THEMA-CNT

Thermal management with carbon nanotube architectures

 Coordinatore OULUN YLIOPISTO 

 Organization address address: Pentti Kaiteran Katu 1
city: OULU
postcode: 90014

contact info
Titolo: Dr.
Nome: Leila
Cognome: Risteli
Email: send email
Telefono: +358 8 5533971
Fax: +358 8 5533973

 Nazionalità Coordinatore Finland [FI]
 Totale costo 3˙465˙764 €
 EC contributo 2˙530˙750 €
 Programma FP7-NMP
Specific Programme "Cooperation": Nanosciences, Nanotechnologies, Materials and new Production Technologies
 Code Call FP7-NMP-2008-SMALL-2
 Funding Scheme CP-FP
 Anno di inizio 2010
 Periodo (anno-mese-giorno) 2010-01-01   -   2012-12-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    OULUN YLIOPISTO

 Organization address address: Pentti Kaiteran Katu 1
city: OULU
postcode: 90014

contact info
Titolo: Dr.
Nome: Leila
Cognome: Risteli
Email: send email
Telefono: +358 8 5533971
Fax: +358 8 5533973

FI (OULU) coordinator 665˙292.00
2    CHALMERS TEKNISKA HOEGSKOLA AB

 Organization address address: -
city: GOETEBORG
postcode: 41296

contact info
Titolo: Ms.
Nome: Ingrid
Cognome: Collin
Email: send email
Telefono: -7721586
Fax: -7728483

SE (GOETEBORG) participant 510˙720.00
3    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW

 Organization address address: Kapeldreef 75
city: LEUVEN
postcode: 3001

contact info
Titolo: Ms.
Nome: Christine
Cognome: Van Houtven
Email: send email
Telefono: +32-16-281 613
Fax: +32-16-281 812

BE (LEUVEN) participant 454˙734.00
4    ON SEMICONDUCTOR BELGIUM BVBA

 Organization address address: WESTERRING 15
city: OUDENAARDE
postcode: 9700

contact info
Titolo: Mr.
Nome: Paul
Cognome: Colson
Email: send email
Telefono: 3255332341
Fax: 3255332452

BE (OUDENAARDE) participant 257˙000.00
5    SZEGEDI TUDOMANYEGYETEM

 Organization address address: DUGONICS TER 13
city: SZEGED
postcode: 6720

contact info
Titolo: Dr.
Nome: Akos
Cognome: Kukovecz
Email: send email
Telefono: 36202561380
Fax: 3662544619

HU (SZEGED) participant 220˙510.00
6    UNIVERSIDAD DEL PAIS VASCO/ EUSKAL HERRIKO UNIBERTSITATEA

 Organization address address: BARRIO SARRIENA S N
city: LEIOA
postcode: 48940

contact info
Titolo: Ms.
Nome: Ione
Cognome: Isasa
Email: send email
Telefono: 34946012895
Fax: 34946013550

ES (LEIOA) participant 219˙994.00
7    SHT SMART HIGH-TECH AB

 Organization address address: FYSIKGRAND 3
city: GOTEBORG
postcode: 412 96

contact info
Titolo: Ms.
Nome: Lilian
Cognome: Liu
Email: send email
Telefono: +46-70-569 3821
Fax: +46 31 7953685

SE (GOTEBORG) participant 202˙500.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

si    crucial    chips    packages    architectures    cooling    electrical    nanotubes    protocol    components    made    cm    ceramics    technologies       carbon    thermal    nanotube   

 Obiettivo del progetto (Objective)

'To overcome the difficulties in the contemporary thermal management of Si components and packages made of ceramics and organic laminates, in this project we propose novel and scaleable cooling technologies that utilize carbon nanotubes and their architectures integrated on various electrical components to achieve cooling efficiency of 100 W/m2 on large area Si chips, 10 W/cm2 on ceramics/polymer packages and 1 kW/cm2 on micro hot spots. Our efforts in the project are focused on generating specifically tailored nanostructured carbon based materials that are crucial for the successful development of new thermal management technologies in current and future electronics. The technologies we are developing will enable direct integration of carbon nanotube architectures in electrical components and make a feasible protocol for upscaling for industrial use. As carbon nanotubes will be directly grown (and in some cases post-mounted) on Si chips/wafers and ceramic/plastic packages the process will be made compatible with conventional Si fabrication and micromodule packaging technologies, i.e. the technology would provide a ready protocol for large scale production of such components. Because of the compatibility with current technologies, the nanotube based cooling devices and production technologies will be cost effective and easy to commercialize. Since thermal management is the most crucial issue in today’s high performance electrical devices (processors, power transistors) the market potential of our innovation is enormous exceeding several billion € total sales every year.'

Introduzione (Teaser)

Electronic devices dissipate heat that can compromise the function of the devices themselves. A novel on-chip thermal management solution exploiting carbon nanotubes will help scientists realise smaller and more powerful circuits.

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