SEALEDBOX

AEROSPACE HOUSING FOR EXTREME ENVIRONMENTS

Coordinatore	FUNDACION TECNALIA RESEARCH & INNOVATION    more  Organization address address: PARQUE TECNOLOGICO DE MIRAMON PASEO MIKELETEGI 2 city: DONOSTIA-SAN SEBASTIAN postcode: 20009 contact info Titolo: Ms. Nome: Garbiñe Cognome: Atxaga Email: send email Telefono: +34 946 430 850
Nazionalità Coordinatore	Spain [ES]
Totale costo	294˙510 €
EC contributo	220˙882 €
Programma	FP7-JTI Specific Programme "Cooperation": Joint Technology Initiatives
Code Call	SP1-JTI-CS-2012-03
Funding Scheme	JTI-CS
Anno di inizio	2013
Periodo (anno-mese-giorno)	2013-08-01   -   2015-05-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	FUNDACION TECNALIA RESEARCH & INNOVATION  Organization address address: PARQUE TECNOLOGICO DE MIRAMON PASEO MIKELETEGI 2 city: DONOSTIA-SAN SEBASTIAN postcode: 20009 contact info Titolo: Ms. Nome: Garbiñe Cognome: Atxaga Email: send email Telefono: +34 946 430 850	ES (DONOSTIA-SAN SEBASTIAN)	coordinator	220˙882.98

Mappa

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 Obiettivo del progetto (Objective)

'The amount of electronically controlled tasks in modern aircraft is increasing steadily and the overall weight of an aircraft has reached a magnitude that requires an analysis to obtain mass reduction. Conventional electronics enclosures are made from metal. Most of the boxes fielded today offer a monolithic architecture in the form of closed box packed with electronics and lots of connectors at the front or the back with corresponding heavy cable harness. The proper housing protects the electronics against the environment, ensures EMC and supports the thermal management. In order to reach higher power density and lower costs the optimisation of the housing is a must. Modern structures built in composite technology are able to provide important mass savings with respect to conventional designs. The advantages of high performance composites are many, including lighter weight, the ability to tailor lay-ups for optimum strength and stiffness, improved fatigue life, corrosion resistance and, with good design practice, reduced assembly costs due to fewer detail parts and fasteners. The objective of the present project is the development of an integrated solution for a lightweight hermetic sealed power electronic housing for unpressurised area with cost neutrality and according to DO160. The final objective is the reengineering of the flat top and bottom covers of the housing in order to demonstrate the technical and economical viability of composite materials as housing materials for extreme environments. The aluminium vertical walls providing the attachment points to the electronic components and to the covers will be maintained in the prototype design. Thus, a hybrid composite-aluminium enclosure will be developed and validated against the requirements fulfilled by the current full aluminium design. The aim is to reduce 40 % the weight of the covers made currently of anodized aluminium with electrically conductive bonding areas (Alodine 1200).'