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UFPC Technology

Hybrid Ultra Flexible Printed Circuits combining flexible and low-cost printed electronics with high performance traditional silicon components.

Total Cost €

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EC-Contrib. €

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Partnership

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Project "UFPC Technology" data sheet

The following table provides information about the project.

Coordinator
VIVA DEVELOPMENTS SL 

Organization address
address: CL ALAMEDA CERVANTES 42 3 D
city: LORCA
postcode: 30800
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Spain [ES]
 Project website http://www.vivainnova.es
 Total cost 71˙429 €
 EC max contribution 50˙000 € (70%)
 Programme 1. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
2. H2020-EU.2.1.2. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies)
 Code Call H2020-SMEINST-1-2015
 Funding Scheme SME-1
 Starting year 2015
 Duration (year-month-day) from 2015-07-01   to  2015-10-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    VIVA DEVELOPMENTS SL ES (LORCA) coordinator 50˙000.00

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 Project objective

Printed electronics is a revolutionary, new way of manufacturing electronic components by using standard printing processes coming from the graphic arts, such as screen printing or inkjet, the difference being that it uses conducting inks. This new technique allows to print electronic components and circuits (e.g. connectors, resistors, sensors, transistors), on widely differing flexible substrates, like plastic, textiles or paper. The printed circuits and components are thin, lightweight, flexible, enabling single use/disposable devices, ubiquitous electronics and new applications, with high volume production at an economical price, compared to traditional silicon electronics.

VIVAINNOVA, a company specialised in the field of printed electronics, has developed an innovative hybrid technology, the Ultra Flexible Printed Circuit (UFPC) that combines printed electronics with traditional silicon components in an ultra low cost, ultra thin and ultra flexible electronic circuit solution. Through the new UFPC technology we will transform the electronics industry by exploiting the competitive advantages of both technologies, combining the ‘high-performance and intelligent silicon-electronics’ with the ‘cost-effective and flexible printed electronics’ and to fill the technological gap between fully-printed electronics and the expansive market of the intelligent objects. The UFPC technology will develop a new generation of electronic circuits giving to the products many properties previously unthinkable like ‘smart capabilities’ combined with ‘flexibility, thinness, light-weight and robustness’, at an ‘economical price’. It will allow to reduce the manufacturing cost of smart flexible electronic circuits by up to 50% compared with the current hybrid solutions.

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The information about "UFPC TECHNOLOGY" are provided by the European Opendata Portal: CORDIS opendata.

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