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NECOMADA SIGNED

Nano-Enabled Conducting Materials Accelerating Device Applicability

Total Cost €

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EC-Contrib. €

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Partnership

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Project "NECOMADA" data sheet

The following table provides information about the project.

Coordinator
CENTRE FOR PROCESS INNOVATION LIMITED LBG 

Organization address
address: WILTON CENTRE WILTON
city: REDCAR CLEVELAND
postcode: TS10 4RF
website: www.uk-cpi.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country United Kingdom [UK]
 Project website http://necomada.eu/
 Total cost 8˙101˙378 €
 EC max contribution 6˙820˙288 € (84%)
 Programme 1. H2020-EU.2.1.2. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies)
 Code Call H2020-NMBP-PILOTS-2016
 Funding Scheme IA
 Starting year 2017
 Duration (year-month-day) from 2017-01-01   to  2019-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    CENTRE FOR PROCESS INNOVATION LIMITED LBG UK (REDCAR CLEVELAND) coordinator 2˙148˙875.00
2    TEKNOLOGISK INSTITUT DK (TAASTRUP) participant 753˙375.00
3    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 648˙777.00
4    PRAGMATIC PRINTING LIMITED UK (SEDGEFIELD) participant 558˙687.00
5    THOMAS SWAN & CO LIMITED UK (CONSETT) participant 518˙000.00
6    CONTITECH ELASTOMER-BESCHICHTUNGEN GMBH DE (HANNOVER) participant 437˙500.00
7    NXP SEMICONDUCTORS BELGIUM NV BE (LEUVEN) participant 351˙750.00
8    HENKEL ELECTRONIC MATERIALS BELGIUMNV BE (WESTERLO) participant 341˙687.00
9    HENKEL KGaA DE (DUSSELDORF) participant 308˙000.00
10    TYOTERVEYSLAITOS FI (HELSINKI) participant 280˙051.00
11    NANOGAP SUB-NM-POWDER SA ES (AMES A CORUNA) participant 224˙700.00
12    CROWN PACKAGING MANUFACTURING UK LIMITED UK (CARLISLE) participant 171˙937.00
13    BSH ELECTRODOMESTICOS ESPANA SA ES (ZARAGOZA) participant 76˙947.00

Map

 Project objective

The project targets the incorporation of advanced functional materials to deliver customised conductive inks and flexible adhesives compatible with high volume manufacturing platforms. Specifically the development of these enabling materials will support high speed roll to roll integration of hybrid and large area electronics to address internet of things opportunities The consortium will integrate materials development with end application requirements in terms of technical performance (thermal/electrical conductivity, processing conditions, materials integrity and adhesion) and unit cost of production to facilitate market adoption. The project will utilise and build on existing CPI pilot facilities (R2R print line) to demonstrate technology integration, manufacturability and produce components for end user evaluation to enable the direct comparison of production techniques. The project delivers a supply chain to support future commercialisation: incorporating materials suppliers of inks and adhesives, supporting RTO in Formulation and nano-particle production, established high fidelity print equipment manufacturers, electronic device manufacturers, established pilot line facilities and potential end users from the apparel, packaging and healthcare sector – relating to the internet of things.

 Deliverables

List of deliverables.
NECOMADA project website launched Websites, patent fillings, videos etc. 2020-04-14 23:43:00
Project dissemination, communication strategy & project branding Documents, reports 2020-04-14 23:43:00

Take a look to the deliverables list in detail:  detailed list of NECOMADA deliverables.

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The information about "NECOMADA" are provided by the European Opendata Portal: CORDIS opendata.

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