MERLIN
"Multi-Gigabit, Scalable & Energy Efficient on-board Digital Processors Employing Multi-core, Vertical, Embedded Opto-electronic Engines"
| Coordinatore | CONSTELEX TECHNOLOGY ENABLERS LTD
Organization address
address: Ikoniou 17 contact info |
| Nazionalità Coordinatore | Greece [EL] |
| Totale costo | 3˙614˙294 € |
| EC contributo | 2˙498˙998 € |
| Programma | FP7-SPACE
Specific Programme "Cooperation": Space |
| Code Call | FP7-SPACE-2013-1 |
| Funding Scheme | CP-FP |
| Anno di inizio | 2013 |
| Periodo (anno-mese-giorno) | 2013-10-02 - 2016-10-02 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
CONSTELEX TECHNOLOGY ENABLERS LTD
Organization address
address: Ikoniou 17 contact info |
EL (Athens) | coordinator | 517˙080.00 |
| 2 |
TEKNOLOGIAN TUTKIMUSKESKUS VTT
Organization address
address: TEKNIIKANTIE 4 A contact info |
FI (ESPOO) | participant | 520˙906.00 |
| 3 |
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK
Organization address
address: IM TECHNOLOGIEPARK 25 contact info |
DE (FRANKFURT (ODER)) | participant | 441˙902.00 |
| 4 |
CHALMERS TEKNISKA HOEGSKOLA AB
Organization address
address: - contact info |
SE (GOETEBORG) | participant | 390˙230.00 |
| 5 |
PHILIPS TECHNOLOGIE GMBH
Organization address
address: LUBECKERTORDAMM 5 contact info |
DE (HAMBURG) | participant | 265˙000.00 |
| 6 |
OFS FITEL DENMARK APS
Organization address
address: PRIORPARKEN 680 contact info |
DK (BRONDBY) | participant | 223˙545.00 |
| 7 |
THALES ALENIA SPACE FRANCE
Organization address
city: TOULOUSE contact info |
FR (TOULOUSE) | participant | 140˙335.00 |
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Obiettivo del progetto (Objective)
'New multi-beam Tera-scale capacity satellites will require a disruptive approach to address digital on-board processors that rely on electronics which consume space, power and cost and reach their capacity saturation. The disruptive solution must combine scalability, technical feasibility, power-efficiency and cost-effectiveness. MERLIN aims to provide this solution realizing multi-gigabit optical inter-connectivity with a unique combination of low-power and high-bandwidth multimode (MM) GaAs VCSEL/PDs, low power, radiation-hardened BiCMOS drivers and radiation-hardened multi-core fibers (MCFs). MERLIN will integrate these technologies on a space grade photonic integration capable to provide ruggedized transceiver modules with a record-high 150Gb/s throughput and 6mW/ Gb/s energy consumption which is a 3-fold improvement against state-of-the-art (SOTA) US-based products. MERLIN will fabricate the first >15GHz MCF-matched 850nm VCSELs operating at -40 to 100 oC and will drive energy consumption down to <200 fJ/bit (0.2 mW/Gb/s). MERLIN will demonstrate the first >30 GHz MM MCF-PDs with >0.6A/W responsivity. MERLIN will couple MCF-VCSELs/PDs to the first 6-core radiation-hard MM-MCF to offer the capability for single-feedthrough robust and hermetic module packaging. Fibers will be distributed through a monolithic fan-out avoiding the use and procurement of expensive connectors. MERLIN will develop the first 25 Gb/s 6-channel, driver/TIA ICs with record-low <2pJ/bit energy consumption in a 5-fold decrease against SOTA products. ICs will be fabricated with IHP 0.25μm SiGe BiCMOS process which is under ESA qualification. MERLIN will fabricate an opto-electronic 6x25 Gb/s capable ADC/DAC module using MCF optical interfaces and will test it in a full-scale optical interconnect breadboard demonstrator. Finally, MERLIN will perform space assessment tests on all the components to align development towards a European space qualifiable system.'