HIGHTECS

Development of High Temperature Survival Electronic Devices for Engine Control Systems

 Coordinatore GE AVIATION SYSTEMS LTD 

 Organization address address: Cheltenham Road
city: Bishops Cleeve
postcode: GL52 8SF

contact info
Titolo: Mr.
Nome: Joe
Cognome: Eyles
Email: send email
Telefono: +44 1638 675609
Fax: +44 1638 660628

 Nazionalità Coordinatore United Kingdom [UK]
 Totale costo 1˙436˙925 €
 EC contributo 704˙180 €
 Programma FP7-JTI
Specific Programme "Cooperation": Joint Technology Initiatives
 Code Call SP1-JTI-CS-2009-01
 Funding Scheme JTI-CS
 Anno di inizio 2010
 Periodo (anno-mese-giorno) 2010-01-01   -   2013-07-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    GE AVIATION SYSTEMS LTD

 Organization address address: Cheltenham Road
city: Bishops Cleeve
postcode: GL52 8SF

contact info
Titolo: Mr.
Nome: Joe
Cognome: Eyles
Email: send email
Telefono: +44 1638 675609
Fax: +44 1638 660628

UK (Bishops Cleeve) coordinator 329˙302.00
2    THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF OXFORD

 Organization address address: University Offices, Wellington Square
city: OXFORD
postcode: OX1 2JD

contact info
Titolo: Ms.
Nome: Alana
Cognome: Davies
Email: send email
Telefono: +44 1865 273747
Fax: +44 1865 273789

UK (OXFORD) participant 192˙232.00
3    General Electric Deutschland Holding GmbH

 Organization address address: Martin-Behaim str. 10
city: Neu-Isenburg
postcode: 63263

contact info
Titolo: Ms.
Nome: Manuela
Cognome: Abraham
Email: send email
Telefono: +49 89 5528 3208
Fax: 498955000000

DE (Neu-Isenburg) participant 182˙646.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

sensors    flight    soi    platform    units    conditioning    module    ehms    signal    special    fadec    fed    voltage    fuel    distributed    operation    integrity    temperatures    functionality    insulator    chip    celsius    components    adc    degrees    engine    hours    silicon    core    temperature    complexity    output    health    asic    digital    full    performance    supply    hightecs    near    recommended    aircraft    electronics    monitoring    electronic    sensor   

 Obiettivo del progetto (Objective)

'This proposal is concerned with the development of distributed high temperature electronics platform for integration with sensor elements to provide a high integrity serial digital data link that can be fed into FADEC (Full Authority Digital Electronic Control) and/or EHMS (Engine Health Monitoring System) units on an aircraft engine. To date most of the work undertaken and reported has been in the United States, which has concentrated on the development of high temperature electronic control systems, with high levels of functionality and more complex components, such as the Honeywell HTMOS products. This proposal aims to design and develop a lower cost distributed electronics platform with fir for purpose functionality that can be deployed close to the sensors and integrated into a miniature multi-chip module. The unit will be designed to provide signal conditioning for a range of sensor outputs and managing the signal to enable high integrity digital signal tranmission to the FADEC/EHMS units. The target long temperature of operation is 250oC for up to 5 years.'

Introduzione (Teaser)

Aircraft engine monitoring and control sensors are most useful when mounted near the engine core, but temperatures there are too high for the electronics. Exploitation of new silicon-on-insulator (SOI) technology may provide the solution.

Descrizione progetto (Article)

The electronics in the engine control unit, the brains of the full authority digital engine control (FADEC), are not rated for operation at very high temperatures and are located on the engine fan casing.. There is interest in placing electronics with sensors near to the engine core without special cooling systems.The use of high-temperature electronics would eliminate special fuel pumping, fuel interfacing and complex heat sinks required to do that.

Scientists explored the use of Silicon on Insulator (SOI) technology to overcome performance issues with silicon-based electronics at high temperatures. EU-funding of the project 'Development of high temperature survival electronic devices for engine control systems' (HIGHTECS) provided financial support.

The team developed a high-temperature electronics platform with engine sensor elements and signal conditioning capability. Analogue signals from on-engine sensors for temperature, strain and vibration were fed to an analogue-to-digital converter (ADC). A high-integrity digital output would be input to the FADEC and/or an engine health monitoring system for enhanced efficiency with reduced cabling and complexity. Targets were operating temperatures of 200 degrees Celsius and short-term up to 250 degrees Celsius, and 50 000 engine flight hours.

Matching temperature and voltage requirements for all the electronic components was quite complex. The ADC supplied to the project was sensitive to supply voltage and did not meet its own specifications. The voltages required to alleviate the discontinuities were above those recommended for the SOI application-specific integrated circuit (ASIC).

Redesign of the ASIC improved performance of the analogue sensor conditioning and frequency measurement components, but the ADC output was still not linear at the 5 V power supply voltage recommended for the SOI technology. Further research will address development of an ADC functioning well at the voltage required by the SOI ASIC. Long-term storage tests at 250 degrees Celsius confirmed that the longevity of the SOI device exceeded the targeted 50 000 hours for the flight temperature profiles provided.

HIGHTECS made important progress in development of a SOI high-temperature engine sensor platform complete with signal conditioning. Successful implementation will significantly reduce the weight and complexity of engine monitoring and control systems and enhance their reliability. In the meantime, custom ASIC and multi-chip module design methodologies and high-temperature electronics packaging technology provide important routes for exploiting project outcomes.

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