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SEER SIGNED

A “Smart” Self-monitoring composite tool for aerospace composite manufacturing using Silicon photonic multi-sEnsors Embedded using through-thickness Reinforcement techniques

Total Cost €

EC-Contrib. €

Partnership

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SEER project word cloud

Explore the words cloud of the SEER project. It provides you a very rough idea of what is the project "SEER" about.

effort minimise reuse resin theoretical establishing time cycles data reliability prototype optimise near models yield circuit quality refractive composite fingerprint maintenance seer link structural optimisation curing pic sensor perfectly preventive sensors itself temperature unprecedented optimising miniature index integrity cater embedding acquired photonic thickness manufacturing self solution infrared material learning algorithms tool comprise parts compatible monitoring alteration reusable cured raw tools smart efficiency save pressure techniques efficient degradation machine

Project "SEER" data sheet

The following table provides information about the project.

Coordinator	INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS Organization address address: Patission Str. 42 city: ATHINA postcode: 10682 website: www.iccs.gr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Greece [EL]
Total cost	5˙962˙311 €
EC max contribution	5˙089˙284 € (85%)
Programme	1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
Code Call	H2020-ICT-2019-2
Funding Scheme	IA
Starting year	2020
Duration (year-month-day)	from 2020-01-01 to 2022-12-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS Organization address address: Patission Str. 42 city: ATHINA postcode: 10682 website: www.iccs.gr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	EL (ATHINA)	coordinator	715˙860.00
2	TWI LIMITED TWI LIMITED Organization address address: GRANTA PARK GREAT ABINGTON city: CAMBRIDGE postcode: CB21 6AL website: www.twi.co.uk contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (CAMBRIDGE)	participant	706˙225.00
3	BRUNEL UNIVERSITY LONDON BRUNEL UNIVERSITY LONDON Organization address address: KINGSTON LANE city: UXBRIDGE postcode: UB8 3PH website: www.brunel.ac.uk contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (UXBRIDGE)	participant	591˙875.00
4	LOIRETECH INGENIERIE LOIRETECH INGENIERIE Organization address address: 9 RUE DU MOULIN CASSE POLE INDUSTRIEL JULES VERNE city: BOUGUENAIS postcode: 44340 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (BOUGUENAIS)	participant	572˙733.00
5	ARGOTECH AS ARGOTECH AS Organization address address: HOLUBOVA 978 city: NACHOD postcode: 547 01 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	CZ (NACHOD)	participant	506˙275.00
6	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	498˙062.00
7	AERNNOVA ENGINEERING DIVISION SAU AERNNOVA ENGINEERING DIVISION SAU Organization address address: CALLE LEONARDO DA VINCI MINANO SN city: VITORIA GASTEIZ postcode: 1510 website: www.aernnova.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	ES (VITORIA GASTEIZ)	participant	406˙805.00
8	CRANFIELD UNIVERSITY CRANFIELD UNIVERSITY Organization address address: College Road city: CRANFIELD - BEDFORDSHIRE postcode: MK43 0AL website: www.cranfield.ac.uk contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (CRANFIELD - BEDFORDSHIRE)	participant	399˙948.00
9	ENGINEERING TECHNOLOGY SOLUTIONS EE ENGINEERING TECHNOLOGY SOLUTIONS EE Organization address address: DOMOKOY 15 city: GERAKAS postcode: 153 44 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	EL (GERAKAS)	participant	343˙000.00
10	AIRTIFICIAL AEROSPACE & DEFENSE SAU AIRTIFICIAL AEROSPACE & DEFENSE SAU Organization address address: CALLE INGENIERIA 4, TECNOPARQUE BAHIA DE CADIZ CARRETERA DE SANLUCAR DE BARRAMEDA, KM 5,5 city: PUERTO DE SANTA MARIA CADIZ postcode: 11500 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	ES (PUERTO DE SANTA MARIA CADIZ)	participant	208˙250.00
11	ELLINIKI ENOSI FOTONIKIS ASTIKI MIKERDOSKOPIKI ETAIRIA ELLINIKI ENOSI FOTONIKIS ASTIKI MIKERDOSKOPIKI ETAIRIA Organization address address: KOLOKOTRONI 8 city: ATHINA postcode: 10561 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	EL (ATHINA)	participant	140˙250.00

Map

Project objective

SEER aims to develop smart self-monitoring composite tools, able to measure process and material parameters and, thus, to provide real-time process control with unprecedented reliability. SEER consortium will achieve this by: 1) developing miniature photonic sensors, 2) embedding those sensors in the tool with through-the-thickness techniques which minimise alteration of the structural integrity of the tool itself and 3) optimising the manufacturing control system through the implementation of a prototype process monitoring, optimisation, and process control unit.

SEER will adopt a multi-sensor approach that will comprise a temperature, a refractive index, and a pressure sensor, operating in the near infrared and all integrated on a miniature photonic integrated circuit (PIC). The SEER solution will be compatible with and optimise existing composite manufacturing methods and its reuse for several resin curing cycles will increase efficiency and save resources. The embedded PIC sensors in a reusable tool will cater perfectly to address pre-processing and will use acquired raw data for process optimisation, using theoretical models and machine learning algorithms, establishing for each tool a link between the sensor data, material state models, process parameters, as well as degradation of the tool. This will allow efficient preventive maintenance of the tool with less effort and provide insight on better tool design. Finally, the acquired data from quality testing of cured parts will be used to optimise the process control ensuring further enhance in the quality yield and will provide with a part quality fingerprint.

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The information about "SEER" are provided by the European Opendata Portal: CORDIS opendata.