MiSPIA

Microelectronic Single-Photon 3D Imaging Arraysnfor low-light high-speed Safety and Security Applications

 Coordinatore POLITECNICO DI MILANO 

 Organization address address: Via Golgi 40
city: Milano
postcode: 20133

contact info
Titolo: Prof.
Nome: Franco
Cognome: Zappa
Email: send email
Telefono: 390224000000
Fax: 39022367604

 Nazionalità Coordinatore Italy [IT]
 Totale costo 3˙401˙019 €
 EC contributo 2˙632˙854 €
 Programma FP7-ICT
Specific Programme "Cooperation": Information and communication technologies
 Code Call FP7-ICT-2009-5
 Funding Scheme CP
 Anno di inizio 2010
 Periodo (anno-mese-giorno) 2010-06-01   -   2013-12-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    POLITECNICO DI MILANO

 Organization address address: Via Golgi 40
city: Milano
postcode: 20133

contact info
Titolo: Prof.
Nome: Franco
Cognome: Zappa
Email: send email
Telefono: 390224000000
Fax: 39022367604

IT (Milano) coordinator 0.00
2    CENTRO RICERCHE FIAT SCPA

 Organization address address: Strada Torino
city: ORBASSANO (TO)
postcode: 10043

contact info
Titolo: Dr.
Nome: Massimo
Cognome: Casali
Email: send email
Telefono: +39 011 9083492
Fax: +39 011 9083786

IT (ORBASSANO (TO)) participant 0.00
3    CF CONSULTING FINANZIAMENTI UNIONE EUROPEA SRL

 Organization address address: Via Giuseppe Mussi
city: MILANO
postcode: 20154

contact info
Titolo: Ms.
Nome: Carla
Cognome: Finocchiaro
Email: send email
Telefono: +30 02 310833 1
Fax: +39 02 33614064

IT (MILANO) participant 0.00
4    EMZA VISUAL SENSE LTD

 Organization address address: HAYOZMA ST 3 RD
city: KAFAR SABA
postcode: 44422

contact info
Titolo: Mr.
Nome: Eitan
Cognome: Ramati
Email: send email
Telefono: +972 97679333
Fax: +972 9 7653550

IL (KAFAR SABA) participant 0.00
5    FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V

 Organization address address: Hansastrasse
city: MUNCHEN
postcode: 80686

contact info
Titolo: Mr.
Nome: Christoph
Cognome: Schulte
Email: send email
Telefono: +49 89 12052728
Fax: +49 89 12057534

DE (MUNCHEN) participant 0.00
6    HERIOT-WATT UNIVERSITY

 Organization address address: Riccarton
city: EDINBURGH
postcode: EH14 4AS

contact info
Titolo: Dr.
Nome: Eva
Cognome: Olszewska-Day
Email: send email
Telefono: 441315000000
Fax: 441315000000

UK (EDINBURGH) participant 0.00
7    MICRO PHOTON DEVICES S.R.L.

 Organization address address: Via Stradivari
city: BOLZANO
postcode: 39100

contact info
Titolo: Dr.
Nome: Roberto
Cognome: Biasi
Email: send email
Telefono: +39 0471 051 212
Fax: +39 0471 501 524

IT (BOLZANO) participant 0.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

mispia    cameras    flight    nmispia    noisy    illuminated    fps    active    fast    pixels    time    single    smart    chip    sensitivity    photon    imager       intelligent    dimensional    cmos    pre    imaging    detectors    spad    ranging    imagers   

 Obiettivo del progetto (Objective)

MiSPIA will develop beyond state-of-the-art photonics technology for array imagers of smart-pixels able to detect single photons. Intelligent in-pixel pre-processing will simultaneously provide ultra high sensitivity (single-photon level), very high frame-rate (up to 200,000fps) and advanced multi-spectral (300-900nm) three-dimensional (3D) distance ranging and two-dimensional (2D) imaging of fast moving objects. MiSPIA detectors will be used in two key applications: long-range (200-1,000m) 2D and 3D active identification in low light level surveillance operations; and very fast (over 200fps) short-range (10-50m) 3D monitoring in automotive pre-crash safety systems. Instead of (slow and noisy) CCDs and CMOS active pixels (with poor sensitivity and noisy electronics), MiSPIA will exploit the ultimate performances of truly-single photon detectors: the Single-Photon Avalanche Diodes (SPAD).nMiSPIA imagers will be based on four different SPAD smart-pixels: 'photon-counting' pixels for 2D imaging; LIDAR pixels for 3D direct 'time-of-flight' (dTOF); two different phase-sensitive pixels for 3D indirect time-of-flight (iTOF) depth acquisitions. Full-size imager chips will be manufactured, characterized and eventually integrated into two 3D ranging cameras deployed into the two end-users applications for validation.nMiSPIA technologies will be both highly-advanced and cost-effective: a high-voltage 0.35µm CMOS processing for front-side illuminated imagers; and a new flipped-chip Silicon-on-Insulator (SOI) CMOS technology for back-side illuminated imagers. Both will prove beyond state-of-the art co-integration of photonic SPAD detectors and CMOS microelectronics for intelligent and dense 2D imaging and 3D ranging high-performance cameras. Such cameras will provide imaging at the quantum limit and on-chip pre-processing at the most effective speed at a drastic reduction of manufacturing costs, down to 5€ per imager chip.nThe developments of the MiSPIA Project will be published on the official website www.mispia.eu.

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