Explore the words cloud of the WIPE project. It provides you a very rough idea of what is the project "WIPE" about.
The following table provides information about the project.
TECHNISCHE UNIVERSITEIT EINDHOVEN
|Coordinator Country||Netherlands [NL]|
|Total cost||3˙766˙097 €|
|EC max contribution||3˙062˙997 € (81%)|
1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
|Duration (year-month-day)||from 2016-01-01 to 2019-06-30|
Take a look of project's partnership.
|1||TECHNISCHE UNIVERSITEIT EINDHOVEN||NL (EINDHOVEN)||coordinator||1˙030˙188.00|
|2||FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.||DE (MUNCHEN)||participant||601˙147.00|
|3||EFFECT PHOTONICS BV||NL (EINDHOVEN)||participant||537˙656.00|
|4||INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM||BE (LEUVEN)||participant||410˙437.00|
|5||SMART PHOTONICS BV||NL (EINDHOVEN)||participant||216˙505.00|
|6||EFFECT PHOTONICS LTD||UK (ALTRINCHAM)||participant||193˙562.00|
|7||BERENSCHOT GROEP BV||NL (Utrecht)||participant||73˙500.00|
|8||IBM RESEARCH GMBH||CH (RUESCHLIKON)||participant||0.00|
The WIPE project aims at developing hybrid electronic-photonic chips as a key enabling technology for data transmission purposes. It aims at bringing photonics to a new level by developing a concept that can be well industrialised. This sustains EU leadership in photonics, as is the ambition of the work program.
A new wafer-scale technology will thus be developed for direct and intimate attachment of III-V Indium-Phosphide (InP) photonic integrated circuits (PICs) and BiCMOS electronic chips (ICs). The ICs contain the driver, receiver andcontrol electronics for the PIC and enable direct connection to polymer optical waveguides. This technology of ‘wafer scale heterogeneous integration’ enables high-performance and high-density photonic-electronic (photronic) modules are created having a lower energy consumption, lower packaging complexity and lower cost compared to modules using more traditional interconnection techniques like wire bonding and laser welding of fibre connections.
Next to the new bonding technology, an integrated module design technology is developed for efficient co-design of hybrid photonic and electronic modules. A library consisting of photonic/electronic standard modules, is created leveraging the process design kits (PDKs) of the most important European foundries of photonic chips in combination with a powerful BiCMOS. These tools are of significantimportance to industry, since they offer photronic module designers a standardised approach that highly facilitates the module design for SMEs and affordable manufacturing by photonic and electronic foundries. The WIPE approach will be proven by showing the feasibility of a 400Gb/s transceiver for data centre application.
|Photonic chip performance||Documents, reports||2020-03-13 10:23:05|
|Exploitation plan: Second release||Other||2020-03-13 10:23:07|
|Industrialisation plan||Other||2020-03-13 10:23:04|
|Technology benchmarking||Documents, reports||2020-03-13 10:23:04|
|Roadmap||Documents, reports||2020-03-13 10:23:05|
|Communication kit version 3||Documents, reports||2020-03-13 10:23:06|
|Communication kit version 1||Documents, reports||2019-05-30 17:24:59|
|Exploitation plan: First release||Other||2019-05-30 17:25:00|
|Communication kit version 2||Documents, reports||2019-05-30 17:24:55|
|Public launch and website||Other||2019-05-30 17:24:59|
Take a look to the deliverables list in detail: detailed list of WIPE deliverables.
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The information about "WIPE" are provided by the European Opendata Portal: CORDIS opendata.
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