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PIN3S SIGNED

Pilot Integration of 3nm Semiconducter technology

Total Cost €

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EC-Contrib. €

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Partnership

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 PIN3S project word cloud

Explore the words cloud of the PIN3S project. It provides you a very rough idea of what is the project "PIN3S" about.

more    realize    ecsel    university    world    overlay    structures    supplying    suppliers    covers    volume    fraunhofer    3d    hospital    approximately    15    2018    pin3s    solutions    industry    asml    ahead    developers    form    bases    defects    materials    thermo    technologies    ambition    complemented    memory    logic    realizing    netherland    size    repair    kti    electronics    care    manufacturers    tools    ju    power    semiconductor    ic    creation    metrology    pilot    leadership    institutes    node    mobility    efficient    evaluation    security    introduction    innovations    twente    miniaturization    fisher    section    mask    societal    euv    lithography    cooperation    integration    class    communication    annual    migrate    germany    components    network    imec    nanoscale    heidelberg    deal    delft    involvement    builds    zeiss    nova    3nm    energy    strategic    tu    plan    maintaining    universities    safety    health    manufacturing    performance   

Project "PIN3S" data sheet

The following table provides information about the project.

Coordinator
ASML NETHERLANDS B.V. 

Organization address
address: DE RUN 6501
city: VELDHOVEN
postcode: 5504DR
website: www.asml.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Netherlands [NL]
 Total cost 119˙581˙291 €
 EC max contribution 26˙787˙918 € (22%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call H2020-ECSEL-2018-1-IA-two-stage
 Funding Scheme ECSEL-IA
 Starting year 2019
 Duration (year-month-day) from 2019-10-01   to  2022-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    ASML NETHERLANDS B.V. NL (VELDHOVEN) coordinator 4˙500˙000.00
2    CARL ZEISS SMT GMBH DE (OBERKOCHEN) participant 5˙913˙176.00
3    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 5˙734˙108.00
4    BERLINER GLAS KGAA HERBERT KUBATZ GMBH & CO DE (BERLIN) participant 1˙422˙687.00
5    KLA-Tencor MIE GmbH DE (Weilburg) participant 1˙164˙750.00
6    APPLIED MATERIALS ISRAEL LTD IL (REHOVOT) participant 984˙188.00
7    UNIVERSITEIT TWENTE NL (ENSCHEDE) participant 975˙166.00
8    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 903˙068.00
9    PRODRIVE TECHNOLOGIES BV NL (SON) participant 828˙750.00
10    NOVA MEASURING INSTRUMENTS LTD IL (REHOVOT) participant 796˙478.00
11    SIOUX CCM BV NL (NUENEN) participant 703˙930.00
12    FEI ELECTRON OPTICS BV NL (EINDHOVEN) participant 690˙250.00
13    KLA-TENCOR CORPORATION (ISRAEL) IL (MIGDAL HAEMEK) participant 368˙550.00
14    ION BEAM SERVICES FR (ROUSSET) participant 265˙795.00
15    COVENTOR SARL FR (VILLEBON SUR YVETTE) participant 259˙696.00
16    TECHNISCHE UNIVERSITEIT DELFT NL (DELFT) participant 241˙652.00
17    VDL ETG TECHNOLOGY & DEVELOPMENT BV NL (EINDHOVEN) participant 233˙870.00
18    PFEIFFER VACUUM FR (ANNECY) participant 196˙909.00
19    SCIA SYSTEMS GMBH DE (CHEMNITZ) participant 157˙644.00
20    SOLMATES BV NL (ENSCHEDE) participant 151˙437.00
21    APPLIED MATERIALS BELGIUM BE (LEUVEN) participant 116˙875.00
22    RECIF TECHNOLOGIES FR (Blagnac) participant 99˙108.00
23    REDEN B.V. NL (HENGELO OV) participant 79˙827.00
24    UNIVERSITATEA POLITEHNICA DIN BUCURESTI RO (BUCHAREST) participant 0.00

Map

 Project objective

The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable to deal with 3D structures, defects analysis, overlay and feature size evaluation. Each of these objectives will be achieved by cooperation between key European equipment developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KTI involved with their suppliers, involvement of a strong knowledge network based on Universities of Germany, Heidelberg University Hospital, and the Netherland, TU Delft and the University of Twente, complemented with key Technology Institutes such as imec and Fraunhofer. The project addresses Section 15 “Electronics Components & Systems Process Technology, Equipment, Materials and Manufacturing”, Major Challenge 4 “Maintaining world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and Major Challenge 1 “Developing advanced logic and memory technology for nanoscale integration and application-driven performance” of the ECSEL JU Annual Work Plan 2018. As set out in the Multi Annual Strategic Plan 2018, PIn3S addresses the ambition for the European Equipment & Manufacturing industry for advanced semiconductor technologies to lead the world in miniaturization by supplying new equipment and materials approximately two years ahead of introduction of volume production of advanced semiconductor manufacturers. With the results of the Pin3S project the consortium builds on realizing IC manufacturers to migrate to the 3nm Technology node which enables a class of new products which have more functionality, more performance and are more power efficient. As such it will form the bases for innovations yet to come enabling solutions that address the societal challenges in communication, mobility, health care, security, energy and safety & security.

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The information about "PIN3S" are provided by the European Opendata Portal: CORDIS opendata.

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