3DTransducers SIGNED

Project "3DTransducers" data sheet

The following table provides information about the project.

 Partnership

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Map

 Project objective

Sensors are ubiquitous in the modern technological world. From the numerous sensors everyone carries within their smartphone, through the pervasive nature of sensors within human machines, to the oncoming explosion of the “Internet of Things” promising immense interconnected networks of sensor enabled systems in virtually every aspect of human life. Micro-electro-mechanical systems (MEMS) as silicon integrated circuits (ICs) are the base technology for nearly all such sensors. In 2017 the worldwide market for MEMS sensors was valued at 10.3€ Billion up from 8.5€ Billion in 2016. It is forecast to grow to 48.4€ Billion in 2024. The use of MEMS ICs provides large-scale manufacture of very cheap sensors. However, there are also many disadvantages. They do not easily provide for rapid and localised/distributed manufacture and implementation. Prototyping requires multi-user foundry platforms or the availability of local facilities, both of which can be relatively expensive, and time consuming, for short runs of prototypes. There are also limitations to what can be achieved. For example, it is very difficult and expensive to make 3D MEMS silicon structures, and there are many issues with liquid interfacing of such systems.

3D printing to make relatively small structures is not new, and various groups have recently reported functionalized polymers. This project will produce 3D printed transducers using 3D printing techniques from the SASATIN ERC project. The 3D printing arrangement does not rely on specific materials purchased from the printer manufacturer.

 Publications