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WIPE SIGNED

Wafer scale Integration of Photonics and Electronics

Total Cost €

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EC-Contrib. €

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Partnership

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Project "WIPE" data sheet

The following table provides information about the project.

Coordinator
TECHNISCHE UNIVERSITEIT EINDHOVEN 

Organization address
address: GROENE LOPER 3
city: EINDHOVEN
postcode: 5612 AE
website: www.tue.nl/en

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Netherlands [NL]
 Project website http://www.wipe.jeppix.eu
 Total cost 3˙766˙097 €
 EC max contribution 3˙062˙997 € (81%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2015
 Funding Scheme RIA
 Starting year 2016
 Duration (year-month-day) from 2016-01-01   to  2019-06-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    TECHNISCHE UNIVERSITEIT EINDHOVEN NL (EINDHOVEN) coordinator 1˙030˙188.00
2    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 601˙147.00
3    EFFECT PHOTONICS BV NL (EINDHOVEN) participant 537˙656.00
4    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 410˙437.00
5    SMART PHOTONICS BV NL (EINDHOVEN) participant 216˙505.00
6    EFFECT PHOTONICS LTD UK (ALTRINCHAM) participant 193˙562.00
7    BERENSCHOT GROEP BV NL (Utrecht) participant 73˙500.00
8    IBM RESEARCH GMBH CH (RUESCHLIKON) participant 0.00
9    IMINDS BE (GENT) participant 0.00

Map

 Project objective

The WIPE project aims at developing hybrid electronic-photonic chips as a key enabling technology for data transmission purposes. It aims at bringing photonics to a new level by developing a concept that can be well industrialised. This sustains EU leadership in photonics, as is the ambition of the work program.

A new wafer-scale technology will thus be developed for direct and intimate attachment of III-V Indium-Phosphide (InP) photonic integrated circuits (PICs) and BiCMOS electronic chips (ICs). The ICs contain the driver, receiver andcontrol electronics for the PIC and enable direct connection to polymer optical waveguides. This technology of ‘wafer scale heterogeneous integration’ enables high-performance and high-density photonic-electronic (photronic) modules are created having a lower energy consumption, lower packaging complexity and lower cost compared to modules using more traditional interconnection techniques like wire bonding and laser welding of fibre connections.

Next to the new bonding technology, an integrated module design technology is developed for efficient co-design of hybrid photonic and electronic modules. A library consisting of photonic/electronic standard modules, is created leveraging the process design kits (PDKs) of the most important European foundries of photonic chips in combination with a powerful BiCMOS. These tools are of significantimportance to industry, since they offer photronic module designers a standardised approach that highly facilitates the module design for SMEs and affordable manufacturing by photonic and electronic foundries. The WIPE approach will be proven by showing the feasibility of a 400Gb/s transceiver for data centre application.

 Deliverables

List of deliverables.
Photonic chip performance Documents, reports 2020-03-13 10:23:05
Exploitation plan: Second release Other 2020-03-13 10:23:07
Industrialisation plan Other 2020-03-13 10:23:04
Technology benchmarking Documents, reports 2020-03-13 10:23:04
Roadmap Documents, reports 2020-03-13 10:23:05
Communication kit version 3 Documents, reports 2020-03-13 10:23:06
Communication kit version 1 Documents, reports 2019-05-30 17:24:59
Exploitation plan: First release Other 2019-05-30 17:25:00
Communication kit version 2 Documents, reports 2019-05-30 17:24:55
Public launch and website Other 2019-05-30 17:24:59

Take a look to the deliverables list in detail:  detailed list of WIPE deliverables.

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The information about "WIPE" are provided by the European Opendata Portal: CORDIS opendata.

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