GETPICS

Generic Technologies for WDM Transmitter Photonic Integrated Circuits

Coordinatore	III V LAB GIE    more  Organization address address: ROUTE DE NOZAY city: MARCOUSSIS postcode: 91460 contact info Titolo: Dr. Nome: Denis Cognome: Mazerolle Email: send email Telefono: +33 1 69 41 57 83
Nazionalità Coordinatore	France [FR]
Totale costo	718˙318 €
EC contributo	718˙318 €
Programma	FP7-PEOPLE Specific programme "People" implementing the Seventh Framework Programme of the European Community for research, technological development and demonstration activities (2007 to 2013)
Code Call	FP7-PEOPLE-2012-ITN
Funding Scheme	MC-ITN
Anno di inizio	2014
Periodo (anno-mese-giorno)	2014-01-01   -   2017-12-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	III V LAB GIE  Organization address address: ROUTE DE NOZAY city: MARCOUSSIS postcode: 91460 contact info Titolo: Dr. Nome: Denis Cognome: Mazerolle Email: send email Telefono: +33 1 69 41 57 83	FR (MARCOUSSIS)	coordinator	63˙211.48
2	TECHNISCHE UNIVERSITEIT EINDHOVEN  Organization address address: DEN DOLECH 2 city: EINDHOVEN postcode: 5612 AZ contact info Titolo: Ms. Nome: Suzanne Cognome: Udo Email: send email Telefono: +31 40 2475824 Fax: +31 40 2448375	NL (EINDHOVEN)	participant	655˙107.00

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 Obiettivo del progetto (Objective)

'The project aims at achieving the improvement of Photonic Integrated Circuit (PIC) building blocks (BBs) for generic integration technology, the design and fabrication of high bit-rate transmitter PICs, typically WDM 10x 25Gbps and 4x 25GBau Tx PIC as test vehicles for the deve-loped BBs, and finally the test and validation of the fabricated PICs in a transmission environment. The program addresses a significant step beyond the present state-of-the-art. To achieve these goals, both partners have adequate infrastructure and complementary means. Some challenging milestones will be set to be reached, such as deep UV stepper lithography; assessment of semi-insulating (SI)-substrate based technology; SAG (Selective Area Growth) epitaxy techniques; SiBH (Semi-Insulating Buried Hetero-structure); advanced RF (radio-frequency) circuit engineering. The test vehicles will be validated in transmission systems, and potential markets for the developed PICs will be explored.'