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Caladan SIGNED

Micro assembled Terabit/s capable optical transceivers for Datacom applications

Total Cost €

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EC-Contrib. €

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Partnership

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 Caladan project word cloud

Explore the words cloud of the Caladan project. It provides you a very rough idea of what is the project "Caladan" about.

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Project "Caladan" data sheet

The following table provides information about the project.

Coordinator
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM 

Organization address
address: KAPELDREEF 75
city: LEUVEN
postcode: 3001
website: www.imec.be

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Belgium [BE]
 Total cost 6˙624˙737 €
 EC max contribution 5˙846˙728 € (88%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2018-2
 Funding Scheme IA
 Starting year 2019
 Duration (year-month-day) from 2019-01-01   to  2022-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) coordinator 2˙547˙368.00
2    IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK DE (FRANKFURT ODER) participant 1˙012˙500.00
3    X-CELEPRINT LIMITED IE (DUBLIN) participant 485˙625.00
4    UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK IE (Cork) participant 471˙506.00
5    INNOLUME GMBH DE (DORTMUND) participant 355˙162.00
6    FICONTEC SERVICE GMBH DE (ACHIM) participant 323˙925.00
7    MELLANOX TECHNOLOGIES LTD - MLNX IL (YOKNEAM) participant 322˙953.00
8    EV GROUP E. THALLNER GMBH AT (ST FLORIAN AM INN) participant 256˙375.00
9    XILINX IRELAND UNLIMITED COMPANY IE (DUBLIN) participant 71˙312.00

Map

 Project objective

Data centers which underpin the Cloud are under pressure. As the capacity of data center servers is growing, so must the capacity of the links between those servers. Industry foresees a need for high volumes of 800Gb/s and 1.6Tb/s transceivers by 2025. Today, despite the use of complex Photonic Integrated Circuits (PICs), manufacturing an optical transceiver still requires a large number of sequential steps. This is because lasers and electronic chips need to be assembled on a piece-by-piece basis onto the PIC. The resulting optical engine then needs to be coupled to a fiber array and packaged. These steps are done sequentially, creating a bottleneck in the manufacturing line which makes it hard to scale up production and reduce cost. CALADAN will demonstrate how integration of lasers and electronics onto a PIC can be done fully at the wafer-level using the established micro transfer printing technique, thus eliminating this bottleneck. GaAs quantum dot lasers and 130nm SiGe BiCMOS 56Gbaud capable driver and receiver electronics will be transfer printed onto Silicon Photonic 300mm wafers. Starting from proven concepts in PIXAPP, a novel fast fiber attachment process will be demonstrated that reduces the time required for fiber attachment by an order of magnitude. Using these techniques, transceiver cost will be 0.1Euro/Gb/s for volumes of at least 1,000,000 units. The consortium, which consists of three SMEs (X-Celeprint, Innolume and ficonTEC), an LE (EVGroup), three research institutes (IMEC, Tyndall and IHP), a transceiver manufacturer (Mellanox) and a multinational (Xilinx) encompasses all the partners to start production of the targeted optical transceivers after the end of the project. Exploitation of the technology will be supported by an end-user (British Telecom), a semiconductor foundry setting up a micro transfer printing Pilot Line (MICROPRINCE, X-FAB), an optical equipment manufacturer (ADVA) and the European Photonic Industry Consortium (EPIC).

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The information about "CALADAN" are provided by the European Opendata Portal: CORDIS opendata.

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