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PICTURE SIGNED

High Performance and High Yield Heterogeneous III-V/Si Photonic Integrated Circuits using a Thin and Uniform Bonding Layer

Total Cost €

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EC-Contrib. €

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Partnership

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Project "PICTURE" data sheet

The following table provides information about the project.

Coordinator
III-V LAB 

Organization address
address: 1 AVENUE AUGUSTIN FRESNEL CAMPUS POLYTECHNIQUE
city: PALAISEAU CEDEX
postcode: 91767
website: www.3-5lab.fr

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country France [FR]
 Project website http://www.picture-h2020.eu/
 Total cost 4˙050˙477 €
 EC max contribution 3˙924˙532 € (97%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2017-1
 Funding Scheme RIA
 Starting year 2018
 Duration (year-month-day) from 2018-01-01   to  2020-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    III-V LAB FR (PALAISEAU CEDEX) coordinator 793˙617.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 880˙093.00
3    UNIVERSITY OF SOUTHAMPTON UK (SOUTHAMPTON) participant 586˙666.00
4    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 379˙687.00
5    UNIVERSITY COLLEGE LONDON UK (LONDON) participant 369˙287.00
6    UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK IE (Cork) participant 325˙145.00
7    ARGOTECH AS CZ (NACHOD) participant 297˙255.00
8    NOKIA BELL LABS FRANCE FR (NOZAY) participant 292˙780.00

Map

 Project objective

The objective of PICTURE project is to develop a photonic integration technology by bonding multi-III-V-dies of different epitaxial stacks to SOI wafers with a thinner and uniform dielectric bonding layer. This heterogeneous integration platform will enable higher performance lasers and photo-detectors using the optimized III-V dies. In addition, the thinner bonding layer will lead to record performance MOSCAP III-V/Si modulators, and to a new generation of wavelength tunable distributed feedback lasers. Moreover the full process including SOI process, bonding, III-V and back-end process will be made on a 200mm R&D CMOS line, leading to higher yield, smaller footprint and lower cost PICs. Two types of PICs with a total capacity of 400Gb/s will be developed, packaged and validated in system configuration. In parallel, PICTURE project will develop direct growth of high performance quantum-dot lasers and selective area growth on bonded templates for high density future generation of PICs. The project is coordinated by III-V Lab, and includes University of Southampton, CEA, University College London, Imec, Tyndall, Argotech and Nokia Bell Labs. The consortium is highly complementary, covering all skills required to achieve the project objectives: growth of semiconductor materials, silicon process and III-V process, design and characterization of PICs, prototyping and assessment of PICs in high bit rate digital communication systems: Apart from the adequacy of the consortium to achieve collectively the project objectives, the consortium partners have the potential to set up a comprehensive supply chain for the future exploitation of the project results, either by exploiting the results “in house” or by setting up suitable partnerships.

 Deliverables

List of deliverables.
First press release on PICTURE project Documents, reports 2019-10-29 14:24:53

Take a look to the deliverables list in detail:  detailed list of PICTURE deliverables.

 Publications

year authors and title journal last update
List of publications.
2019 Claire Besancon, Jean Decobert, Jean-Pierre Le Goec, Nicolas Vaissiere, Cécilia Dupré, Viviane Muffato, Frank Fournel, Christophe Jany, Franck Bassani, Sylvain David and Thierry Baron
High-quality Epitaxial Growth of AlGaInAs-based Active Structure on a Directly-Bonded InPoSi Substrate
published pages: , ISSN: , DOI:
Proceedings of Compound Semiconductor Week 2019 Yearly 2019-09-05

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The information about "PICTURE" are provided by the European Opendata Portal: CORDIS opendata.

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