-component” Demonstration Model (DM) for space applications, offering unmatched Figures of Merit for space packaging, in terms of Interconnexion density, Die surface, Integration density, together with a cost reduction factor of 3 compared to ceramic CGA, among others. These challenges are made reachable within a 3-phase program, leveraging advanced technologies in organic high density low CTE PCBs, innovative thermal management and SIP integration up to a TRL7 stage, validating the full industrial processes vs. the ECSS Q ST standards. Furthermore, thanks to the close partnership we have in our Consortium, this COMAP-4S Project will set the stage for a true European supply chain serving additional markets beyond rad-hard space equipment, such as embedded macro-components for Defense or Aeronautics, being fully in line with the objectives of SPACE-10-TEC-2019.

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The information about "COMAP-4S" are provided by the European Opendata Portal: CORDIS opendata.