MEMS MATURITY

MEMS Gyro - Maturity assessment of performance and integration

 Coordinatore TRONIC S MICROSYSTEMS SA 

 Organization address address: PRE DE L HORME 55
city: CROLLES
postcode: 38920

contact info
Titolo: Dr.
Nome: Stephane
Cognome: Renard
Email: send email
Telefono: 33476972950
Fax: 33476972951

 Nazionalità Coordinatore France [FR]
 Totale costo 763˙500 €
 EC contributo 572˙625 €
 Programma FP7-JTI
Specific Programme "Cooperation": Joint Technology Initiatives
 Code Call SP1-JTI-CS-2012-01
 Funding Scheme JTI-CS
 Anno di inizio 2012
 Periodo (anno-mese-giorno) 2012-12-03   -   2015-01-02

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    TRONIC S MICROSYSTEMS SA

 Organization address address: PRE DE L HORME 55
city: CROLLES
postcode: 38920

contact info
Titolo: Dr.
Nome: Stephane
Cognome: Renard
Email: send email
Telefono: 33476972950
Fax: 33476972951

FR (CROLLES) coordinator 572˙625.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

mechanical    soi    drie       performances    gt    cell    vacuum    si    material    thanks    manufacturing    silicon    tronics    critical    goals    environement    lt    stable    gyro    environment    maturity    lifetime    structures    gyrix    micro    thick    mems    sfwa    performance   

 Obiettivo del progetto (Objective)

'The program MEMS MATURITY has four goals: 1/ To miniaturize the high performance gyro cell, Gyrix, of the SFWA (Smart Fixed Wings Aircraft) partner 2/ To identify the critical paramaters of the process that influence the cell performance 3/ To assess the impact of the variability of the critical parameters on the cell performance 4/ To optimize the process for a repeatable manufacturing and to deliver 20 optimized Gyro cells to evaluate their performances in the sensor operational environment together with the SFWA partner.

To reach these goals, TRONICS will use and improve the best state-of-the-art technology for high-performance low-drift inertial sensors. Its main features are: • Mechanical structures achieved in thick (> 60 µm) single crystal material, starting from thick SOI substrate. • Mechanical structures etched, in the top thick SOI layer, using a notch-free, highly-vertical, accurate (<0.2 µm accuracy) Deep Reactive Ion Etching (DRIE) process, thanks to the latest generation of DRIE processes. • Wafer level packaging of the MEMS structure with a silicon cap, bonded through Silicon Direct Bonding, Si-Si or Si-SiO2-Si, avoiding any intermediate heterogeneous material such as a metal sealing. • Stable high-vacuum environment ensured thanks to long-term-stable high-vacuum (<10-3 mbar) ceramic package, including getter technology that maintain performance over the product lifetime (lifetime > 20 years). • Die-attach of the MEMS chip in the package with non-degasing metallic alloy preform, and stress decoupling structures.

TRONICS has defined a complete work plan to adress the main goals of the program. The overall final objective of this program is also to develop an industial manufacturing environement for the Gyrix cell object of this program. This environement should meet the performances needed for civil aeronautic applications. Durring this program, TRONICS will also improve the maturity of the Gyrix cell to bring it to a TRL5 level.'

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