#	Pagina
attuale pagina	/open-h2020/projects/213188/index.html

Opendata, web and dolomites

PICTURE SIGNED

High Performance and High Yield Heterogeneous III-V/Si Photonic Integrated Circuits using a Thin and Uniform Bonding Layer

Total Cost €

EC-Contrib. €

Partnership

Views

Outcomes and
results

PICTURE project word cloud

Explore the words cloud of the PICTURE project. It provides you a very rough idea of what is the project "PICTURE" about.

wavelength nokia density direct validated thinner southampton total communication optimized lab labs moscap cmos coordinated tyndall supply feedback dielectric 400gb quantum lasers silicon imec layer generation back templates made capacity packaged distributed house picture soi pics dies bit either london stacks photonic integration argotech performance record collectively suitable 200mm characterization bonding bell detectors parallel modulators setting platform selective apart line configuration area uniform lower si digital university skills types complementary footprint chain cea photo dot smaller adequacy epitaxial yield rate prototyping tunable college bonded semiconductor full wafers heterogeneous materials

Project "PICTURE" data sheet

The following table provides information about the project.

Coordinator	III-V LAB Organization address address: 1 AVENUE AUGUSTIN FRESNEL CAMPUS POLYTECHNIQUE city: PALAISEAU CEDEX postcode: 91767 website: www.3-5lab.fr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	France [FR]
Project website	http://www.picture-h2020.eu/
Total cost	4˙050˙477 €
EC max contribution	3˙924˙532 € (97%)
Programme	1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
Code Call	H2020-ICT-2017-1
Funding Scheme	RIA
Starting year	2018
Duration (year-month-day)	from 2018-01-01 to 2020-12-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	III-V LAB III-V LAB Organization address address: 1 AVENUE AUGUSTIN FRESNEL CAMPUS POLYTECHNIQUE city: PALAISEAU CEDEX postcode: 91767 website: www.3-5lab.fr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (PALAISEAU CEDEX)	coordinator	793˙617.00
2	COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES Organization address address: RUE LEBLANC 25 city: PARIS 15 postcode: 75015 website: www.cea.fr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (PARIS 15)	participant	880˙093.00
3	UNIVERSITY OF SOUTHAMPTON UNIVERSITY OF SOUTHAMPTON Organization address address: Highfield city: SOUTHAMPTON postcode: SO17 1BJ website: http://www.southampton.ac.uk contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (SOUTHAMPTON)	participant	586˙666.00
4	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	379˙687.00
5	UNIVERSITY COLLEGE LONDON UNIVERSITY COLLEGE LONDON Organization address address: GOWER STREET city: LONDON postcode: WC1E 6BT website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (LONDON)	participant	369˙287.00
6	UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK Organization address address: WESTERN ROAD city: Cork postcode: T12 YN60 website: www.ucc.ie contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (Cork)	participant	325˙145.00
7	ARGOTECH AS ARGOTECH AS Organization address address: HOLUBOVA 978 city: NACHOD postcode: 547 01 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	CZ (NACHOD)	participant	297˙255.00
8	NOKIA BELL LABS FRANCE NOKIA BELL LABS FRANCE Organization address address: SITE NOKIA PARIS SACLAY, ROUTE DE VILLEJUST city: NOZAY postcode: 91620 website: http://www.ict-etics.eu/ contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (NOZAY)	participant	292˙780.00

Map

Project objective

The objective of PICTURE project is to develop a photonic integration technology by bonding multi-III-V-dies of different epitaxial stacks to SOI wafers with a thinner and uniform dielectric bonding layer. This heterogeneous integration platform will enable higher performance lasers and photo-detectors using the optimized III-V dies. In addition, the thinner bonding layer will lead to record performance MOSCAP III-V/Si modulators, and to a new generation of wavelength tunable distributed feedback lasers. Moreover the full process including SOI process, bonding, III-V and back-end process will be made on a 200mm R&D CMOS line, leading to higher yield, smaller footprint and lower cost PICs. Two types of PICs with a total capacity of 400Gb/s will be developed, packaged and validated in system configuration. In parallel, PICTURE project will develop direct growth of high performance quantum-dot lasers and selective area growth on bonded templates for high density future generation of PICs. The project is coordinated by III-V Lab, and includes University of Southampton, CEA, University College London, Imec, Tyndall, Argotech and Nokia Bell Labs. The consortium is highly complementary, covering all skills required to achieve the project objectives: growth of semiconductor materials, silicon process and III-V process, design and characterization of PICs, prototyping and assessment of PICs in high bit rate digital communication systems: Apart from the adequacy of the consortium to achieve collectively the project objectives, the consortium partners have the potential to set up a comprehensive supply chain for the future exploitation of the project results, either by exploiting the results “in house” or by setting up suitable partnerships.

Deliverables

List of deliverables.
First press release on PICTURE project	Documents, reports	2019-10-29 14:24:53

Take a look to the deliverables list in detail: detailed list of PICTURE deliverables.

Publications

List of publications.
year	authors and title	journal	last update
2019	Claire Besancon, Jean Decobert, Jean-Pierre Le Goec, Nicolas Vaissiere, CÃ©cilia DuprÃ©, Viviane Muffato, Frank Fournel, Christophe Jany, Franck Bassani, Sylvain David and Thierry Baron High-quality Epitaxial Growth of AlGaInAs-based Active Structure on a Directly-Bonded InPoSi Substrate published pages: , ISSN: , DOI:	Proceedings of Compound Semiconductor Week 2019 Yearly	2019-09-05

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "PICTURE" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "PICTURE" are provided by the European Opendata Portal: CORDIS opendata.