Explore the words cloud of the R2POWER300 project. It provides you a very rough idea of what is the project "R2POWER300" about.
The following table provides information about the project.
|Coordinator Country||Italy [IT]|
|Total cost||8˙173˙781 €|
|EC max contribution||2˙060˙272 € (25%)|
1. H2020-EU.220.127.116.11. (ECSEL)
|Duration (year-month-day)||from 2015-07-01 to 2018-12-31|
Take a look of project's partnership.
|1||STMICROELECTRONICS SRL||IT (AGRATE BRIANZA)||coordinator||1˙451˙930.00|
|2||L.P.E. SPA||IT (BARANZATE MILANO)||participant||161˙759.00|
|3||CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LA NANOELETTRONICA||IT (BOLOGNA)||participant||97˙115.00|
|4||CONSIGLIO NAZIONALE DELLE RICERCHE||IT (ROMA)||participant||75˙403.00|
|5||NANO DESIGN SRO||SK (BRATISLAVA)||participant||68˙034.00|
|6||POLITECNICO DI TORINO||IT (TORINO)||participant||59˙067.00|
|7||UNIVERSITA DI PISA||IT (PISA)||participant||51˙442.00|
|8||Besi Netherlands BV||NL (DUIVEN)||participant||49˙681.00|
|9||PICOSUN OY||FI (ESPOO)||participant||28˙837.00|
|10||ASM EUROPE BV||NL (ALMERE)||participant||17˙000.00|
|11||ASM EUROPE BV||NL (ALMERE)||participant||0.00|
R2POWER300 is committed to challenge the following Objectives: • Development and manufacturing of a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) • Energy Efficiency and CO2 Reduction megatrends.
The project aims to achieve the following Goals: 1. Set the stage for the future extension to 300mm of the R2 Fab facility located in Agrate Brianza (Italy) - i.e. line’s specification, tools’ evaluation and screening, new process’s optimization and characterization, etc. 2. To evaluate, characterize and optimize the equipments and process necessary to achieve the new BCD10 technology, featuring 90nm lithography, at 300mm wafer size. BCD (i.e. Bipolar CMOS DMOS) is a unique smart power technology invented by ST in the mid ‘80s (CMOS’s gate length was 4 ïm at that time!). As of today BCD is one of the key technology assets of ST and the indefatigable evolution and challenging roadmap makes ST a world-class leader on smart power ICs. 3. Advanced System in Packages: some SiP activity will be performed, with specific reference to Sintering based die-attach, thermal analysis and dedicated packaging solution for high density ALD capacitors.
|D5.1.3 - Final dissemination report||Documents, reports||2019-09-06 08:42:09|
|D5.1.2 - Project dissemination plan||Documents, reports||2019-09-06 08:42:09|
|D5.1.1 - Project website online||Websites, patent fillings, videos etc.||2019-09-06 08:42:09|
Take a look to the deliverables list in detail: detailed list of R2POWER300 deliverables.
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The information about "R2POWER300" are provided by the European Opendata Portal: CORDIS opendata.
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