3D-HIPMAS

Pilot Factory for 3D High Precision MID Assemblies

 Coordinatore HAHN-SCHICKARD-GESELLSCHAFT FUER ANGEWANDTE FORSCHUNG E.v. 

 Organization address address: WILHELM-SCHICKARD-STRASSE 10
city: Villingen
postcode: 78052

contact info
Titolo: Ms.
Nome: Anke
Cognome: Ihle-Benz
Email: send email
Telefono: +49 711 685 84777

 Nazionalità Coordinatore Germany [DE]
 Sito del progetto http://www.3d-hipmas.eu/
 Totale costo 5˙350˙276 €
 EC contributo 3˙499˙600 €
 Programma FP7-NMP
Specific Programme "Cooperation": Nanosciences, Nanotechnologies, Materials and new Production Technologies
 Code Call FP7-2012-NMP-ICT-FoF
 Funding Scheme CP-FP
 Anno di inizio 2012
 Periodo (anno-mese-giorno) 2012-10-01   -   2015-09-30

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    HAHN-SCHICKARD-GESELLSCHAFT FUER ANGEWANDTE FORSCHUNG E.v.

 Organization address address: WILHELM-SCHICKARD-STRASSE 10
city: Villingen
postcode: 78052

contact info
Titolo: Ms.
Nome: Anke
Cognome: Ihle-Benz
Email: send email
Telefono: +49 711 685 84777

DE (Villingen) coordinator 721˙750.00
2    ASSOCIATION POLE EUROPEEN DE PLASTURGIE

 Organization address address: RUE PIERRE ET MARIE CURIE 2
city: BELLIGNAT
postcode: 1100

contact info
Titolo: Ms.
Nome: Dominique
Cognome: Abeille
Email: send email
Telefono: +33 4 74 81 92 92

FR (BELLIGNAT) participant 485˙100.00
3    PHOTONIC SCIENCE LIMITED

 Organization address address: MILLHAM MOUNTFIELD
city: ROBERTSBRIDGE
postcode: TN32 5LA

contact info
Titolo: Mr.
Nome: Daniel Frederic Alexandre
Cognome: Brau
Email: send email
Telefono: +44 1 580 88 11 99

UK (ROBERTSBRIDGE) participant 411˙441.00
4    HAECKER AUTOMATION GMBH

 Organization address address: INSELSBERGSTRASSE 17
city: SCHWARZHAUSEN
postcode: 99891

contact info
Titolo: Mr.
Nome: Uwe
Cognome: Schulz
Email: send email
Telefono: +49 36259 300 0

DE (SCHWARZHAUSEN) participant 349˙495.00
5    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

 Organization address address: RUE LEBLANC 25
city: PARIS 15
postcode: 75015

contact info
Titolo: Mr.
Nome: Yves
Cognome: Hussenot
Email: send email
Telefono: +33 4 3878 3226
Fax: +33 4 3878 5132

FR (PARIS 15) participant 325˙066.00
6    LPKF LASER & ELECTRONICS AG

 Organization address address: OSTERIEDE 7
city: GARBSEN
postcode: 30827

contact info
Titolo: Dr.
Nome: Roman
Cognome: Ostholt
Email: send email
Telefono: 49513200000000
Fax: 495132000000

DE (GARBSEN) participant 300˙108.00
7    RADIALL

 Organization address address: Rue Philibert Hoffmann 101
city: Rosny Sous Bois
postcode: 93116

contact info
Titolo: Mrs.
Nome: Emilie
Cognome: Fond
Email: send email
Telefono: +33 4 76 50 00 57

FR (Rosny Sous Bois) participant 228˙903.00
8    RAYCE SARL

 Organization address address: RUE ALEXANDRE FREUND 3
city: SAINT-LOUIS
postcode: 68300

contact info
Titolo: Mrs.
Nome: Silvia
Cognome: Cestaro
Email: send email
Telefono: +33 4 72 44 67 58

FR (SAINT-LOUIS) participant 181˙357.00
9    Phonak AG

 Organization address address: Laubisruetistrasse 28
city: Staefa
postcode: 8712

contact info
Titolo: Dr.
Nome: Erdal
Cognome: Karamuk
Email: send email
Telefono: +41 58 928 86 62

CH (Staefa) participant 163˙633.00
10    PLASTIPOLIS

 Organization address address: Rue Pierre et Marie Curie 180
city: OYONNAX
postcode: 1115

contact info
Titolo: Mr.
Nome: Patrick
Cognome: Vuillermoz
Email: send email
Telefono: +33 4 74 12 19 23

FR (OYONNAX) participant 113˙076.00
11    ENSINGER GMBH

 Organization address address: RUDOLF DIESEL STRASSE 8
city: NUFRINGEN
postcode: 71154

contact info
Nome: Steffani
Cognome: Kollinger
Email: send email
Telefono: +49 7032 819620

DE (NUFRINGEN) participant 110˙200.00
12    PRAGMA INDUSTRIES SAS

 Organization address address: RUE DE BASSILOUR DEPOT ANNE 665
city: BIDART
postcode: 64210

contact info
Titolo: Mr.
Nome: Pierre
Cognome: Forte
Email: send email
Telefono: 33559512755

FR (BIDART) participant 109˙471.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

parts    plastics    factory    electronics    integration    micro    tracks    circuitry    molded    manufacturing    technologies    precision    combine    assembly    directly    quality    converging    electrical    components    mid    plastic    moulded    conductive    mids    industry    pilot   

 Obiettivo del progetto (Objective)

'Due to the high potential of miniaturization and integration, with regard to the innovation degree, quality and sustainability requirements, the 21st century looks forward to the integration of new functions on plastic parts to produce smart plastic products, as markets are requiring traceability, security, communication as well as ergonomics. So called “Molded Interconnected Devices” (MID) basically combine all the features of molded plastic parts with electrical conductive circuitry and electronics components assembly directly on the plastic packaging. MID lead finally to highly integrated multimaterial and multifunctional 3D compact systems. With a 20% of growth per year since 2008, MID is the tomorrow’s converging technology for electronics and plastics. To achieve advanced high precision and high quality 3D micro systems, the EU industry is facing the following MIDs bottlenecks: - to be able to manufacture high precision 3D micro-parts integration plastics and electronics, including 3D plastic system carrier, 3D-conductive tracks and 3D electronics component assembly - to be able to reduce the manufacturing cost by 50% in order for EU industry to be competitive with low-wage countries, - to provide the industry with reliable, robust and in-line controlled manufacturing processes for plastics and electronics converging technologies. 3D-HiPMAS will overcome these challenges by providing the EU industry with a pilot factory based on 4 key technological building blocks enabling the manufacturing of low costs and high precision 3D multi-materials parts: A. 3D high precision plastics micro-parts B. 3D high definition conductive tracks C. 3D precision electronics components assembly D. 3D reliable and robust online monitoring and quality inspection system E. These 4 technologies will be integrated in order to launch the future EU pilot factory The consortium is composed of all key actors from the value chain, from the material manufacturer to the end-user'

Introduzione (Teaser)

Moulded Interconnect Devices (MIDs) combine all the features of moulded plastic parts with electrical circuitry and electronic components assembled directly on the plastic package.

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