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COMPUSAPIEN SIGNED

Computing Server Architecture with Joint Power and Cooling Integration at the Nanoscale

Total Cost €

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EC-Contrib. €

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Partnership

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 COMPUSAPIEN project word cloud

Explore the words cloud of the COMPUSAPIEN project. It provides you a very rough idea of what is the project "COMPUSAPIEN" about.

density    realize    network    architectures    scalable    consumption    holistic    benefits    chip    predictive    architecture    cell    energy    subsystem    respect    worst    failures    grown    servers    3d    drastic    surge    controller    maximum    innovations    revise    overheating    revolution    savings    temperatures    integrate    effect    completely    supplied    computing    stack    champions    digital    reward    overcomes    prevailing    temperature    40    computation    risk    undesirable    server    foundations    breakthrough    core    combined    soaring    faster    microfluidic    dimensional    demand    limiting    semiconductor    scalability    last    paradigm    scaling    sustain    compusapien    heterogeneous    vision    fuel    brain    levels    supply    situation    cooling    dissipated    remaining    mammalian    joint    power    designs    inspired    guarantee    disruptive    software    computers    heat    evolution    collateral    provisioning    electronic    electrochemical    performance    template    cores    models   

Project "COMPUSAPIEN" data sheet

The following table provides information about the project.

Coordinator		 ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE 

Organization address
address: BATIMENT CE 3316 STATION 1
city: LAUSANNE
postcode: 1015
website: www.epfl.ch

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.
 Coordinator Country Switzerland [CH]
 Total cost 1˙999˙281 €
 EC max contribution 1˙999˙281 € (100%)
 Programme 1. H2020-EU.1.1. (EXCELLENT SCIENCE - European Research Council (ERC))
 Code Call ERC-2016-COG
 Funding Scheme ERC-COG
 Starting year 2017
 Duration (year-month-day) from 2017-06-01   to  2022-05-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE CH (LAUSANNE) coordinator 1˙999˙281.00

Map

 Project objective

The soaring demand for computing power in the last years has grown faster than semiconductor technology evolution can sustain, and has produced as collateral undesirable effect a surge in power consumption and heat density in computing servers. Although computing servers are the foundations of the digital revolution, their current designs require 30-40% of the energy supplied to be dissipated in cooling. The remaining energy is used for computation, but their complex many-core designs produce very high operating temperatures. Thus, operating all the cores continuously at maximum performance levels results in system overheating and failures. This situation is limiting the benefits of technology scaling.

The COMPUSAPIEN proposal aims to completely revise the current computing server architecture. In particular, inspired by the mammalian brain, this proposal targets to design a disruptive three-dimensional (3D) computing server architecture that overcomes the prevailing worst-case power and cooling provisioning paradigm for servers. This new 3D server design champions a heterogeneous many-core architecture template with an integrated on-chip microfluidic fuel cell network for joint cooling delivery and power supply. Also, it will include a novel predictive controller based on holistic power-temperature models, which exploit the server software stack to achieve energy-scalable computing capabilities. Because of its integrated electronic-electrochemical architecture design, COMPUSAPIEN is clearly a high-risk high-reward proposal that will bring drastic energy savings with respect to current server design approaches, and will guarantee energy scalability in future server architectures. To realize this vision, COMPUSAPIEN will develop and integrate breakthrough innovations in heterogeneous computing architectures, cooling-power subsystem design, combined microfluidic power delivery and temperature management in computers.

 Publications

year authors and title journal last update
List of publications.
2019 Benoit W. Denkinger, Flavio Ponzina, Soumya S. Basu, Andrea Bonetti, Szabolcs Balasi, Martino Ruggiero, Miguel Peon-Quiros, Davide Rossi, Andreas Burg, David Atienza
Impact of Memory Voltage Scaling on Accuracy and Resilience of Deep Learning Based Edge Devices
published pages: 1-1, ISSN: 2168-2356, DOI: 10.1109/mdat.2019.2947282 		IEEE Design & Test August 2019 2020-02-06
2019 Kawsar Haghshenas, Ali Pahlevan, Marina Zapater, Siamak Mohammadi, David Atienza
MAGNETIC: Multi-Agent Machine Learning-Based Approach for Energy Efficient Dynamic Consolidation in Data Centers
published pages: 1-1, ISSN: 1939-1374, DOI: 10.1109/tsc.2019.2919555 		IEEE Transactions on Services Computing 31 May 2019 2020-02-06
2018 Artem Aleksandrovich Andreev, Arvind Sridhar, Mohamed M. Sabry, Marina Zapater, Patrick Ruch, Bruno Michel, David Atienza
PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays
published pages: 73-85, ISSN: 0018-9340, DOI: 10.1109/tc.2017.2695179 		IEEE Transactions on Computers 67/1 2019-02-26
2018 Ali Pahlevan, Xiaoyu Qu, Marina Zapater, David Atienza
Integrating Heuristic and Machine-Learning Methods for Efficient Virtual Machine Allocation in Data Centers
published pages: 1667-1680, ISSN: 0278-0070, DOI: 10.1109/tcad.2017.2760517 		IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 37/8 2019-02-26
2018 Arman Iranfar, Marina Zapater, David Atienza
Machine Learning-Based Quality-Aware Power and Thermal Management of Multistream HEVC Encoding on Multicore Servers
published pages: 2268-2281, ISSN: 1045-9219, DOI: 10.1109/tpds.2018.2827381 		IEEE Transactions on Parallel and Distributed Systems 29/10 2019-03-01
2018 Arman Iranfar, Mehdi Kamal, Ali Afzali-Kusha, Massoud Pedram, David Atienza
TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-Chip
published pages: 1532-1545, ISSN: 0278-0070, DOI: 10.1109/tcad.2017.2768417 		IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 37/8 2019-02-26

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