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INSTET

Integral Security Trust Element for the Internet of Things

Total Cost €

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EC-Contrib. €

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Partnership

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Project "INSTET" data sheet

The following table provides information about the project.

Coordinator
INTRINSIC ID B.V. 

Organization address
address: HIGH TECH CAMPUS 9
city: EINDHOVEN
postcode: 5656 AE
website: www.intrinsic-id.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Netherlands [NL]
 Project website https://www.intrinsic-id.com/
 Total cost 71˙429 €
 EC max contribution 50˙000 € (70%)
 Programme 1. H2020-EU.3.7. (Secure societies - Protecting freedom and security of Europe and its citizens)
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-1-2016-2017
 Funding Scheme SME-1
 Starting year 2016
 Duration (year-month-day) from 2016-10-01   to  2017-03-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INTRINSIC ID B.V. NL (EINDHOVEN) coordinator 50˙000.00

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 Project objective

Intrinsic-ID is a Dutch SME, spin-off from Philips Research, and a world leader in security solutions for chips, with 25 patents. Intrinsic-ID has created a technology to uniquely identify and authenticate chips based on the inherent characteristics of their memory component (SRAM). This technology, a digital equivalent of a fingerprint, is called Physical Unclonable Function (PUF).

Intrinsic-ID is working on INSTET – a fully-fledged security solution on top of PUF that will protect low-end chips that are omnipresent in IoT devices everywhere by making them physically and cryptographically secure and extremely resilient to advanced attacks. INSTET will work as a Root of Trust, i.e. a set of core software components that are always trusted by the chip, and provide a trust foundation for the IoT device and distributed IoT systems.

INSTET addresses the core problem of semiconductor vendors and OEMs: lack of security. INSTET can be deployed on almost any chip, including the ones that are already in the field, without costly redesigns or additional hardware, generating savings of up to 35% per chip.

In this 6-month feasibility study, Intrinsic-ID will investigate the product/market fit and business model fit in three most promising vertical segments of the semiconductor industry (wearables, medical electronics and automotive), develop a go-to-market strategy and calculate costs of scaling up.

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The information about "INSTET" are provided by the European Opendata Portal: CORDIS opendata.

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