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TWILIGHT SIGNED

Towards the neW era of 1.6 Tb/s System-In-Package transceivers for datacenter appLIcations exploiting wafer-scale co-inteGration of InP membranes and InP-HBT elecTronics

Total Cost €

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EC-Contrib. €

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Partnership

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 TWILIGHT project word cloud

Explore the words cloud of the TWILIGHT project. It provides you a very rough idea of what is the project "TWILIGHT" about.

latency    20um    drivers    112g    asics    optical    airflow    smaller    interfacing    gratings    functionalities    speeds    selective    emls    800gbe    created    packaging    2025    serdes    modules    analog    echelle    soas    tias    dci    linear    assembly    dictated    wafer    exploited    fuelling    transceiver    multiplexers    sag    utc    layerstack    technologies    iot    industrial    72    components    demonstrators    huge    exhibiting    10km    interleaving    110ghz    de    50    speed    cooling    realization    twilight    chip    band    electronics    unleash    bonding    combination    cloud    pi    40km    membranes    consumption    savings    100gb    switches    ultra    gb    servers    start    co    pluggables    power    89    massive    respectively    datacentre    leverage    5g    close    platform    bandwidth    accuracy    cope    4x4    2013    100ghz    distances    space    mlnx    ratification    keep    unprecedently    transceivers    lt    and16x16    polarization    6t    112gbaud    engines    pace    traffic    standards    performance    lane    packaged    operators    optoelectronic    optics    interconnectivity    footprint    insensitive    generation    inp    nanosecond    paving    photodiodes    capacity    area    gt    market    74    sip    400gbe    hbt   

Project "TWILIGHT" data sheet

The following table provides information about the project.

Coordinator
INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS 

Organization address
address: Patission Str. 42
city: ATHINA
postcode: 10682
website: www.iccs.gr

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Greece [EL]
 Total cost 5˙080˙621 €
 EC max contribution 5˙080˙621 € (100%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2019-2
 Funding Scheme RIA
 Starting year 2019
 Duration (year-month-day) from 2019-12-01   to  2023-11-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS EL (ATHINA) coordinator 798˙750.00
2    TECHNISCHE UNIVERSITEIT EINDHOVEN NL (EINDHOVEN) participant 1˙505˙065.00
3    III-V LAB FR (PALAISEAU CEDEX) participant 990˙532.00
4    MELLANOX TECHNOLOGIES LTD - MLNX IL (YOKNEAM) participant 649˙400.00
5    ARGOTECH AS CZ (NACHOD) participant 616˙500.00
6    KUNGLIGA TEKNISKA HOEGSKOLAN SE (STOCKHOLM) participant 520˙373.00

Map

 Project objective

IoT, 5G and cloud applications have created a huge growth of datacentre traffic fuelling the market of 400GbE and the ratification of 800GbE and 1.6T standards expected within 2013-2025. Datacentre operators must keep pace with the increasing speeds and to cope with the increasing power consumption required for airflow management and cooling. Moreover, they must address the massive interconnectivity between servers and switches dictated by 5G ultra-low latency applications. 100Gb/s per lane is the next step for the realization of 800GbE modules but this will be the end of pluggables and the start of co-packaged optics with ASICs paving the way to 1.6T and beyond. TWILIGHT aims to bring InP membranes and InP-HBT electronics at unprecedently close distances (<20um) to unleash the speed capabilities of its high performance components and to enable 112Gbaud per lane. Wafer-scale bonding together with high-accuracy assembly and co-packaging concepts, TWILIGHT’s optoelectronic engines will be capable of up to 1.6T capacity. Selective area growth will be exploited to develop C-band and O-band EMLs and UTC photodiodes in combination with echelle gratings on the same system-on-chip platform. Adaptation of the SAG layerstack will be used to develop polarization insensitive SOAs enabling complex functionalities on chip. TWILIGHT will leverage analog bandwidth interleaving for interfacing its transceivers with next generation 112G SERDES and will develop analog (de)multiplexers, >110GHz linear drivers and 100GHz TIAs. TWILIGHT will exploit the PI-SOAs to develop 4x4 and16x16 optical space switches exhibiting nanosecond latency and >50% smaller footprint. The O-band and C-band SiP transceiver demonstrators leverage up to 72% and 74% power consumption savings compared to established technologies and target the datacentre market (2-10km) and DCI (<40km), respectively, with estimated cost 0.89€/Gb/s. Exploitation of TWILIGHT’s technologies is aimed via its industrial partner MLNX.

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The information about "TWILIGHT" are provided by the European Opendata Portal: CORDIS opendata.

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