MSP
Multi-Sensor-Platform for Smart Building Management
| Coordinatore | Materials Center Leoben Forschung GmbH
Organization address
address: Roseggerstrasse 12 contact info |
| Nazionalità Coordinatore | Austria [AT] |
| Totale costo | 18˙113˙023 € |
| EC contributo | 12˙505˙467 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2013-10 |
| Funding Scheme | CP |
| Anno di inizio | 2013 |
| Periodo (anno-mese-giorno) | 2013-09-01 - 2016-08-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
Materials Center Leoben Forschung GmbH
Organization address
address: Roseggerstrasse 12 contact info |
AT (Leoben) | coordinator | 0.00 |
| 2 |
ALBERT-LUDWIGS-UNIVERSITAET FREIBURG
Organization address
address: FAHNENBERGPLATZ contact info |
DE (FREIBURG) | participant | 0.00 |
| 3 |
AMS AG
Organization address
address: TOBELBADERSTRASSE 30 contact info |
AT (UNTERPREMSTAETTEN) | participant | 0.00 |
| 4 |
AppliedSensor GmbH
Organization address
address: GERHARD KINDLER STRASSE 8 contact info |
DE (REUTLINGEN) | participant | 0.00 |
| 5 |
BOSCHMAN TECHNOLOGIES BV
Organization address
address: STENOGRAAF 3 contact info |
NL (DUIVEN) | participant | 0.00 |
| 6 |
CAMBRIDGE CMOS SENSORS LIMITED
Organization address
address: ST ANDREWS STREET, ST ANDREWS HOUSE 59 contact info |
UK (CAMBRIDGE) | participant | 0.00 |
| 7 |
EV GROUP E. THALLNER GMBH
Organization address
address: DI ERICH THALLNER STRASSE 1 contact info |
AT (ST. FLORIAN AM INN) | participant | 0.00 |
| 8 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
DE (MUNCHEN) | participant | 0.00 |
| 9 |
SAMSUNG ELECTRONICS (UK) LIMITED
Organization address
address: SAMSUNG HOUSE - 1000 HILLSWOOD DRIVE contact info |
UK (CHERTSEY - SURREY) | participant | 0.00 |
| 10 |
SIEMENS AKTIENGESELLSCHAFT
Organization address
address: Wittelsbacherplatz 2 contact info |
DE (MUENCHEN) | participant | 0.00 |
| 11 |
STICHTING IMEC NEDERLAND
Organization address
address: HIGH TECH CAMPUS 31 contact info |
NL (EINDHOVEN) | participant | 0.00 |
| 12 |
THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE
Organization address
address: The Old Schools, Trinity Lane contact info |
UK (CAMBRIDGE) | participant | 0.00 |
| 13 |
THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF OXFORD
Organization address
address: University Offices, Wellington Square contact info |
UK (OXFORD) | participant | 0.00 |
| 14 |
THE UNIVERSITY OF WARWICK
Organization address
address: Kirby Corner Road - University House contact info |
UK (COVENTRY) | participant | 0.00 |
| 15 |
UNIVERSITA DEGLI STUDI DI BRESCIA
Organization address
address: Piazza Del Mercato 15 contact info |
IT (BRESCIA) | participant | 0.00 |
| 16 |
UNIVERSITE CATHOLIQUE DE LOUVAIN
Organization address
address: Place De L'Universite 1 contact info |
BE (LOUVAIN-LA-NEUVE) | participant | 0.00 |
| 17 |
VLAAMSE INSTELLING VOOR TECHNOLOGISCH ONDERZOEK N.V.
Organization address
address: Boeretang 200 contact info |
BE (MOL) | participant | 0.00 |
Mappa
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Obiettivo del progetto (Objective)
The concept of the MSP project is based on a multi-project wafer approach that enables the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The central objective of the MSP-project is the development of a technology and manufacturing platform for the 3D-integration of sophisticated components and sensors with CMOS technology being the sound foundation for cost efficient mass fabrication.nThe MSP project is focused on the development of essential components and sensors that are required for the realization of miniaturized smart systems capable for indoor and outdoor environmental monitoring:n Gas sensors for detection of potentially harmful or toxic gasesn Sensors for particulate matter and ultrafine particlesn Development of metamaterial based IR sensors for presence and fire detectionn Development of optimized IR detectors based on SOI thermopilesn Development of highly efficient photovoltaics and piezoelectrics for energy harvestingn Development of light sensor and UV-A/B sensors.nThe rigorous employment of Through-Silicon-Via technology enables a highly flexible 'plug-and play' 3D-integration of these components and sensors to miniaturized smart systems with significantly advanced functionalities. The goal of the MSP project is the development of a smart multi-sensor platform for distributed sensor networks in Smart Building Management, which are able to communicate with smart phones.nThe MSP project covers the heterogeneous integration of KETs and contributes to reinforce European industrial leadership through miniaturization, performance increase and manufacturability of innovative smart systems. The MSP project is focused on emerging innovative technologies and processes for customer needs with a special emphasis on SMEs to enable their take up of KETs for competitive, highly performing product development.
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