NPLC-LED

IMMERSION COOLING OF SUSPENDED AND COATED NANO-PHOSPHOR PARTICLES FOR ENHANCED THERMAL AND OPTICAL EXTRACTION OF LIGHT EMITTING DIODES FOR GENERAL ILLUMINATION

 Coordinatore Ozyegin University 

 Organization address address: NISANTEPE MAH ORMAN SOK 13
city: ALEMDAG CEKMEKOY ISTANBUL
postcode: 34794

contact info
Titolo: Dr.
Nome: Nilay
Cognome: Papila
Email: send email
Telefono: +90 216 564 95 68
Fax: +90 216 564 90 57

 Nazionalità Coordinatore Turkey [TR]
 Totale costo 100˙000 €
 EC contributo 100˙000 €
 Programma FP7-PEOPLE
Specific programme "People" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
 Code Call FP7-PEOPLE-2011-CIG
 Funding Scheme MC-CIG
 Anno di inizio 2012
 Periodo (anno-mese-giorno) 2012-06-01   -   2016-05-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    Ozyegin University

 Organization address address: NISANTEPE MAH ORMAN SOK 13
city: ALEMDAG CEKMEKOY ISTANBUL
postcode: 34794

contact info
Titolo: Dr.
Nome: Nilay
Cognome: Papila
Email: send email
Telefono: +90 216 564 95 68
Fax: +90 216 564 90 57

TR (ALEMDAG CEKMEKOY ISTANBUL) coordinator 100˙000.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

thermal    fluxes    chip    liquid    cooling    temperatures    air    light    phosphor    heat    introduction    leds    led   

 Obiettivo del progetto (Objective)

'The introduction of high brightness light emitting diodes (LEDs) with white light and monochromatic colors has allowed LED penetration into general illumination applications. The increased electrical currents used to drive these LEDs have resulted in high heat fluxes, often exceeding those for average silicon computer chips. The output of a typical HB LED is today over 100 lumens, achieved with heat fluxes in excess of 300 W/cm2. Thermal management is, thus, a critical technology for LED lighting. Much of the current LED thermal research and development is focusing on air cooling with heat sinks. While these approaches provide significant heat removal capability, they are constrained by the presence of multiple interface resistances and they cannot effectively address non-uniform chip temperatures and local phosphor hot spots. To overcome the limitations imposed by air cooling, this research will investigate the potential of direct liquid cooling to provide an additional thermal path for heat dissipated in the LEDs and phosphor layers. The introduction of topside liquid cooling with optically-transparent liquids is expected to dramatically reduce average chip temperatures and to improve the uniformity of chip and phosphor temperature, leading to higher light extraction efficiencies.'

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