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FineSol

Assembly of miniaturized PCBs by using low cost hyper-fine solder powders

Total Cost €

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EC-Contrib. €

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Partnership

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Project "FineSol" data sheet

The following table provides information about the project.

Coordinator
ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS 

Organization address
address: CHARILAOU THERMI ROAD 6 KM
city: THERMI THESSALONIKI
postcode: 57001
website: www.certh.gr

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Greece [EL]
 Project website http://www.finesol.org
 Total cost 6˙148˙635 €
 EC max contribution 4˙959˙450 € (81%)
 Programme 1. H2020-EU.2.1.5.1. (Technologies for Factories of the Future)
 Code Call H2020-FoF-2015
 Funding Scheme IA
 Starting year 2015
 Duration (year-month-day) from 2015-11-01   to  2019-04-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS EL (THERMI THESSALONIKI) coordinator 723˙875.00
2    ATOMISING SYSTEMS LIMITED UK (SHEFFIELD) participant 450˙625.00
3    INSTITUTO DE SOLDADURA E QUALIDADE PT (PORTO SALVO) participant 443˙337.00
4    EKTOS TESTING & RELIABILITY SERVICE AS DK (KOBENHAVN) participant 440˙410.00
5    MAT-TECH BV NL (SON EN BREUGEL) participant 415˙065.00
6    CENTER FOR TECHNOLOGY RESEARCH ANDINNOVATION (CETRI) LTD CY (LIMASSOL) participant 400˙750.00
7    RISE RESEARCH INSTITUTES OF SWEDEN AB SE (BORAS) participant 369˙500.00
8    MICROSEMI SEMICONDUCTOR LIMITED UK (GWENT) participant 333˙375.00
9    POLMECANIC GROUP SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA PL (SKOMLIN) participant 265˙475.00
10    ABIS SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA SPK PL (RZASKA) participant 253˙400.00
11    Prisma Electronics ABEE EL (ALEXANDROUPOLIS) participant 242˙375.00
12    APPLIED MATERIALS ITALIA SRL IT (SAN BAGIO DI CALLALTA) participant 217˙000.00
13    EUROPEAN FEDERATION FOR WELDING JOINING AND CUTTING BE (BRUXELLES) participant 207˙562.00
14    CREATIVE NANO PC EL (PERISTERI) participant 196˙700.00

Map

 Project objective

The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double component density will be achieved. Consequently, this would effectively enable more than a doubling of the functions available on electronic devices such as cell phones, satellite navigation systems, health devices etc. The successful completion of the FineSol project would lift the ultra-miniaturisation/functionality road block and also enable reduction in raw material usage, reduction in WEEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.

 Deliverables

List of deliverables.
Presentation of dissemination material Documents, reports 2020-02-12 08:53:01
Project website Websites, patent fillings, videos etc. 2020-02-12 08:53:00

Take a look to the deliverables list in detail:  detailed list of FineSol deliverables.

 Publications

year authors and title journal last update
List of publications.
2017 TBS
\"\"\"IIW International Conference (by Prof Luisa Coutinho)\"\"\"
published pages: , ISSN: , DOI:
2020-02-12
2017 TBS
IAB WG Inspection, Qualification and Certification of Welders, Genoa, Italy
published pages: , ISSN: , DOI:
2020-02-12
2016 TBS
EWF General Assembly
published pages: , ISSN: , DOI:
2020-02-12
2018 TBS
Going Green - CARE INNOVATION 2018
published pages: , ISSN: , DOI:
2020-02-12
2018 TBS
SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2018, /Towards miniaturization of electronics by developing and characterizing hyperfine solder powders used in printed circuit boards
published pages: , ISSN: , DOI:
2020-02-12
2016 TBS
IIW-International Institute of Welding - 69th Annual Assembly and International Conference
published pages: , ISSN: , DOI:
2020-02-12
2016 TBS
13th International Conference on Nanosciences & Nanotechnologies-NN16
published pages: , ISSN: , DOI:
2020-02-12
2017 TBS
Printed Electronics USA 2018
published pages: , ISSN: , DOI:
2020-02-12
2016 TBS
IAB-IIW Members Meeting
published pages: , ISSN: , DOI:
2020-02-12
2017 TBS
EFFRA Project Event and Impact Workshop
published pages: , ISSN: , DOI:
2020-02-12
2018 TBS
16th International Conference on Nanosciences & Nanoechnologies-NN18 Characterization of Hyperfine Solder Powders used for Miniaturized Electronics
published pages: , ISSN: , DOI:
2020-02-12
2018 TBS
Printed Electronics EUROPE 2018
published pages: , ISSN: , DOI:
2020-02-12
2017 TBS
EFFRA’s Factories of the Future Community Day (flyer distribution)
published pages: , ISSN: , DOI:
2020-02-12
2017 TBS
15th International Conference on Nanosciences & Nanoechnologies-NN17 (booth and presentation)
published pages: , ISSN: , DOI:
2020-02-12
2018 TBS
III FPGA Symposium, poster session. Presentaion of Finesol to show future change in miniaturization
published pages: , ISSN: , DOI:
2020-02-12
2017 TBS
Euronanoforum 2017
published pages: , ISSN: , DOI:
2020-02-12
2016 TBS
21st Edition of the Workshop on Electromagnetic,Nondestructive Evaluation (distribution of flyer)
published pages: , ISSN: , DOI:
2020-02-12
2018 TBS
Project Presentation at ASR Joining Event
published pages: , ISSN: , DOI:
2020-02-12
2018 TBS
Printed Electronics USA 2018
published pages: , ISSN: , DOI:
2020-02-12
2016 TBS
EFFRA\'s Factories of the Future Conference 2016
published pages: , ISSN: , DOI:
2020-02-12
2018 TBS
IDTechEx Show EUROPE - Masterclass in Advanced Screen Printing in PE Applications
published pages: , ISSN: , DOI:
2020-02-12

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The information about "FINESOL" are provided by the European Opendata Portal: CORDIS opendata.

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