TERAMICROSYS

Terahertz microsystems - Enabling the large-scale exploitation of the terahertz gap

 Coordinatore KUNGLIGA TEKNISKA HOEGSKOLAN 

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 Nazionalità Coordinatore Sweden [SE]
 Totale costo 1˙727˙189 €
 EC contributo 1˙727˙189 €
 Programma FP7-IDEAS-ERC
Specific programme: "Ideas" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
 Code Call ERC-2013-CoG
 Funding Scheme ERC-CG
 Anno di inizio 2014
 Periodo (anno-mese-giorno) 2014-04-01   -   2019-03-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    KUNGLIGA TEKNISKA HOEGSKOLAN

 Organization address address: Valhallavaegen 79
city: STOCKHOLM
postcode: 10044

contact info
Titolo: Dr.
Nome: Joachim
Cognome: Oberhammer
Email: send email
Telefono: +46 87906250
Fax: +46 8100858

SE (STOCKHOLM) hostInstitution 1˙727˙189.00
2    KUNGLIGA TEKNISKA HOEGSKOLAN

 Organization address address: Valhallavaegen 79
city: STOCKHOLM
postcode: 10044

contact info
Titolo: Mrs.
Nome: Erika
Cognome: Appel
Email: send email
Telefono: +46 87907786
Fax: +46 8100858

SE (STOCKHOLM) hostInstitution 1˙727˙189.00

Mappa


 Word cloud

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interfaces    micro    microsystems    submillimeter    thz    ghz    adaptive    links    unprecedented    microwave    building    sensors    medical    wave    blocks   

 Obiettivo del progetto (Objective)

'This project envisions the wide-spread use of THz technology in various applications in our society, which is enabled by the proposed THz microsystems, providing an unprecedented way of creating highly-integrated, volume-manufacturable, cost and energy-efficient, reconfigurable and thus adaptive submillimeter-wave and THz systems. Advanced three-dimensional micromachining is used as the key enabling fabrication technology. In connection with the technology convergence of advancing microwave semiconductor technology according to international technology programmes and roadmaps, the findings of this project are expected to comprise a significant contribution towards the large-scale exploitation of the heavily sought-after frequency space between 100 GHz and 1 THz, the so-called ‘terahertz gap’. Primary application fields with high impact of the proposed technology are wireless short-range communication links to interconnect future small-cell clouds replacing the current macro-basestation radio access network, and submillimeter-wave/THz sensing with application fields including medical diagnosis, food quality control, agriculture and industrial sensors. The proposed THz microsystems are based on rectangular waveguide-technology integrated into a multi-wafer stacked silicon substrate, which integrates all passive components needed for completing a submillimeter-wave/THz system around the monolithic-microwave integrated circuits (MMIC). Novel key building blocks investigated in this proposal include platform-integrated sensor and antenna interfaces, micro-electromechanically tuneable filters, phase-shifters, impedance-matching networks and non-galvanic microsystem-to-IC interfaces. The micro-mechanical reconfigurability enables unprecedented adaptive THz systems. Key outcomes of this project are proof-of-concept prototypes of all key building blocks up to 650 GHz, and of complete THz microsystems implemented for the two key applications telecom links and medical sensors.'

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