LASER-CONNECT

"Ultrafast laser processing of thin film interconnections in microelectronic, display, and photovoltaic applications"

 Coordinatore NATIONAL UNIVERSITY OF IRELAND, GALWAY 

 Organization address address: University Road -
city: GALWAY

contact info
Titolo: Mr.
Nome: Gerard
Cognome: O'connor
Email: send email
Telefono: +353 91 492513
Fax: +353 91 494594

 Nazionalità Coordinatore Ireland [IE]
 Totale costo 649˙269 €
 EC contributo 649˙269 €
 Programma FP7-PEOPLE
Specific programme "People" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
 Code Call FP7-PEOPLE-2009-IAPP
 Funding Scheme MC-IAPP
 Anno di inizio 2010
 Periodo (anno-mese-giorno) 2010-06-01   -   2014-05-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    NATIONAL UNIVERSITY OF IRELAND, GALWAY

 Organization address address: University Road -
city: GALWAY

contact info
Titolo: Mr.
Nome: Gerard
Cognome: O'connor
Email: send email
Telefono: +353 91 492513
Fax: +353 91 494594

IE (GALWAY) coordinator 440˙598.00
2    M-SOLV LTD

 Organization address address: OXONIAN PARK LANGFORD LOCKS
city: KIDLINGTON
postcode: OX5 1FP

contact info
Titolo: Dr.
Nome: Adam
Cognome: Brunton
Email: send email
Telefono: +44 (0)1865 844070
Fax: -+44 (0)1865 844071

UK (KIDLINGTON) participant 175˙791.00
3    M-Solv (HK) Limited

 Organization address address: LOCKHART ROAD 1 CHUNG NAM BUILDING
city: HONG KONG

contact info
Titolo: Mr.
Nome: Adrian
Cognome: Baughan
Email: send email
Telefono: +44 1865844070
Fax: -85225270235

HK (HONG KONG) participant 32˙880.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

boards    circuit    material    density    engaged    connect    thin    interactions    company    involving    electronics    tracks    laser    film   

 Obiettivo del progetto (Objective)

'Laser-Connect connects fundamental studies of ultrafast laser matter interactions with demand-driven high volume electronics production. The project is highly relevant to the development of new intelligent laser-based manufacturing systems in Europe targeting touch panel interactive screens, high density circuit boards for hand-held electronics, and other photovoltaic technologies. The project brings together a recently established high growth rate UK company engaged in laser systems development, its sister company engaged in system integration in Asia, and an Irish academic research group engaged in laser material ambient interactions. The objectives of the project are to generate improved understanding of laser-material interactions, develop new concepts in optical design and process control, and to demonstrate new processes for emerging thin film electronic materials and devices. The technical challenges of creating channels in thin film coatings on glass and flexible organic substrates, cutting tracks and drilling vias in high density multi-layer circuit boards, and etching isolation tracks for photovoltaics, over large areas, at high speed, with micron precision, are appreciable. The partners are committed to realising these goals by extensive knowledge transfer. Laser-Connect proposes 54 intersectoral fellowship months, with 40% involving early stage, 38% involving experienced and 22% involving more experienced researchers. Three researchers will be recruited to prepare and enhance impact of secondments. In addition to normal dissemination, the partners will communicate results at two regional workshops in years 2 and 4.'

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