Opendata, web and dolomites

METRO4-3D

Metrology for future 3D-technologies

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

Project "METRO4-3D" data sheet

The following table provides information about the project.

Coordinator
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM 

Organization address
address: KAPELDREEF 75
city: LEUVEN
postcode: 3001
website: www.imec.be

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Belgium [BE]
 Project website http://www.metro4-3d.eu/
 Total cost 3˙349˙813 €
 EC max contribution 2˙689˙035 € (80%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2015
 Funding Scheme IA
 Starting year 2016
 Duration (year-month-day) from 2016-02-01   to  2019-01-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) coordinator 1˙137˙903.00
2    CAPRES AS DK (KGS. LYNGBY) participant 301˙875.00
3    DANMARKS TEKNISKE UNIVERSITET DK (KGS LYNGBY) participant 300˙473.00
4    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 249˙221.00
5    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 246˙325.00
6    MATERIALS CENTER LEOBEN FORSCHUNG GMBH AT (LEOBEN) participant 234˙136.00
7    ION-TOF TECHNOLOGIES GMBH DE (MUNSTER) participant 117˙600.00
8    PVA TEPLA ANALYTICAL SYSTEMS GMBH DE (WESTHAUSEN) participant 101˙500.00
9    EIDGENOSSISCHE MATERIALPRUFUNGS- UND FORSCHUNGSANSTALT CH (DUBENDORF) participant 0.00
10    LAM RESEARCH BELGIUM BE (LEUVEN) participant 0.00

Map

 Project objective

Within the food chain of equipment delivery for the semiconductor industry, Europe has kept a very strong position in the metrology area with many companies establishing themselves as main leaders in the field. Hence in line with the objectives of the ICT25 call for innovation action to overcome the (initial) barriers for the successful commercialization of novel European products, this project aims at exploring for a number of metrology solutions their technological readiness, reliability and relevance of the developed protocols, and the COO. The portfolio within the project covers new metrology concepts addressing specifically the processing challenges linked to 3D-Devices and range from probing basic layer properties (composition, electrical properties) in FEOL to control of metallization in BEOL up to issues linked to die stacking. Due to the specific processing steps which need to be addressed, three separate metrology tools will be assessed in this project i.e a Tofsims system (IonTOF) with build-in Scanning Probe stage and FIB column for true 3D-composition profiling, a completely automated micro-Hall and sheet resistance measurement tool (Capres) with additional capabilities for measurements on dedicated test structures (prior to full BEOL) and an GHz acoustic Microscope (Tepla) for probing voids in TSV’s and stacked dies. As some of them (IonTOf, Capres) are addressing partly complementary information (composition versus electrical properties), their co-existence in this project creates additional value as beyond the tool assessment also a methodology based on combining these concepts can be explored and certified. Moreover a significant efficiency gain is created as they can employ similar test structures and devices. For each of these tools, the basic metrology concepts are existing and validated in the lab on selected applications but their general applicability field within the semiconductor industry still needs to be established

 Deliverables

List of deliverables.
Report on organized training on the instrument Documents, reports 2019-10-03 10:47:52
Report 2 on dissemination activities Documents, reports 2019-10-03 10:47:52
Summary of the access time on the instruments Documents, reports 2019-10-03 10:47:52
Set-up of the website and strategic board Websites, patent fillings, videos etc. 2019-10-03 10:47:52
Report documenting the detailed technical specifications of the individual components Documents, reports 2019-10-03 10:47:52
Report on dissemination activities Documents, reports 2019-10-03 10:47:52

Take a look to the deliverables list in detail:  detailed list of METRO4-3D deliverables.

 Publications

year authors and title journal last update
List of publications.
2017 Eva Grünwald, René Hammer, Jördis Rose, Bernhard Sartory, Roland Brunner
Accretion Detection via Scanning Acoustic Microscopy in Microelectronic Components - Considering Symmetry Breaking Effects
published pages: 1466-1467, ISSN: 1431-9276, DOI: 10.1017/S1431927617007991
Microscopy and Microanalysis 23/S1 2019-10-03

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "METRO4-3D" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "METRO4-3D" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.)

EuConNeCts4 (2019)

European Conferences on Networks and Communications (EuCNC)

Read More  

RADON (2019)

Rational decomposition and orchestration for serverless computing

Read More  

INNODEC (2019)

Innovation Radar Data-based Identification & Commercialisation

Read More