MSP

Multi-Sensor-Platform for Smart Building Management

 Coordinatore Materials Center Leoben Forschung GmbH 

 Organization address address: Roseggerstrasse 12
city: Leoben
postcode: 8700

contact info
Titolo: Prof.
Nome: Reinhold
Cognome: Ebner
Email: send email
Telefono: 43384245922
Fax: 43384200000000

 Nazionalità Coordinatore Austria [AT]
 Totale costo 18˙113˙023 €
 EC contributo 12˙505˙467 €
 Programma FP7-ICT
Specific Programme "Cooperation": Information and communication technologies
 Code Call FP7-ICT-2013-10
 Funding Scheme CP
 Anno di inizio 2013
 Periodo (anno-mese-giorno) 2013-09-01   -   2016-08-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    Materials Center Leoben Forschung GmbH

 Organization address address: Roseggerstrasse 12
city: Leoben
postcode: 8700

contact info
Titolo: Prof.
Nome: Reinhold
Cognome: Ebner
Email: send email
Telefono: 43384245922
Fax: 43384200000000

AT (Leoben) coordinator 0.00
2    ALBERT-LUDWIGS-UNIVERSITAET FREIBURG

 Organization address address: FAHNENBERGPLATZ
city: FREIBURG
postcode: 79085

contact info
Titolo: Dr.
Nome: Olena
Cognome: Yurchenko
Email: send email
Telefono: +49 7612034781
Fax: +49 76120397562

DE (FREIBURG) participant 0.00
3    AMS AG

 Organization address address: TOBELBADERSTRASSE 30
city: UNTERPREMSTAETTEN
postcode: 8141

contact info
Nome: Christian
Cognome: Siller
Email: send email
Telefono: +43 3136 500 100

AT (UNTERPREMSTAETTEN) participant 0.00
4    AppliedSensor GmbH

 Organization address address: GERHARD KINDLER STRASSE 8
city: REUTLINGEN
postcode: 72770

contact info
Titolo: Ms.
Nome: Nicole
Cognome: Stiegler
Email: send email
Telefono: +49 7121 5148617

DE (REUTLINGEN) participant 0.00
5    BOSCHMAN TECHNOLOGIES BV

 Organization address address: STENOGRAAF 3
city: DUIVEN
postcode: 6921 EX

contact info
Titolo: Mr.
Nome: Frank
Cognome: Boschman
Email: send email
Telefono: +31 26 3194900
Fax: 3126319499

NL (DUIVEN) participant 0.00
6    CAMBRIDGE CMOS SENSORS LIMITED

 Organization address address: ST ANDREWS STREET, ST ANDREWS HOUSE 59
city: CAMBRIDGE
postcode: CB2 3BZ

contact info
Titolo: Ms.
Nome: Jones
Cognome: Wendy
Email: send email
Telefono: +44 1223 321905

UK (CAMBRIDGE) participant 0.00
7    EV GROUP E. THALLNER GMBH

 Organization address address: DI ERICH THALLNER STRASSE 1
city: ST. FLORIAN AM INN
postcode: 4782

contact info
Titolo: Mr.
Nome: Paul
Cognome: Lindner
Email: send email
Telefono: +43 7712 5311 0

AT (ST. FLORIAN AM INN) participant 0.00
8    FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V

 Organization address address: Hansastrasse 27C
city: MUNCHEN
postcode: 80686

contact info
Titolo: Ms.
Nome: Andrea
Cognome: Zeumann
Email: send email
Telefono: +49 89 1205 2723
Fax: +49 89 1205 7534

DE (MUNCHEN) participant 0.00
9    SAMSUNG ELECTRONICS (UK) LIMITED

 Organization address address: SAMSUNG HOUSE - 1000 HILLSWOOD DRIVE
city: CHERTSEY - SURREY
postcode: KT16 0PS

contact info
Titolo: Mr.
Nome: Seungjin
Cognome: Lee
Email: send email
Telefono: +44 1784 428600
Fax: +44 1784 428610

UK (CHERTSEY - SURREY) participant 0.00
10    SIEMENS AKTIENGESELLSCHAFT

 Organization address address: Wittelsbacherplatz 2
city: MUENCHEN
postcode: 80333

contact info
Titolo: Mr.
Nome: Andres
Cognome: Santamaria
Email: send email
Telefono: 498964000000

DE (MUENCHEN) participant 0.00
11    STICHTING IMEC NEDERLAND

 Organization address address: HIGH TECH CAMPUS 31
city: EINDHOVEN
postcode: 5656 AE

contact info
Titolo: Mr.
Nome: Gerold
Cognome: van der Heijde
Email: send email
Telefono: 31404020437
Fax: +314040 20 699

NL (EINDHOVEN) participant 0.00
12    THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE

 Organization address address: The Old Schools, Trinity Lane
city: CAMBRIDGE
postcode: CB2 1TN

contact info
Titolo: Mrs.
Nome: Renata
Cognome: Schaeffer
Email: send email
Telefono: 441224000000

UK (CAMBRIDGE) participant 0.00
13    THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF OXFORD

 Organization address address: University Offices, Wellington Square
city: OXFORD
postcode: OX1 2JD

contact info
Titolo: Ms.
Nome: Gill
Cognome: Wells
Email: send email
Telefono: +44 1865 289800
Fax: +44 1865 289801

UK (OXFORD) participant 0.00
14    THE UNIVERSITY OF WARWICK

 Organization address address: Kirby Corner Road - University House
city: COVENTRY
postcode: CV4 8UW

contact info
Titolo: Dr.
Nome: Peter
Cognome: Hedges
Email: send email
Telefono: +44 2476 523859

UK (COVENTRY) participant 0.00
15    UNIVERSITA DEGLI STUDI DI BRESCIA

 Organization address address: Piazza Del Mercato 15
city: BRESCIA
postcode: 25121

contact info
Titolo: Dr.
Nome: Elena
Cognome: Corini
Email: send email
Telefono: 390304000000
Fax: 390303000000

IT (BRESCIA) participant 0.00
16    UNIVERSITE CATHOLIQUE DE LOUVAIN

 Organization address address: Place De L'Universite 1
city: LOUVAIN-LA-NEUVE
postcode: 1348

contact info
Titolo: Prof.
Nome: Denis
Cognome: Flandre
Email: send email
Telefono: +32 10472540
Fax: +32 10472598

BE (LOUVAIN-LA-NEUVE) participant 0.00
17    VLAAMSE INSTELLING VOOR TECHNOLOGISCH ONDERZOEK N.V.

 Organization address address: Boeretang 200
city: MOL
postcode: 2400

contact info
Titolo: Mr.
Nome: Jan
Cognome: Theunis
Email: send email
Telefono: +32 14335372
Fax: +32 14321183

BE (MOL) participant 0.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

kets    nthe    smart    sensor    miniaturized    platform    sensors    technologies    integration    components    ir    efficient    innovative    msp   

 Obiettivo del progetto (Objective)

The concept of the MSP project is based on a multi-project wafer approach that enables the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The central objective of the MSP-project is the development of a technology and manufacturing platform for the 3D-integration of sophisticated components and sensors with CMOS technology being the sound foundation for cost efficient mass fabrication.nThe MSP project is focused on the development of essential components and sensors that are required for the realization of miniaturized smart systems capable for indoor and outdoor environmental monitoring:n Gas sensors for detection of potentially harmful or toxic gasesn Sensors for particulate matter and ultrafine particlesn Development of metamaterial based IR sensors for presence and fire detectionn Development of optimized IR detectors based on SOI thermopilesn Development of highly efficient photovoltaics and piezoelectrics for energy harvestingn Development of light sensor and UV-A/B sensors.nThe rigorous employment of Through-Silicon-Via technology enables a highly flexible 'plug-and play' 3D-integration of these components and sensors to miniaturized smart systems with significantly advanced functionalities. The goal of the MSP project is the development of a smart multi-sensor platform for distributed sensor networks in Smart Building Management, which are able to communicate with smart phones.nThe MSP project covers the heterogeneous integration of KETs and contributes to reinforce European industrial leadership through miniaturization, performance increase and manufacturability of innovative smart systems. The MSP project is focused on emerging innovative technologies and processes for customer needs with a special emphasis on SMEs to enable their take up of KETs for competitive, highly performing product development.

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