PHASTFlex

Photonic Hybrid ASsembly Through FLEXible waveguides

Coordinatore	TECHNISCHE UNIVERSITEIT EINDHOVEN    more  Organization address address: DEN DOLECH 2 2 city: EINDHOVEN contact info Titolo: Mr. Nome: Alfons Cognome: Bruekers Email: send email Telefono: +31 40 247 5824 Fax: +31 40 244 8375
Nazionalità Coordinatore	Netherlands [NL]
Totale costo	3˙884˙010 €
EC contributo	2˙795˙000 €
Programma	FP7-ICT Specific Programme "Cooperation": Information and communication technologies
Code Call	FP7-ICT-2013-11
Funding Scheme	CP
Anno di inizio	2014
Periodo (anno-mese-giorno)	2014-01-01   -   2016-12-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	TECHNISCHE UNIVERSITEIT EINDHOVEN  Organization address address: DEN DOLECH 2 2 city: EINDHOVEN contact info Titolo: Mr. Nome: Alfons Cognome: Bruekers Email: send email Telefono: +31 40 247 5824 Fax: +31 40 244 8375	NL (EINDHOVEN)	coordinator	0.00
2	AIFOTEC AG  Organization address address: HOLZMARKT 5 city: JENA contact info Nome: Gunther Cognome: Vollrath Email: send email Telefono: 4936940000000	DE (JENA)	participant	0.00
3	FICONTEC SERVICE GMBH  Organization address address: DESMASTRASSE 3-5 city: ACHIM contact info Titolo: Dr. Nome: Moritz Cognome: Seyfried Email: send email Telefono: +49 42025116027 Fax: 4942030000000	DE (ACHIM)	participant	0.00
4	IMST GMBH  Organization address address: CARL-FRIEDRICH-GAUSS-STRASSE 2 city: KAMP-LINTFORT contact info Titolo: Mr. Nome: Rens Cognome: Baggen Email: send email Telefono: +49 2842981326	DE (KAMP-LINTFORT)	participant	0.00
5	LIONIX BV  Organization address address: HENGELOSESTRAAT 500 city: ENSCHEDE contact info Titolo: Dr. Nome: Arne Cognome: Leinse Email: send email Telefono: 31532030053 Fax: 31535011303	NL (ENSCHEDE)	participant	0.00
6	Oclaro Technology Limited  Organization address address: Caswell city: Towcester contact info Titolo: Prof. Nome: Michael Cognome: Wale Email: send email Telefono: +44 1327 356560 Fax: +44 1327 356389	UK (Towcester)	participant	0.00
7	TECHNISCHE UNIVERSITEIT DELFT  Organization address address: STEVINWEG 1 city: DELFT contact info Titolo: Mrs Nome: Lily Cognome: Tunggal Email: send email Telefono: +31 15 27 88684	NL (DELFT)	participant	0.00
8	TELNET REDES INTELIGENTES SA  Organization address address: CALLE BUENOS AIRES 18 city: LA MUELA contact info Titolo: Mr. Nome: San Millán Benito Cognome: Jose Victor Email: send email Telefono: +34 976 141 800	ES (LA MUELA)	participant	0.00
9	WILLOW PHOTONICS LTD  Organization address address: WAPPENHAM ROAD ABTHORPE 4 city: TOWCESTER contact info Titolo: Dr. Nome: David Cognome: Robbins Email: send email Telefono: +44 1327 857795	UK (TOWCESTER)	participant	0.00
10	XIO PHOTONICS BV  Organization address address: HENGELOSESTRAAT 705 city: ENSCHEDE contact info Titolo: Dr. Nome: Geuzebroek Cognome: Douwe Email: send email Telefono: +31 53 483 6688	NL (ENSCHEDE)	participant	0.00

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 Obiettivo del progetto (Objective)

PHASTFLEX proposes the development of a fully automated, high precision, cost-effective assembly technology for next generation hybrid photonic packages. In hybrid packages, multiple Photonic ICs (PICs) are assembled, combining the best of different material platforms for a wide range of applications and performance. In PHASTFlex, InP PICs with active functions are combined with passive TriPleX PICs.PIC fabrication can now be done in a generic foundry-based process, bringing PIC cost within the scope of many applications (~10-100€). However, current assembly and packaging technology leads to custom-engineered solutions; packaging is an order of magnitude more expensive, and this, is a major bottle-neck to market penetration. The EU Photonics21's SRA calls 'new approaches to packaging' a key challenge.The most demanding assembly task for multi-port PICs is the high-precision (±0.1μm) alignment and fixing of waveguides. PHASTFlex proposes an innovative concept, in which the waveguides in the TriPleX PIC are released during fabrication to make them movable. Actuators and fixing functions, integrated in the same PIC, place and fix the flexible waveguides in the optimal position (peak out-coupled power).The project aims to develop a complete assembly process and tooling to implement this concept, including pre-assembly using solder reflow and automated handling, and on-chip micro-fabricated fine-alignment and fixing functions. Fully automated cost-effective and high-performance solutions will also encourage photonic packaging to be carried out in EU economies. Proof of the concept will be given by assembly of prototypes for end-user applications.The consortium consists of 9 partners (7 industrial, of which 2 provide applications, 2 are universities), and are all recognised leading industrial and research entities in the photonics components and systems industry. The project duration is 36 months, the total cost is ~3.9M€, the requested EU contribution is ~2.8M