HYPERSOL

Environmentally Sustainable Manufacturing of Ultra-Functional Miniaturised Consumer Electronics Using Hyper-Fine Solder Powders

 Coordinatore ATOMISING SYSTEMS LIMITED 

 Organization address address: 371 COLEFORD ROAD
city: SHEFFIELD
postcode: S95NF

contact info
Titolo: Dr.
Nome: Paul
Cognome: Rose
Email: send email
Telefono: 441143000000
Fax: 441143000000

 Nazionalità Coordinatore United Kingdom [UK]
 Totale costo 1˙851˙225 €
 EC contributo 1˙374˙975 €
 Programma FP7-SME
Specific Programme "Capacities": Research for the benefit of SMEs
 Code Call FP7-SME-2010-1
 Funding Scheme BSG-SME
 Anno di inizio 2010
 Periodo (anno-mese-giorno) 2010-12-01   -   2013-07-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    ATOMISING SYSTEMS LIMITED

 Organization address address: 371 COLEFORD ROAD
city: SHEFFIELD
postcode: S95NF

contact info
Titolo: Dr.
Nome: Paul
Cognome: Rose
Email: send email
Telefono: 441143000000
Fax: 441143000000

UK (SHEFFIELD) coordinator 78˙900.01
2    MILTECH HELLAS AE

 Organization address address: METAXA STREET 90
city: PEANIA
postcode: 19002

contact info
Titolo: Mr.
Nome: John
Cognome: Spanoudakis
Email: send email
Telefono: 302107000000
Fax: 302107000000

EL (PEANIA) participant 342˙925.00
3    Prisma Electronics ABEE

 Organization address address: Dimokratias Avenue 87
city: ALEXANDROUPOLIS
postcode: 68100

contact info
Titolo: Mr.
Nome: Serafim
Cognome: Katsikas
Email: send email
Telefono: 302109000000
Fax: 302109000000

EL (ALEXANDROUPOLIS) participant 342˙925.00
4    ABIS SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA SPK

 Organization address address: UL. KAMIENNA 17
city: RZASKA
postcode: 30 199

contact info
Titolo: Mr.
Nome: Piotr
Cognome: Bistro?
Email: send email
Telefono: 48124295508
Fax: 48124295508

PL (RZASKA) participant 232˙325.00
5    BOLUDA DIVISION INDUSTRIAL SL

 Organization address address: "CALLE JOIERS, VIAL A, NAVE 9 17-19"
city: PALAU SOLITA I PLEGAMANS
postcode: 8184

contact info
Titolo: Mr.
Nome: Fransesc
Cognome: Martinez
Email: send email
Telefono: 34938644942
Fax: 34608105046

ES (PALAU SOLITA I PLEGAMANS) participant 181˙044.24
6    BIZESP LTD

 Organization address address: OXFORD CENTRE FOR INNOVATION - MILL STREET
city: OXFORD
postcode: OX2 OJX

contact info
Titolo: Mr.
Nome: David
Cognome: Bridgland
Email: send email
Telefono: +44 1865 811142
Fax: +44 1865 793165

UK (OXFORD) participant 158˙855.75
7    POLMECANIC Sp. z o.o.

 Organization address address: ul. 18 Stycznia 16
city: WIELUN
postcode: 98-300

contact info
Titolo: Mr.
Nome: Adam
Cognome: Bokwa
Email: send email
Telefono: 48605065665
Fax: 48605065665

PL (WIELUN) participant 26˙000.00
8    Surface Technology International Limited

 Organization address address: Osborn Way
city: Hook
postcode: RG27 9HX

contact info
Titolo: Mrs.
Nome: Sue
Cognome: Knight
Email: send email
Telefono: 441257000000
Fax: 441257000000

UK (Hook) participant 12˙000.00
9    BRUNEL UNIVERSITY

 Organization address address: Kingston Lane
city: UXBRIDGE
postcode: UB83PH

contact info
Titolo: Ms.
Nome: Teresa
Cognome: Waller
Email: send email
Telefono: 441895000000
Fax: 441895000000

UK (UXBRIDGE) participant 0.00
10    ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS

 Organization address address: CHARILAOU THERMI ROAD 6 KM
city: THERMI THESSALONIKI
postcode: 57001

contact info
Titolo: Prof.
Nome: Elias
Cognome: Houstis
Email: send email
Telefono: 302421000000
Fax: 302421000000

EL (THERMI THESSALONIKI) participant 0.00
11    KENTRO EREVNAS TECHNOLOGIAS KAI ANAPTYXIS THESSALIAS

 Organization address address: TECHNOLOGIKO PARKO A VIPE
city: VOLOS
postcode: 38500

contact info
Titolo: Prof.
Nome: Elias
Cognome: Houstis
Email: send email
Telefono: 302421000000
Fax: 302421000000

EL (VOLOS) participant 0.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

ultra    raw    pastes    functionality    material    demand    asia    computer    weee    block    density    road    solder    hypersol    competition    pcb    electronics    miniaturisation    reduce    quantity    industry   

 Obiettivo del progetto (Objective)

'The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fuelled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. Achievement of these twin drivers can reduce raw material requirements, reduce WEEE and deliver a competitive edge to the European industry, moving it up the value chain to high value added and high margin products. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. Hypersol aims to deliver solder pastes with solder spheres <10μ to enable PCB manufacturers to more than double the component density on the PCB. In layman’s terms, this would effectively enable more than a doubling of the functions available on your cell phone, satellite navigation system, MP3 player and of course the ubiquitous lap top computer which could soon become a palm top computer. The successful completion of the HYPERSOL project would lift the ultra-miniaturisation/functionality road block and in the process also enable reduction in raw material usage, reduction in WEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.'

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